The 74ALVC162334 is a 16-bit universal bus driver that has series resistors in the device output structure which will significantly reduce line noise when used with light loads. This driver has been designed to drive ±12mA at the designated threshold levels. The 74ALVC162334 operates at -40C to +85C

特性

  • Typical tSK(o) (Output Skew) < 250ps
  • ESD > 2000V per MIL-STD-883, Method 3015
  • > 200V using
  • machine model (C = 200pF, R = 0)
  • VCC = 3.3V ± 0.3V, Normal Range
  • VCC = 2.7V to 3.6V, Extended Range
  • VCC = 2.5V ± 0.2V
  • CMOS power levels (0.4 uW typ. static)
  • Rail-to-Rail output swing for increased noise margin
  • Balanced Output Drivers: ±12mA
  • Available in 48 pin TSSOP package

tune产品选择

器件号 Part Status Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
Active TSSOP 48 C 是的 Tube
Availability
Active TSSOP 48 C 是的 Reel
Availability

description文档

文档标题 language 类型 文档格式 文件大小 日期
数据手册与勘误表
star 74ALVC162334 Datasheet 数据手册 PDF 141 KB
应用指南 & 白皮书
AN-224: ALVC/LVC Logic Characteristics and Apps. 应用文档 PDF 238 KB
PCN / PDN
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly 产品变更通告 PDF 611 KB
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly 产品变更通告 PDF 611 KB
PCN# : A1511-01(R1) Add SPEL India as Alternate Assembly Location 产品变更通告 PDF 596 KB
PCN# : A1511-01 Add SPEL India as Alternate Assembly Location 产品变更通告 PDF 544 KB
PCN# : TB1503-01R1 Carrier Tape Standardization for Selective Packages 产品变更通告 PDF 333 KB
PCN# : TB1503-01 Carrier Tape Standardization for Selective Packages 产品变更通告 PDF 291 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w 产品变更通告 PDF 24 KB
PCN# : A0803-02 Add ATP as alternate assembly for TSSOP-48 and TSSOP-56 产品变更通告 PDF 129 KB
PCN# : A0807-02 Copper Bond Wire for SSOP, SOIC and TSSOP 产品变更通告 PDF 147 KB
PCN#: TB-0510-05 New Shipping Tube for TSSOP/TVSOP/TSSOP Exposed 产品变更通告 PDF 201 KB
PCN# A-0508-02: OSET Alternate Assembly Location for Green 产品变更通告 PDF 18 KB
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph 产品变更通告 PDF 38 KB
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph 产品变更通告 PDF 16 KB
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph 产品变更通告 PDF 47 KB
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT 产品变更通告 PDF 35 KB
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products 产品变更通告 PDF 80 KB
PCN#: A-0405-06, To qualify alternate facility ATP for PV (SSOP) 产品变更通告 PDF 22 KB
PCN#:A-0312-01, new mold compound material - G600 产品变更通告 PDF 109 KB
PCN#:A-0312-02, new die attach material - 8290 产品变更通告 PDF 116 KB
PCN#: A-0310-01, Green Products 产品变更通告 PDF 26 KB
PDN# L-03-04: Product Discontinuance 产品停产通告 PDF 105 KB
PCN#: G-0303-04, new m/c G700 & 8290 d/a material 产品变更通告 PDF 130 KB
PCN Addendum # L0203-10R1 Fab 2 to Fab 4 Transfer 产品变更通告 PDF 110 KB
PCN# G-0110-06 REV.1 Mold Compound 产品变更通告 PDF 48 KB
PCN# G-0203-05 Mold Compound 产品变更通告 PDF 40 KB
PCN# L0203-10 Fab Transfer from Fab 2 to Fab 4 产品变更通告 PDF 27 KB
PCN# G-0110-06 Mold Compound 产品变更通告 PDF 47 KB
PCN# L0110-04 Moisture Level Change From 1 to 3 产品变更通告 PDF 32 KB
PCN# G0106-01, Moisture Sensitive Label Change 产品变更通告 PDF 274 KB
PCN# G9911-05, To qualify low alpha mold compound. 产品变更通告 PDF 44 KB

file_download下载

文档标题 language 类型 文档格式 文件大小 日期
模型
74ALVC162334 Hspice Model Model - SPICE ZIP 47 KB
74ALVC162334 IBIS Model 模型 - IBIS ZIP 10 KB