Evaluation Kit for ZSSC3015
The ZSSC3015KIT Evaluation Kit, also known as the ZACwireTM SSC Modular Evaluation Kit, provides the hardware needed for configuration, calibration and evaluation of...
Resistive Sensor Signal Conditioner with Diagnostics- AEC Q 100 qualified
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概览
简介
The ZSSC3015 RBicdLite-Auto™ sensor signal conditioner IC is adjustable to nearly all piezoresistive bridge sensors. Measured and corrected bridge values are provided at the Sig™ pin, which can be configured as an analog voltage output or as a one-wire serial digital output. The ZACwire™ digital one-wire interface (OWI) can be used for a simple PC-controlled calibration procedure to program a set of calibration coefficients into an on-chip EEPROM. The calibrated ZSSC3015 and a specific sensor are mated digitally: fast, precise, and without the cost overhead associated with trimming by external devices or laser. Integrated diagnostics functions make the ZSSC3015 particularly well-suited for automotive applications.
特性
- Digital compensation of sensor offset, sensitivity, temperature drift, and nonlinearity
- Programmable analog gain and digital gain; accommodates bridges with spans <1mV/V and high offset
- Many diagnostic features on-chip (e.g., EEPROM signature, bridge connection checks, bridge short detection, power loss detection)
- Independently programmable high and low clipping levels
- 24-bit customer ID field for module traceability
- Internal temperature compensation reference (no external components)
- Option for external temperature compensation with the addition of a single diode
- Output options: rail-to-rail ratiometric analog voltage (12-bit resolution), absolute analog voltage, ZACwire™ digital one-wire interface
- Fast power-up to data out response, output available 5ms after power-up
- Current consumption depends on programmed sample rate and mode: 1mA down to 300μA (typ.)
- Fast response time: 1.4ms typical
- High voltage protection: ≤30V with external JFET
- AEC-Q100 qualified
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| 类型 | 文档标题 | 日期 |
| 数据手册 | PDF 562 KB | |
| 指南 | 7Z 1.21 MB | |
| 手册 - 开发工具 | PDF 1.09 MB | |
| 应用文档 | PDF 667 KB | |
| 数据手册 - 简易格式 | PDF 202 KB | |
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设计和开发
软件与工具
开发板与套件
开发板与套件
模型
ECAD 模块
Schematic symbols, PCB footprints, and 3D CAD models from SamacSys can be found by clicking on products in the Product Options table. If a symbol or model isn't available, it can be requested directly from the website.
Processing table
| WAFER | 0 | -40 to 125°C | Wafer | ||
| WAFER | 0 | -40 to 125°C | Wafer | ||
| SOIC | 8 | -40 to 125°C | Reel | ||
| SOIC | 8 | -40 to 125°C | Tube | ||
| WAFER | 0 | -50 to 150°C | Wafer | ||
| WAFER | 0 | -50 to 150°C | Wafer | ||
| SOIC | 8 | -50 to 150°C | Reel | ||
| SOIC | 8 | -50 to 150°C | Tube |
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视频和培训
IDT Sensor Signal Conditioner (SSC) Evaluation Kit Overview
A brief introduction and overview of IDT's sensor signal conditioner evaluation kits. Evaluation kits generally consist of three parts: a communication interface board, a device board, and a sensor simulator board - all connected together. A sophisticated software GUI accompanies the kit, enabling an engineer to learn how to use the part rapidly, do quick prototyping, and practice calibrations.
Presented by David Grice, applications engineer at IDT. For more information about IDT's sensor signal conditioner products, visit https://www.idt.com/ssc
Video List