概览

JEDEC compliant Advanced Memory Buffer for Fully buffered DIMMs. 3.2, and 4.0 Gb/s serial speeds (DDR2-533, and 667 DRAM). Support for up to eight DIMMs per channel.

  • Leverages high-speed serial technology for DRAM interface
  • Supports 3.2, 4.0 and 4.8 Gbits serial speeds (DDR2-533/667)
  • Support for 14 northbound lanes (read) and 10 southbound lanes (write)
  • Support for up to 8 DIMMs per channel

文档
类型 文档标题 日期
End Of Life Notice
PDN# CQ-16-03 Manufacturing Discontinuance Notice
PDF 15 KB
产品变更通告
PCN# : A1108-04 CHANGED SUBSTRATE CORE MATERIAL & PLUG IN MATERIAL
PDF 1.19 MB
传单
Advance Memory Buffer (AMB) Flyer
PDF 728 KB
产品变更通告
PCN# : TB0801-01 Add SPIL Taiwan as Alternate Test and Backend for IDT AMB Products
PDF 87 KB
产品变更通告
PCN# A0702-01 Changed of Underfill Material for FCBGA-655
PDF 115 KB
5 items

设计和开发

ECAD 模块

Schematic symbols, PCB footprints, and 3D CAD models from SamacSys can be found by clicking on products in the Product Options table. If a symbol or model isn't available, it can be requested directly from the website.

扩展 ECAD 模块
Diagram of ECAD Models

产品选择

    Processing table
    Pkg. Type
    Lead Count (#)
    Temp. Grade
    Pb (Lead) Free
    Carrier Type
    购买 / 样片
    器件号
    AMB0482C1RJ
    circle过时
    memory
    view_in_ar
    		FCBGA 655 C No Tray
    AMB0482C1RJ8
    circle过时
    memory
    view_in_ar
    		FCBGA 655 C No Reel
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