文档标题 信息
Package Name W4X4.16E
Package Previous Code WEV
Package Description 16 BALL WLCSP, 4x4 ARRAY, (BACK SIDE COATING) 0.40 PITCH- ASEKH
Package Status Active
Package Type WLCSP-TKCURDLBC
类别 PLASTIC
Package Code WEV
分类 PLASTIC
Lead Count 16
Pb (Lead) Free Yes
长度 1.78mm
宽度 1.78mm
Thickness 0.54mm
Pitch 0.4mm
Pkg. Dimensions (mm) 1.78 x 1.78 x 0.54

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4x4 Array 16 Balls With 0.40 Pitch Wafer Level Chip Scale Package Package Outline Drawing PDF 108 KB