Title Information
Product Number: GX62474-HIU
Pkg. Description: MODULE REQUIRES WAFER
Pkg. Code: MOD0
Lead Count: 0
Length: 0 mm
Width: 0 mm
Thickness: 0 mm
Moisture Sensitivity Bake: 24 hrs
Moisture Exposure Floor Life: 168hrs@<30C/60%RH
Pkg. Category: NP
Pb (Lead) Free: No
Title Information
Carrier Type: Tray
Qty. per Carrier: 50# #
Pkg. Type: MODULE
Qty. per Reel: 0# #
Tape Pin 1 Quad: 0
Moisture Sensitivity Level (MSL): 3
Pkg. Class: MODULE
Re-bake Conditions: 48hrs@125C
Peak Reflow Temp: 260

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