概览

简介

RA2E1 产品群是 RA 系列的入门级单芯片微控制器,基于48 MHz Arm® Cortex®-M23 内核,具有高达 128 kB 的代码闪存以及 16 kB 的 SRAM 。 这款产品采用优化的制程和瑞萨电子的低功耗工艺技术,是业界一流水平的超低功耗微控制器。 RA2E1 产品支持 1.6V 至 5.5V 的宽工作电压范围和多种封装,如 LQFP、QFN、LGA、BGA 和 WLCSP。 RA2E1 可与 RA2L1 产品群引脚和外围设备兼容,特别适用于电池供电应用以及空间受限应用,以及其他需要高性能和低功耗的系统。

特性

  • 48MHz Arm® Cortex®-M23
  • 高达 128kB 的闪存以及 16kB SRAM
  • 4kB 数据闪存,提供与 EEPROM 类似的数据存储功能
  • 从 25 引脚封装扩展至 64 引脚封装
  • 1.6V - 5.5V 的宽工作电压范围
  • 增强型电容式触摸感应单元 (CTSU)
  • 12 位 ADC,LPACMP,温度传感器
  • 32 位通用 PWM 定时器,16 位通用 PWM 定时器,低功耗异步通用定时器
  • 实时时钟
  • SCI(UART、简单 SPI、简单 I2C)
  • 独立的 SPI 接口/I2C 多主接口
  • 安全功能
  • 加密功能
  • 多种封装选择(LQFP、QFN、LGA、BGA 及 WLCSP)

产品对比

应用

应用

  • 一般用途
  • 消费者应用
  • 家用电器
  • 工业自动化
  • 楼宇自动化
  • 医疗与保健

文档

设计和开发

软件与工具

软件与工具

Software title
Software type
公司
灵活配置软件包 (FSP)
FSP 是一款增强型软件包,旨在为使用瑞萨电子 RA 系列 Arm 微控制器的嵌入式系统设计提供简单易用且可扩展的高质量软件。
Software Package 瑞萨电子
QE for Capacitive Touch: Development Assistance Tool for Capacitive Touch Sensors
In developing embedded system using the capacitive touch sensor of MCUs, you can easily setup initial configurations of the touch interface as well as process the tuning of sensors, and reduce development time. [Plugin for Renesas IDE "e2 studio"] [Standalone Version] [Support MCU/MPU:RA, RL78, RX, Renesas Synergy™]
Solution Toolkit 瑞萨电子
E2 emulator [RTE0T00020KCE00000R]
On-chip debugging emulator. Also available as a flash memory programmer. [Support MCU/MPU: RA, RE, RH850, R-Car D1, RL78, RX, RISC-V MCU]
Emulator 瑞萨电子
E2 emulator Lite [RTE0T0002LKCE00000R]
On-chip debugging emulator. Also available as a flash memory programmer. [Support MCU/MPU: RA, RE, RL78, RX, RISC-V MCU]
Emulator 瑞萨电子
PG-FP6
Flash memory programmer [Programming software: Dedicated GUI-based software, the "FP6 Terminal"] [Support MCU/MPU and devices: RA, RE, RX, RL78, RH850, Renesas Synergy, Power Management, Renesas USB Power Delivery Family, ICs for Motor Driver/Actuator Driver, SuperH RISC engine, V850, 78K, R8C]
Programmer (Unit/SW) 瑞萨电子
RA Smart Configurator
The Renesas RA Smart Configurator (RA SC) is a desktop application that helps you in configuring software systems (including a Board Support Package (BSP), drivers, RTOS, and middleware) for RA-Family MCUs when you are using a third-party IDE and toolchain.
Solution Toolkit 瑞萨电子
Renesas Flash Programmer (Programming GUI)
Flash memory programming software [Support MCU/MPU and devices: RA, RE, RX, RL78, RH850, RISC-V MCU Renesas Synergy, Power Management, Renesas USB Power Delivery Family, ICs for Motor Driver/Actuator Driver, V850, 78KR, 78K0]
Programmer (Unit/SW) 瑞萨电子
Sensor Software Modules for Renesas MCU Platforms
Middleware (FIT module and FSP module) and sample software packages that enable control and data acquisition for Renesas sensor products.
Sensor 瑞萨电子
e² studio - information for RA Family
Eclipse-based Renesas integrated development environment (IDE). [Support MCU/MPU: RA, RE, RX, RL78, RH850, Renesas Synergy, RZ]
IDE and Coding Tool 瑞萨电子
EZ-CUBE3
EZ-CUBE3(CYRCNEZCUBE03)是具有Flash存储器编程功能的片上调试仿真器,可以用于调试MCU程序或将程序烧写到MCU的内置Flash中。
Emulator 瑞萨电子
SEGGER emWin GUI Library for Renesas RA Products
SEGGER's emWin graphics library is a ready-to-use solution that provides a versatile and professional GUI platform for creating interactive and high-quality graphical user interfaces on any type of display for the Renesas RA family.
Imaging SEGGER
SEGGER J-Link and J-Trace PRO
The J-Link debug probes offer full support for RA Family MCUs. With their outstanding performance, robustness, and ease of use are widely recognized as the market-leading debug probes today.
Emulator SEGGER
IAR Embedded Workbench for Arm
IAR Embedded Workbench for Arm (EWARM) provides a complete development environment for Arm - including RA Family MCUs - generating fast, compact code and enabling you to take full control of your code.
IDE and Coding Tool IAR Systems
Arm® Keil® MDK
Arm® Keil® MDK is a comprehensive software development solution for Arm-based microcontrollers, including RA Family MCUs, containing all the components that you need to create, build, and debug embedded applications.
IDE and Coding Tool Arm® Keil® MDK Arm®
14 items

样例程序

开发板与套件

开发板与套件

模型

引脚数/内存阵容

闪存:128kB
RAM:16kB
闪存:64kB
RAM:16kB
闪存:32kB
RAM:16kB
     
引脚数
封装
大小
管脚间距
25 引脚
WLBGA
2.14x2.27mm
0.4mm
32 引脚
LQFP
7x7mm
0.8mm
32 引脚
QFN
5x5mm
0.5mm
36 引脚
LGA
4x4mm
0.5mm
48 引脚
QFN
7x7mm
0.5mm
48 引脚
LQFP
7x7mm
0.5mm
64 引脚
BGA
4x4mm
0.4mm
64 引脚
LQFP
14x14mm
0.8mm
64 引脚
LQFP
10x10mm
0.5mm