Renesas Electronics' package technology makes its semiconductor products more functional, faster, and smaller, which enables multi-functional, high-speed solutions as well as compact, high-density mounting for space limited applications.
Reference for designers and process engineers in electronic equipment:
Package and Packing Outline
Semiconductor Package Mount Manual
This online manual describes mounting and handling methods for semiconductor devices with the aim of enabling you to execute skillful mounting while maintaining the high reliability of the products.