IDT Announces Expansion of RF Beamforming Portfolio for Phased Array Applications

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IDT supports commercial satellite communications market with RF solutions based on its industry-leading Beamformer architecture.

30 Apr 2019

SAN JOSE, Calif., April 30, 2019 – Integrated Device Technology, Inc. (IDT), a wholly owned subsidiary of Renesas Electronics Corporation (TSE: 6723), announced today that it is broadly sampling a portfolio of microwave and millimeter-wave (mmWave) beamformer products for satellite communications (Satcom), radar, test and measurement and other applications that utilize phased array antennas. The portfolio consists of three families of transmit and receive silicon ICs that support Ku, Ka and CDL frequency bands.

Joining the 5G beamformer IC family, this new Satcom portfolio continues IDT’s investment and growth in the RF market and consolidates its position as a leading supplier of RF products in both the wireless infrastructure and growing data-on-the-move markets.

“Beamforming is at the heart of phased-array systems, enabling signals to be shaped and pointed at specific objects,” said Duncan Pilgrim, vice president and general manager of IDT’s RF division. “Our latest beamformer ICs have been designed to simplify the implementation of a phased array antenna and ease the thermal challenges associated with such multi array antenna panels by enabling a low power dissipation design. By minimizing RMS gain and phase error and offering exceptional gain and phase orthogonality, our customers will see a significant reduction – or possibly an elimination – of the typical calibration requirements.”

The 8-channel F6101, F6102 and F6103 receivers and F6501, F6502 and F6503 transmitters have 6-bit phase resolution and more than 30dB gain adjustment control with 0.25dB resolution on each channel enabling, precise beam pointing and side-lobe level control, as well as arbitrary pattern shaping including deep nulling for interferer mitigation.

As with all of IDT’s RF devices, the monolithic silicon-based beamformer ICs enable higher levels of integration to achieve lower solution costs without sacrificing RF performance, as well as improving manufacturing robustness. Sample parts and evaluation kits are available now to customers upon request. Visit for more details.


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The content in the press release, including, but not limited to, product prices and specifications, is based on the information as of the date indicated on the document, but may be subject to change without prior notice.