Overview

Description

The R-Car E3e is an upscale to the R-Car D3e SoC for 3D graphics clusters, that brings enhanced 3D graphics rendering performance. As part of the Renesas R-Car family, this SoC also offers the functional safety and security functions that are essential for connected cars as the role of the human-machine interface (HMI) becomes more important. With these features, the R-Car E3e simplifies the task of developing robust systems capable of dealing safely with both malfunctions and cyberattacks
The single-chip design enables the integration of a variety of systems, significantly reducing overall system development costs and achieving substantial space savings. The R-Car E3e shares the scalability of the R-Car H3e and R-Car M3e for integrated cockpits as well as the R-Car D3e for instrument clusters, establishing the highest level of software reuse. Renesas partner companies with extensive experience in the instrument cluster field are ready to provide operating systems (OS) and HMI tools in addition to system integration support. This greatly reduces the development burden, extending software support to a wide range of vehicles.

Features

  • Suitable solution for large panel full graphics cluster system
  • Performance and functions optimized for entry-level integrated cockpit systems
  • Compatibility with previous products enables use of existing ecosystem and access to over 250* R-Car Consortium partners (*as of Oct, 2018)

Comparison

Applications

Applications

  • Digital instrument cluster 
  • Display audio system
  • Driver Monitoring System 
  • LED matrix light

Documentation

Design & Development

Software & Tools

Software Downloads

Type Title Date
Software & Tools - Software Log in to Download ZIP 185.75 MB
Software & Tools - Software Log in to Download ZIP 133.56 MB
Software & Tools - Other Log in to Download ZIP 428.12 MB
Software & Tools - Evaluation Software Log in to Download ZIP 199.46 MB
Software & Tools - Evaluation Software Log in to Download ZIP 2.35 MB
Software & Tools - Other Log in to Download ZIP 2.45 MB
Software & Tools - Other Log in to Download ZIP 8.87 MB
Software & Tools - Evaluation Software Log in to Download ZIP 127.91 MB
8 items

Sample Code

Boards & Kits

Boards & Kits

Models

Specification

ItemR-Car E3e Specifications
Product NoR-Car E3e (R8A779M6)
Power supply voltage3.3/1.8 V (IO), 2.5V(Ether), 1.35 V (DDR3L), 1.03 V (core)
CPU coreArm® Cortex®-A53
Dual
Arm® Cortex®-R7
Dual Lock-Step
Cache memoryL1 Instruction cache: 32 KB
L1 Operand cache: 32 KB
L2 cache: 256 KB
L1 Instruction cache: 32 KB
L1 Operand cache: 32 KB
External memoryDDR3L-SDRAM
Approved standards:DDR3L-1866
Data bus width: 32 bits x 1 ch
Graphics3D Graphics Processing Unit
Imagination Technologies' PowerVR® Series 8XE GE8300
2D Graphics Processing Unit
VideoDisplay Out x 2 ch (LVDS x 2 or LVDS + Digital RGB)
Video Input x 2 ch (MIPI CSI2, Digital RGB)
Up and down scaling, 1-D LUT/3D-LUT/1D-Histogram/2D-Histgram, color conversion, I/P conversion, super resolution, rotate, ordered dithering, sharpness, lossless compression/decompression, lossy compression
Distortion compensation module (IMR-LX4)
Video output checkDisplay Output Compare Unit (DISCOM)
Video-Output-Checker (VOC)
AudioAudio DSP
Sampling rate converter × 10 ch
Serial sound interface × 10 ch
Storage interfacesUSB 3.0 host interface (DRD) × 1 port (wPHY)
USB 2.0 host/function interface × 1 port (wPHY)
SD host interface × 3 ch (SDR104)
Multimedia card interface × 1 ch
PCI Express (1 lane) x 1 ch
Raw NAND Flash memory interface x 1 ch
In car network and
automotive peripherals

Media local bus (MLB) interface × 1 ch (3-pin interface)
Controller area network (CAN-FD support) interface × 2ch
Ethernet AVB 1.0-compatible MAC built in
Interface: RGMII
Ethernet AVB (802.1BA)

  • IEEE802.1BA
  • IEEE802.1AS
  • IEEE802.1Qav
  • IEEE1722
SecurityCrypto engine (AES, DES, Hash, RSA)
SystemRAM
Other peripheralsSYS-DMAC x 48 ch, Realtime-DMAC x 16 ch,
Audio-DMAC x 16 ch, Audio(peripheral)-DMAC x 29 ch
32bit timer x 26 ch
PWM timer × 7 ch
I2C bus interface × 9 ch
Serial communication interface (SCIF) × 11 ch
SPI multi I/O bus controller (RPC) × 2 ch (HyperFlashTM/QSPI support)
Clock-synchronized serial interface (MSIOF) × 4 ch (SPI/IIS)
Digital radio interface (DRIF) × 4 ch
Low power modeDynamic Power Shutdown
DFS (Dynamic Frequency Scaling), DDR-SDRAM power supply backup mode
Package552- pin Flip chip BGA (21 mm x 21 mm, 0.8 mm pitch)
Development
environment
ICE for Arm CPU available from tool vendors
Evaluation boardA user system development reference platform with the following features is also available to enable the users to carry out efficient system development.
(1) Incorporates car information system-oriented peripheral circuits, providing users with an actual device verification environment.
(2) Can be used as a software development tool for application software, etc.
(3) Allows easy implementation of custom user functions.
Software PlatformSupport OS: Linux, QNX® Neutrino® RTOS, Integrity® etc.
OpenGL ES3.1 3D graphics library, Wide variety of H.265, H.264, MPEG-4 and VC-1 for video compliant with OpenMAX IL I/F in addition to BSPs compliant with OSs standard API are available to realize complete system concept.

(Remarks)
Arm and Cortex are registered trademarks of Arm Limited.
PowerVR is a trademark of Imagination Technologies Limited.
QNX, neutrino and Blackberry are trademarks from BlackBerry Limited, and are used with permission from QNX Software System Limited.
Green Hills Software and INTEGRITY are trademarks or registered trademarks of Green Hills Software, Inc. in the U.S. and/or internationally.
HyperFlash is a trademark of Spansion LLC in the United States and other countries.
All names of other products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.