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Glossary

 

[A]

Ashing

[C]

CAD

Contact hole

[D]

Device

Direct current characteristics

Dry etching

[G]

Gate

Gold fine wire

[I]

Ingot

Interlayer insulation film

[L]

Lead

Lithography

[N]

Nitride film

N-type diffusion layer

[O]

Oxide film

Gold fine wire

[P]

Package

Polysilicon

Positive method

Probe

P-type diffusion layer

[R]

Resist pattern

[S]

Silver paste resin

Source, drain

Sputtering method

Stepper

[T]

Tester

Transistor

[U]

UV tape

[W]

Wafer

Wet etching

 
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