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Beate Ostermann
Senior Staff Engineer
Published: March 24, 2021

Renesas participated in this year's digital Embedded World, which took place from 1-5 March and had demonstrations in ADAS, EV, Vehicle Computer, SoC, MCU, Analog and Power, covering the full range of the latest in Renesas Automotive solutions. Several demonstrations brought together the capabilities of Renesas and IDT and Intersil - two companies acquired by Renesas to help complete our solution offerings in Automotive.

Here are a few highlights:

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R-CAR V3U - A BRAND NEW PROCESSOR FOR AUTONOMOUS DRIVING 

Renesas introduced its next generation ASIL D SoC that combines high computing power (60 TOPS) and low power consumption. R-Car V3U delivers highly flexible DNN (Deep Neural Processing) and AI machine learning functions. Its flexible architecture can handle any state-of-the-art neural network and provides up to 60 TOPS with low power consumption. The SoC integrates multiple sophisticated safety mechanisms that provide high coverage, achieving ASIL D metrics.

The R-Car V3U comes with an open and integrated development environment (e2studio) that enables fast time-to-market for computer vision and deep learning-based solutions. 

More information on R-Car V3U & e2studio can be found here.

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IPS2550 – INDUCTIVE POSITION SENSOR FOR HIGH-SPEED MOTOR COMMUTATION

Renesas introduced its new automotive-qualified position sensor IPS2550. Featuring improved performance and easy customization, the new IPS2550 is ideal for use as an absolute position sensor for high-speed motor commutation in passenger cars, heavy-duty commercial and off-road vehicles as well as motorbikes. With its optimized bill-of-materials, the new sensor allows cost-effective sensor designs to maximize the sensor’s accuracy. Being totally stray field immune, this new-born sensor allows to reduce weight and form factor supporting a much better motor integration than resolvers. 

Based on Renesas’ inductive position sensing technology, the magnet-free IPS2550 delivers speeds up to 600krpm (electrical) and is designed around the motor, accommodating both off-axis (through shaft and side shaft) and on-axis positioning. The number of sectors to pole pairs of the motor can be matched and cost-effectively boost accuracy compared with alternative sensing technologies. The IPS2550 is developed according to ISO 26262 to support, as a single IC, the most challenging functional safety-critical applications, capable of supporting up to ASIL C/D system-level requirements. More information on IPS2550 and the associated evaluation kit can be found here.

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SEMICONDUCTOR SOLUTIONS FOR xEV APPLICATIONS

Renesas' commitment to the growing call for environmentally friendly e-mobility goes back a long way to the beginning of this development. Accordingly, a product portfolio has been and is still being developed that takes these requirements into account. The essentially required semiconductor components are comprised of MCUs (ASIL C) which are conceptually focusing on a traction inverter, incl. a dedicated Motor-control IP with integrated position sensor interface, PMICs to supply the MCU, gate drivers to bridge the interface between the digital and analog side, the IGBT & FRD which provide the power to drive the e-Motor and recently also the inductive position sensors. All together for a high-performance and safe traction drive. Renesas also dedicates itself to the battery management system and develops outstanding semiconductor components for this. For further information please click here.

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AUTOMOTIVE VEHICLE COMPUTER VC3

Renesas is the first chip maker to provide a comprehensive reference design for the Connected Gateway/Car Server application. The third generation of the evaluation platform Vehicle Computer (VC3.0) is based on a complete Renesas chipset, covering the Connected Gateway/Car Server application up to a performance level of 40k DMIPS. The box can be used for evaluation, rapid prototyping, or data logging, and offers specific support for automotive requirements and communication standards such as CAN FD, LIN, MOST, FlexRay, PCIe, and Ethernet. Various Ethernet Time-Sensitive Networking (TSN) protocols are supported to realize high-bandwidth, real-time communication. The new VC3.0 is now released to the market. It offers key improvements such as Gigabit Ethernet and support for all TSN features, while increasing the number of available classical automotive network interfaces. It is the ideal candidate for pre-silicon evaluation of next-generation R-Car devices for future Communication Gateway ECUs. More details on the box and its features can be found here.

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RENESAS ANALOG & POWER PORTFOLIO

Renesas’ complementary portfolio of Analog + Power products

Renesas highlighted how it expands its analog and power portfolio and gave insights on existing and future solutions. For further information please click here.

Optimal Power Management for Renesas Controller

Renesas emphasized its power management and timing products tailored to simplify the successful integration of Renesas R-Car devices into modern automotive applications. More details can be obtained here.

Speeding Time to Market with Proven Compatibility

Renesas presented a set of “Winning Combinations” for Automotive - reference designs comprising a broad range of Renesas MCUs, SoCs, analog and power products to streamline controller development, reduce cost, and improve time to market. More information for each of these solutions can be found on our website.

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