The QS3VH2245 is a high bandwidth 8-bit bus switch. The QS3VH2245, with 25 ohm ON resistance and 1.35ns propagation delay, is ideal for line matching and low noise environments. The combination of small propagation delay, high OFF impedance, and over-voltage tolerance makes the QS3VH2245 ideal for high performance communication applications. The QS3VH2245 operates from -40C to +85C.

Features

  • N channel FET switches with no parasitic diode to VCC
  • Isolation under power-off conditions
  • No DC path to VCC or GND
  • 5V tolerant in OFF and ON state
  • 5V tolerant I/Os
  • Flat RON characteristics over operating range
  • Rail-to-rail switching 0 - 5V
  • Bidirectional dataflow with near-zero delay: no added ground bounce
  • Excellent RON matching between channels
  • VCC operation: 2.3V to 3.6V
  • High bandwidth
  • LVTTL-compatible control Inputs
  • Undershoot Clamp Diodes on all switch and control Inputs
  • Low I/O capacitance, 4pF typical
  • 25 ohm resistors for low noise and line matching
  • Available in 20 pin QSOP and TSSOP packages

descriptionDocumentation

Title language Type Format File Size Date
star QS3VH2245 Datasheet
Datasheet
PDF 330 KB
AN-20: Board Assembly for 0.4mm Pin Surface Mounts
Application Note
PDF 62 KB
Errata LEN-08-01
Device Errata
PDF 64 KB
PCN# : A1808-01 Transfer Assembly Location from Amkor Philippines for select pacakges
Product Change Notice
PDF 39 KB
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly
Product Change Notice
PDF 611 KB
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly
Product Change Notice
PDF 611 KB
PCN# : A1511-01(R1) Add SPEL India as Alternate Assembly Location
Product Change Notice
PDF 596 KB
PCN# : A1511-01 Add SPEL India as Alternate Assembly Location
Product Change Notice
PDF 544 KB
PCN# : TB1503-01R1 Carrier Tape Standardization for Selective Packages
Product Change Notice
PDF 333 KB
PCN# : TB1503-01 Carrier Tape Standardization for Selective Packages
Product Change Notice
PDF 291 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w
Product Change Notice
PDF 24 KB
PCN# A-0508-02: OSET Alternate Assembly Location for Green
Product Change Notice
PDF 18 KB
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph
Product Change Notice
PDF 38 KB
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph
Product Change Notice
PDF 16 KB
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph
Product Change Notice
PDF 47 KB
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT
Product Change Notice
PDF 35 KB
PCN#:A-0312-01, new mold compound material - G600
Product Change Notice
PDF 109 KB
PCN#:A-0312-02, new die attach material - 8290
Product Change Notice
PDF 116 KB
PCN Addendum # L0203-10R1 Fab 2 to Fab 4 Transfer
Product Change Notice
PDF 110 KB
PCN# L0206-11 ICCQ Max Limit Change
Product Change Notice
PDF 9 KB
PCN# G-0203-05 Mold Compound
Product Change Notice
PDF 40 KB
PCN# L0203-10 Fab Transfer from Fab 2 to Fab 4
Product Change Notice
PDF 27 KB
PCN# G0202-01, Alternate assembly facility
Product Change Notice
PDF 16 KB
PCN# L0108-01R1, Die Revision from YQ, ZQ, QC to Z
Product Change Notice
PDF 12 KB
PCN# G0106-01, Moisture Sensitive Label Change
Product Change Notice
PDF 274 KB
PCN# G0005-01, Laser Top Mark
Product Change Notice
PDF 24 KB

file_downloadDownloads

Title language Type Format File Size Date
QS3VH2245 Hspice Model
Model - SPICE
ZIP 18 KB