April 12, 2011

TOKYO, Japan, April 12, 2011 — Renesas Electronics Corporation (TSE: 6723) has announced the impact of the earthquake in northern Japan on March 11, on Renesas Electronics Group (“the Group”) manufacturing sites. The Group intends to add details of the impact from the earthquake to its financials when confirmed information is available.

[Status of Renesas Electronics Group's factories (as of April 12, 2011, 12:00 p.m)]

Factory City/ Prefecture Operational Status Status of the investigation
1 Renesas Northern Japan Semiconductor, Inc., Tsugaru Factory (Front-end line) Goshogawara-shi, Aomori Began startup procedures to restart its manufacturing - Temporarily shut production after the earthquake on April 7 (Note 1).
- Began startup procedures of the manufacturing equipment.
- Plan to restart its manufacturing from April 12.
2 Renesas Yamagata Semiconductor Co., Ltd., Tsuruoka Factory (Front-end line) Tsuruoka-shi, Yamagata Began startup procedures to restart its manufacturing - Temporarily shut production after the earthquakes on April 7 and April 11 (Note 1).
- Began startup procedures of the manufacturing equipment.
- Plan to restart its manufacturing from April 12.
3 Renesas Electronics Corporation, Naka Factory (Front-end line) Hitachinaka-shi, Ibaraki Preparing to begin startup procedures to restart its manufacturing - Currently working to restore manufacturing equipment at both 300mm and 200mm wafer fabrication lines.
- Resumed part of its operation of the clean room from April 10.
4 Renesas Electronics Corporation, Takasaki Factory (Front-end line) Takasaki-shi, Gunma Restarted its manufacturing Restarted manufacturing from April 8.
5 Renesas Electronics Corporation, Kofu Factory (Front-end line) Kai-shi, Yamanashi Restarted its manufacturing Restarted its manufacturing from April 9.

(Note 1)
Earthquake on April 7: 7.4-magnitude earthquake centered in Miyagi Prefecture that occurred on April 7, 11:37p.m.
Earthquake on April 11: 7.1-magnitude earthquake centered in Fukushima Prefecture that occurred on April 11, 5:16p.m.

(Note 2) The three back-end manufacturing sites, Renesas High Components, Inc., Renesas Northern Japan Semiconductor, Inc., Yonezawa Factory and Renesas Eastern Japan Semiconductor, Tokyo Device Division, have resumed normal production.


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