The ISL6614 integrates two ISL6613 MOSFET drivers and is specifically designed to drive two independent power channels in a Multiphase interleaved buck converter topology. These drivers combined with HIP63xx or ISL65xx Multiphase Buck PWM controllers and N-Channel MOSFETs form complete core-voltage regulator solutions for advanced microprocessors. The ISL6614 drives both the upper and lower gates simultaneously over a range from 5V to 12V. This drivevoltage provides the flexibility necessary to optimize applications involving trade-offs between gate charge and conduction losses. An advanced adaptive zero shoot-through protection is integrated to prevent both the upper and lower MOSFETs from conducting simultaneously and to minimize the dead time. These products add an overvoltage protection feature operational before VCC exceeds its turn-on threshold, at which the PHASE node is connected to the gate of the low side MOSFET (LGATE). The output voltage of the converter is then limited by the threshold of the low side MOSFET, which provides some protection to the microprocessor if the upper MOSFET(s) is shorted during startup. The overtemperature protection feature prevents failures resulting from excessive power dissipation by shutting off the outputs when its junction temperature exceeds 150°C (typically). The driver resets once its junction temperature returns to 108°C (typically). The ISL6614 also features a three-state PWM input which, working together with Intersil's Multiphase PWM controllers, prevents a negative transient on the output voltage when the output is shut down. This feature eliminates the Schottky diode that is used in some systems for protecting the load from reversed output voltage events.

Features

  • Pin-to-pin Compatible with HIP6602 SOIC Family for Better Performance and Extra Protection Features
  • Quad N-Channel MOSFET Drives for Two Synchronous Rectified Bridges
  • Advanced Adaptive Zero Shoot-Through Protection
  • Body Diode Detection
  • Auto-zero of rDS(ON) Conduction Offset Effect
  • Adjustable Gate Voltage (5V to 12V) for Optimal Efficiency
  • Internal Bootstrap Schottky Diode
  • Bootstrap Capacitor Overcharging Prevention
  • Supports High Switching Frequency (up to 1MHz)
  • 3A Sinking Current Capability
  • Fast Rise/Fall Times and Low Propagation Delays
  • Three-State PWM Input for Output Stage Shutdown
  • Three-State PWM Input Hysteresis for Applications With Power Sequencing Requirement
  • Pre-POR Overvoltage +Protection
  • VCC Undervoltage Protection
  • Over-Temperature Protection (OTP) with +42°C Hysteresis
  • Expandable Bottom Copper Pad for Enhanced Heat Sinking
  • QFN Package:
  • Compliant to JEDEC PUB95 MO-220 QFN
  • Quad Flat No Leads
  • Package Outline
  • Near Chip Scale Package Footprint, which Improves PCB Efficiency and has a Thinner Profile
  • Pb-free Available (RoHS compliant)

Applications

  • Core Regulators for Intel® and AMD® Microprocessors
  • High Current DC-DC Converters
  • High Frequency and High Efficiency VRM and VRD Related Literature
  • Technical Brief TB363 "Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs)"
  • Technical Brief 400 and 417 for Power Train Design,Layout Guidelines, and Feedback Compensation Design

Product Options

Part Number Part Status Pkg. Type Carrier Type MOQ Buy Sample
Obsolete QFN Tube 75
Availability
Obsolete QFN Reel 6000
Availability
Obsolete QFN Tube 75
Availability

Documentation

Title language Type Format File Size Date
Datasheets & Errata
ISL6614 Datasheet Datasheet PDF 664 KB
Application Notes & White Papers
AN1681: Grounding Techniques Application Note PDF 509 KB
AN1684: Nonideality of Ground Application Note PDF 397 KB
AN1116: CMOS Applications Information Application Note PDF 576 KB
Five Easy Steps to Create a Multi-Load Power Solution White Paper PDF 846 KB
PCNs & PDNs
PCN13024 - Alternate Manufacturing Site for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering - Chung-Li, Taiwan (ASECL Product Change Notice PDF 183 KB
PCN13009 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li (ASECL), Taiwan and STATS ChipPAC (SCM) - Kuala Lump Product Change Notice PDF 173 KB
PCN10083 - Alternate Bond Wire Material for Assembly of the Listed Intersil DFN/QFN Packaged Products - STATS ChipPAC Malaysia Product Change Notice PDF 79 KB
PCN10055 - Alternate Bond Wire Material for Assembly of the Listed Intersil DFN/QFN Packaged Products - STATS ChipPAC Malaysia Product Change Notice PDF 248 KB
Other
TB458: Converting a Fixed PWM to an Adjustable PWM Other PDF 315 KB
PLC20016 - End of Life Notice Product Life Cycle Notice PDF 220 KB