August 22, 2005

INTEL DEVELOPER FORUM, san francisco, August 22, 2005 — IDT™ (Integrated Device lTechnology, Inc.; Nasdaq:  IDTI), a leading communications IC company, today announced that interoperability has been achieved between Fully Buffered Dual Inline Memory Modules (FB-DIMMs) that use both IDT and Intel Corporation’s Advanced Memory Buffer (AMB) devices.  This milestone will enable designers of memory modules, servers and workstations to choose FB-DIMM platforms with confidence, knowing that the system will remain flexible and can be upgraded as bandwidth requirements grow. 


IDT will showcase the interoperability as part of a demonstration, taking place at the forthcoming Intel Developer Forum (IDT Booth #936), August 23-25at the Moscone Center West in San Francisco.


“We are pleased to have achieved this significant technology milestone, which will help our customers develop next-generation, high-bandwidth server and workstation systems,” said Tom Kao, director of marketing for the IDT DIMM support products group.  “Through world-class technology delivery, IDT has consistently demonstrated leadership and commitment to the DIMM market.  Early to market with our AMB devices, we are committed to building the AMB ecosystem and will continue to establish strategic partnerships to enable customers to take advantage of advanced technologies.”


“Interoperability among AMBs is the essential next step in making the benefits of FB-DIMM a reality,” said Jim Pappas, director of initiative marketing for Intel's Digital Enterprise Group.  “This milestone demonstrates that interoperability is now possible and also provides designers a look at the design tools necessary to meet next-generation server requirements.”


AMB devices are an essential building block for next-generation, high-bandwidth applications, such as servers and workstations, which require increased performance and large memory capacities.  A key attribute of the FB-DIMM channel architecture is the high-speed, serial, point-to-point connection between the memory controller and modules on the channel.  The AMB chip located on each FB-DIMM collects and distributes the data from or to a DIMM, buffers the data internally on the chip and receives or forwards it to the next DIMM or memory controller.  This unique channel structure alleviates buffer latency issues common in registered DIMM technology, enabling designers to use a large number of DIMMs within a single system.



The IDT AMB product is sampling now, with production-level quantities available in September 2005.  More information about other IDT DIMM support products can be found on the IDT Web site at 


About IDT

IDT is a global leader in semiconductor solutions for advanced network services. IDT serves communications equipment vendors by applying its advanced hardware, software and memory technologies to create flexible, highly integrated products that enhance the functionality and processing of network equipment. IDT accelerates innovation with products such as network search engines (NSEs), flow-control management (FCM) ICs and its commitment to and products for standards-based serial switching. The portfolio also comprises products optimized for communications applications, including telecom products, FIFOs, multi-ports, and timing solutions. In addition, the product mix includes high-performance digital logic and high-speed SRAMs to meet the requirements of leading communications companies.


Headquartered in San Jose, Calif., the company employs approximately 2,500 people worldwide and has a wafer manufacturing facility in Oregon, and an assembly and test facility in Malaysia.  IDT stock is traded on the NASDAQ Stock Market® under the symbol “IDTI.”  The company is included in the S&P 1000, which is a combination of the S&P MidCap 400 and S&P SmallCap 600 Indices, and is also partof the S&P SuperComposite 1500, which combines the S&P 500, MidCap 400, and SmallCap 600.



IDT, Interprise and the IDT logo are trademarks of Integrated Device Technology, Inc. Intel is a registered trademark of Intel Corporation or its subsidiaries in the United States and other countries.  Other brands, product names and marks are trademarks, registered trademarks, or trade names of their respective owners.