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RA2L1 产品组基于 Arm® Cortex®-M23 核心(现今 Arm® Cortex-M 系列中功耗最低的 CPU)。 这款产品采用优化的制程和瑞萨电子的低功耗工艺技术,是业界一流水平的超低功耗微控制器。 RA2L1 产品组能够支持 1.6V 至 5.5V 宽电压工作,CPU 时钟频率最高 48MHz,且运行模式电流和待机模式电流更低。 RA2L1 产品群配备了增强型电容式触摸感应单元 (CTSU2)、串行通信接口、高精度模拟电路和定时器。 产品封装从 48 引脚到 100 引脚。

特性

  • 48MHz Arm® Cortex®-M23
  • 128KB/ 256KB 代码闪存和 32KB SRAM(支持 ECC)
  • 8KB 数据闪存,提供与 EEPROM 类似的数据存储功能
  • 从 48 引脚到到 100 引脚的封装选择
  • 内部电压调节电路
  • 增强型电容式触摸感应单元 (CTSU2)
  • 12 位 ADC,12 位 DAC,低功耗比较器
  • 32 位通用 PWM 定时器,16 位通用 PWM 定时器,低功耗异步通用定时器
  • 实时时钟
  • 串行通信接口(UART、简单 SPI、简单 I2C)
  • 独立的SPI接口 / I2C 多主接口
  • CAN
  • 安全功能
  • 加密功能

应用

  • 消费者应用
  • 家用电器
  • 工业自动化
  • 楼宇自动化
  • 医疗与保健
  • 一般用途

 

star特色文件

description文档

文档标题 language 类型 文档格式 文件大小 日期
数据手册与勘误表
star RA2L1 Group Datasheet 日本語 数据手册 PDF 1.49 MB
使用指南与说明
star RA2L1 Group User's Manual: Hardware 日本語 手册 - 硬件 PDF 10.78 MB
E2 Emulator, E2 Emulator Lite Additional Document for User's Manual (Notes on Connection of RA Devices) Rev.3.00 日本語 手册 - 开发工具 PDF 641 KB
EK-RA2L1 Errata 日本語 手册 - 开发工具 PDF 458 KB
Technical Updates
RA2L1 Group, RA2E1 Group, Disclosure of CTSU2 test registers for IEC 60730 Class-B functional safety diagnosis 日本語 Technical Update PDF 373 KB
RA2A1 Group, RA2L1 Group, RA2E1 Group, RA4M1 Group, RA4W1 Group, addition of SPI Data Control Register (SPDCR) bit 日本語 Technical Update PDF 460 KB
RA2A1 Group, RA2L1 Group, RA2E1 Group, RA4M1 Group, RA4W1 Group, RA6M1 Group, RA6M2 Group, RA6M3 Group, RA6T1 Group, Note on ALeRASE command 日本語 Technical Update PDF 152 KB
RA family, Addition of register definition for Flash 日本語 Technical Update PDF 139 KB
Errata for User's Manual: Hardware regarding the overview Technical Update PDF 86 KB
应用指南 & 白皮书
Injection current to prevent damage to MCU 应用文档 PDF 83 KB
Renesas RA Family System Specifications for Standard Boot Firmware 应用文档 PDF 747 KB
EK-RA2L1 Example Project Bundle
相关文件: 样例程序
应用文档 PDF 79 KB
FS2012 Sample application
相关文件: 样例程序
日本語 应用文档 PDF 2.87 MB
HS300x Sample application
相关文件: 样例程序
日本語 应用文档 PDF 3.41 MB
RA2L1 Group Self-capacitance Waterproof Touch Button Demo Sample Software
相关文件: 样例程序
日本語 应用文档 PDF 1.22 MB
ZMOD4xxx Sample application
相关文件: 样例程序
日本語 应用文档 PDF 4.09 MB
Getting Started with Low Power Applications Package Application Project 应用文档 PDF 138 KB
- LPM Application 样例程序 ZIP 9.12 MB
Getting Started with Low Power Applications for RA2L1/RA2E1 Group Application Project 应用文档 PDF 1.15 MB
- LPM Application 样例程序 ZIP 9.12 MB
RA2 Quick Design Guide 应用文档 PDF 1.19 MB
Secure Bootloader for RA2 MCU Series – Application Project
相关文件: 样例程序
应用文档 PDF 1.08 MB
RA2L1 Group Touchless Button Demo Solution (Hardware) 日本語 应用文档 PDF 280 KB
Arm TrustZone 的安全设计 - IP 保护 English 应用文档 PDF 3.27 MB
- Renesas RA Security Design with Arm® TrustZone® - IP Protection Rev.1.10 - Sample Code 样例程序 ZIP 2.61 MB
RA2L1 Group Touchless Button Demo Solution Sample Software
相关文件: 样例程序
日本語 应用文档 PDF 341 KB
CTSU 电容式触摸电极设计指南 English, 日本語 应用文档 PDF 2.38 MB
Renesas RA Family QE for Capacitive Touch usage for IAR EWARM 应用文档 PDF 2.18 MB
Renesas RA Family QE for Capacitive Touch usage for Keil® MDK 应用文档 PDF 1.70 MB
RA2L1/RA2E1 Group Example of Low Power Application (Data Logger)
相关文件: 样例程序
应用文档 PDF 2.45 MB
RA Family IEC 60730/60335 Self Test Library for RA MCU (CM4_CM23)
相关文件: 样例程序
日本語 应用文档 PDF 1.73 MB
为设计提供快速精确的多点触控用户界面 English, 日本語 白皮书 PDF 677 KB
RA Azure IoT Cloud Connectivity Solution
相关文件: 样例程序
应用文档 PDF 1.78 MB
Renesas RA Securing Data at Rest Using the Arm® TrustZone®
相关文件: 样例程序
应用文档 PDF 870 KB
Migrating Projects to New FSP Version 应用文档 PDF 645 KB
RA Family Using QE and FSP to Develop Capacitive Touch Application 日本語 应用文档 PDF 963 KB
Renesas RA Family Flash Memory Programming 应用文档 PDF 1.85 MB
其他
RA Family Brochure 日本語 手册 PDF 4.69 MB
An Introduction to Renesas Advanced (RA) MCU Kits Presentation PPSX 35.87 MB
Renesas RA2L1 Group of 32-bit MCUs with Arm® Cortex®-M Core 传单 PDF 371 KB
EK-RA2L1 v1 - Design Package 原理图 ZIP 19.09 MB
[Flyer] E2仿真器[RTE0T00020KCE00000R] English, 日本語 传单 PDF 254 KB
[Flyer] 闪存编程器 PG-FP6 English, 日本語 传单 PDF 345 KB
Renesas RA Family of 32-bit MCUs with Arm® Cortex®-M Core Flyer 日本語 传单 PDF 391 KB
Building Automation Brochure 日本語 手册 PDF 6.65 MB
半导体封装安装手册 English, 日本語 其他 PDF 15.77 MB
Semiconductor Reliability Handbook 日本語 General Reliability Literature PDF 14.70 MB

file_download下载

文档标题 language 类型 文档格式 文件大小 日期
软件
Segger emWin v614d - Documentation, Tools and Samples ZIP 82.99 MB
Segger emWin v614a - Documentation, Tools and Samples ZIP 79.34 MB
样例程序
EK-RA2L1 Example Project Bundle - Sample Code
相关文件: 应用文档
样例程序 ZIP 4.57 MB
LPM Application 样例程序 ZIP 9.12 MB
- Getting Started with Low Power Applications for RA2L1/RA2E1 Group Application Project 应用文档 PDF 1.15 MB
- Getting Started with Low Power Applications Package for RA6M3 and RA4 Groups Application Project 应用文档 PDF 1.48 MB
- Getting Started with Low Power Applications Package Application Project 应用文档 PDF 138 KB
FS2012 Sample application - Sample Code
相关文件: 应用文档
日本語 样例程序 ZIP 39.46 MB
HS300x Sample application - Sample Code
相关文件: 应用文档
日本語 样例程序 ZIP 97.25 MB
RA2L1 Group Self-capacitance Waterproof Touch Button Demo Sample Software - Sample Code
相关文件: 应用文档
日本語 样例程序 ZIP 3.16 MB
ZMOD4xxx Sample application - Sample Code
相关文件: 应用文档
日本語 样例程序 ZIP 152.64 MB
Secure Bootloader for RA2 MCU Series – Application Project - Sample Code
相关文件: 应用文档
样例程序 ZIP 1.13 MB
Renesas RA Security Design with Arm® TrustZone® - IP Protection Rev.1.10 - Sample Code 样例程序 ZIP 2.61 MB
- Arm TrustZone 的安全设计 - IP 保护 English 应用文档 PDF 3.27 MB
RA2L1 Group Touchless Button Demo Solution Sample Software Rev.1.01 - Sample Code
相关文件: 应用文档
日本語 样例程序 ZIP 1.59 MB
RA2L1/RA2E1 Group Example of Low Power Application (Data Logger) Rev.1.00 - Sample Code
相关文件: 应用文档
样例程序 ZIP 2.44 MB
RA Family IEC 60730/60335 Self Test Library for RA MCU (CM4_CM23) Rev.1.00 - Sample Code
相关文件: 应用文档
日本語 样例程序 ZIP 8.83 MB
RA2L1 Group Capacitive Touch Evaluation System Example Project Rev.1.00 - Sample Code
相关文件: 应用文档
样例程序 ZIP 2.97 MB

select_all软件和工具页面

文档标题 类型 Description Company
E2 emulator Lite [RTE0T0002LKCE00000R] Emulator On-chip debugging emulator. Also available as a flash memory programmer. [Support MCU/MPU: RA, RE, RL78, RX] Renesas
E2 emulator [RTE0T00020KCE00000R] Emulator On-chip debugging emulator. Also available as a flash memory programmer. [Support MCU/MPU: RA, RE, RH850, R-Car D1, RL78, RX] Renesas
e² studio IDE and Coding Tool Eclipse-based Renesas integrated development environment (IDE).
[Support MCU/MPU: RA, RE, RX, RL78, RH850, Renesas Synergy, RZ]
(Note: You need to install compiler separately as an additional software)
(Note: No separate e² studio installation required for RA FSP, this will be installed as part of the FSP with e² studio installer (Platform Installer) on GitHub.)
Renesas
PG-FP6 Programmer (Unit/SW) Flash memory programmer [Programming software: Dedicated GUI-based software, the "FP6 Terminal"] [Support MCU/MPU and devices: RA, RE, RX, RL78, RH850, Renesas Synergy, Power Management, Renesas USB Power Delivery Family, ICs for Motor Driver/Actuator Driver, SuperH RISC engine, V850, 78K, R8C] Renesas
Renesas Flash Programmer (Programming GUI) Programmer (Unit/SW) Flash memory programming software [Support MCU/MPU and devices: RA, RE, RX, RL78, RH850, Renesas Synergy, Power Management, Renesas USB Power Delivery Family, ICs for Motor Driver/Actuator Driver, V850, 78KR, 78K0] Renesas
Sensor Software Sensor Middleware (FIT module and FSP module) and sample software packages that enable control and data acquisition for Renesas sensor products.
Renesas
灵活配置软件包 (FSP) Software Package FSP 是一款增强型软件包,旨在为使用瑞萨电子 RA 系列 ARM 微控制器的嵌入式系统设计提供简单易用且可扩展的高质量软件。 Renesas
QE for Capacitive Touch: Development Assistance Tool for Capacitive Touch Sensors Solution Toolkit In developing embedded system using the capacitive touch sensor of RA family and RX family MCUs, you can easily setup initial configurations of the touch interface as well as process the tuning of sensors, and reduce development time. [Plugin for Renesas IDE "e2 studio"]
Renesas
RA Smart Configurator Solution Toolkit The Renesas RA Smart Configurator (RA SC) is a desktop application that helps you in configuring software systems (including a Board Support Package (BSP), drivers, RTOS, and middleware) for RA-Family MCUs when you are using a third-party IDE and toolchain. Renesas

memory开发板与套件

器件号 文档标题 类型 Company
RTK0EG0022S01001BJ Capacitive Touch Evaluation System for RA2L1 评估 Renesas
EK-RA2L1 RA2L1 MCU 群组评估套件 评估 Renesas

引脚数/内存阵容:

闪存:256kB
RAM:32kB
闪存:128kB
RAM:32kB
引脚数
封装
大小
管脚间距
48 引脚
QFN
7x7mm
0.5mm
48 引脚
LQFP
7x7mm
0.5mm
64 引脚
LQFP
10x10mm
0.5mm
80 引脚
LQFP
12x12mm
0.5mm
100 引脚
LQFP
14x14mm
0.5mm