SiP, System In Package is a product in which two or more chips conform a system utilizing the package's interconnect structure. It saves lead time, space, and BOM cost in the application.
SiP has various structures and those characteristics are shown below.
Structures and Characteristics of SiP
|Structure||Advantage||Flexibility of Memory vender||High Density||Heat Dissipation||Cost|
|Small and High-density Circuits||☆||☆☆☆||☆☆||☆☆|
|Side by Side
|Good heat dissipation||☆||☆||☆☆☆||☆|
|PoP (Package on Package)
|High Flexibility of Memory vender||☆☆☆||☆☆||☆☆||☆|
SiP Packages and Applications
SiP's usage has expanded from the characteristic low level noise and high speed operations to more highly-functional products.
Key Technology Supporting SiP
The advanced package technologies are employed by SiP to connect multiple chips in a package.
PoP, Package on Package is the realization of a large scale system by separating SoC such as logic functions from the memory functions, constructing them as a separate package and attaching the selected parts last. It is possible to change the TOP Packages so there are advantages such as amount of memory used and a wider choice for vendors. Making use of high density packaging and liberalized systems, the demand is increasing with the focus on mobile products.