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Package Description MODULE PACKAGE, MODULE REQUIRES WAFER
Package Status Active
Package Type MODULE
类别 MODULE
Package Code MOD0
分类 NP
Lead Count 108
Pb (Lead) Free Yes, No
长度 21.35mm
Pb Free Category e0,
宽度 16.3mm
Thickness 1.85mm, 0mm
Peak Reflow Temp 250.00°C, 260.00°C, 245.00°C
Pitch 1.2mm, 0mm
Package Carrier Reel, Tray, Box

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