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Overview

Description

The RMHE41A184AGBG is a 67, 108, 864-word by 18-bit and the RMHE41A364AGBG is a 33, 554, 432-word by 36-bit synchronous double data rate Low Latency RAM fabricated with advanced CMOS technology using DRAM memory cell. The Low Latency DRAM-III chip is a 1. 1Gb DRAM capable of a sustained throughput of approximately 57. 6 Gbps for burst length of 4 (approximately 51. 2 Gbps for applications implementing error correction), excluding refresh overhead and data bus turn-around With a bus speed of 800 MHz, a burst length of 4, and a tRC of 13. 75 ns, the Low Latency DRAM-III chip is capable of achieving this rate when accesses to at least 6 banks of memory are overlapped. These products are packaged in 180-pin FCBGA.

Features

  • 2 cycle 800MHz DDR Muxed Address
  • Optional data bus inversion to reduce SSO, SSN, maximum I/O current, and average I/O power
  • Training sequence for per-bit deskew
  • Selectable Refresh Mode: Auto or Overlapped Refresh
  • Programmable PVT-compensated output impedance
  • Programmable PVT-compensated on-die input termination
  • PLL for improved input jitter tolerance and wide output data valid window

Comparison

Applications

Documentation

Design & Development

Models

ECAD Models

Schematic symbols, PCB footprints, and 3D CAD models from SamacSys can be found by clicking on products in the Product Options table. If a symbol or model isn't available, it can be requested directly from the website.

Diagram of ECAD Models