Tsuyoshi introduces the major trend changes in the automotive industry and our in-vehicle software platform to meet them.

By Tsuyoshi Tsumuraya, Director -- 2021-01

Renesas offers R-Car Virtual Platform (VPF), which can realize software development without silicon, for customers of Automotive SoC, R-Car, to enhance Shift-left of Software development and System verification for Next-generation vehicles.

By Seiji Mochizuki, Senior Principal Engineer -- 2021-01

Masashi Ueda explains why the new RA2E1 entry-line RA MCU group is a perfect fit for cost-sensitive, low power and space-constrained applications.

By Masashi Ueda, Staff Product Marketing & Engineer -- 2021-01

We would like to introduce Embedded Target for RH850 Multicore, which facilitate software development for H850 multicore by Model Based Design.

By Mitsugu Inoue, Engineer -- 2021-01

在这一期里,我们介绍了瑞萨电子汽车业务的核心价值,以及我们在新冠肺炎期间及之后为客户提供的价值。

By Zhou Yu, Staff Engineer -- 2021-01

Knut 引导我们逐步了解ASI4U-V5中嵌入的传输机制,这是ASi-5的最简单实现选项,即使在恶劣的工业环境中,也可确保所有数据无误地到达目的地。

By Knut Dettmer, Senior Manager -- 2021-01

William discusses the stringent requirements for next-generation Macro BTS and the value of a complete RF signal chain solution from Renesas.

By William Qi, RF Product Marketing Manager -- 2021-01

Amruta walks us through a medical patch solution based on the Renesas low power 32-bit RX23W microcontroller and a variety of other Renesas products.

By Amruta Patra, System Architect & Technical Marketing Engineer -- 2021-01

Up to now, OEMs are facing the dilemma to choose between high deep learning performance and safety / low power for automated driving ECUs. This blog shows how R-Car V3U is solving this challenge without compromise between deep learning performance versus Low power & Safe operation.

By Eric Pinton, Director -- 2021-01

The R-IN32M3 module starts supporting EtherCAT® on top of the existing EtherNet/IPTM and PROFINET, which are the three major industrial Ethernet protocols. In this blog, I introduce the benefits of developing EtherCAT compatible devices with R-IN32M3 module.

By Kei Hagiwara, Principal Specialist -- 2021-01