Photocouplers / Optocouplers Insulation Distances

Insulation Distances

Our photocoupler use a double structure consisting of an inner resin with high optical transmittance between the light-emitting diode (LED) and the photo-diode, and an outer resin with high light shading effect on the outside.

As a result, both stable operation not influenced by external light and high sensitivity (small minimum operating input current) are achieved.

Further, with this double structure, particularly for the high-insulation type, not only is a long inner creepage distance (boundary between inner resin and outer resin) achieved, but strong adhesion is also obtained due to the use of epoxy resin for both inner and outer.

As a result, an extremely high insulation voltage is achieved, since destruction by inner creeping discharge practically does not occur.

Insulation Distances

No. / Name Description
1. Outer Creepage Distance Shortest distance between the light emitting side pin and the light receiving side pin, along the package surface (green line in the figure above).
2. Inner Creepage Distance Shortest distance between the light emitting side pin and the light receiving side pin, along the boundary between the inner resin and the outer resin (blue line in the figure above).
3. Insulator Thickness Shortest distance between the light emitting side and the light receiving side insulated with resin.
4. Clearance (Air distance) Space outside the resin that is the shortest distance between the light emitting side pin and the light receiving side pin. Depending on the pin shape, this distance may be the same as the outer creepage distance.
Package name Width of molded body between pin lines (mm) Length (mm) Height (mm) Mass (g) Packages Marking Packing
16-pin DIP Insulation Distances 6.5 19.8 3.6 1.02

Standard (88KB)

Lead Bending Type for Long Creepage (67KB)

Marking (51KB)

Magazine case (32KB)

Taping (162KB)

8-pin DIP Insulation Distances 6.5 9.25 3.6 0.55
4-pin DIP Insulation Distances 6.5 4.6 3.6 0.26
6-pin SDIP Insulation Distances 6.8 4.58 3.7 0.35
8-pin SDIP Insulation Distances 6.8 5.85 3.7 0.35
16-pin SSOP Insulation Distances 4.4 10.3 2 0.2
12-pin SSOP Insulation Distances 4.4 5.6 2.5 0.14
8-pin SSOP Insulation Distances 3.95 5.21 3.27 0.14
5-pin SOP Insulation Distances 4.4 4 2.1 0.08
4-pin SOP Insulation Distances 4.4 4 2.1 0.08
4-pin SSOP Insulation Distances 4.4 2.7 2 0.05
4-pin mini flat-lead Insulation Distances 4.6 2.5 2.1 0.05

*Caution: The values below differ slightly depending on the lead forming type.