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The ISL6260C is a multiple phase PWM buck regulator for miroprocessor core power supply. The multiple phase implementation results in better system performance, superior thermal management, lower component cost, reduced power dissipation, and smaller implementation area. The ISL6260C multiphase controller together with ISL6208 external gate drivers provide a complete solution to power Intel's mobile microprocessors. The PWM modulator of ISL6260C is based on Intersil's Robust Ripple Regulator technology (R3). Compared with the traditional multiphase buck regulator, the R3 modulator commands variable switching frequency during load transients, which achieves faster transient response. With the same modulator, the switching frequency is reduced at light load conditions resulting higher operation efficiency. Intel Mobile Voltage Positioning (IMVP) reduces power dissipation for Intel Pentium processors. The ISL6260C is designed to be completely compliant with IMVP-6+ specifications. ISL6260C responds to PSI# signal by adding or dropping PWM2 and adjusting overcurrent protection accordingly. To reduce audible noise, the DPRSLPVR signal can be used to reduce output voltage slew rates when entering and exiting Deeper Sleep State according to Intel specification. The ISL6260C has several other key features. ISL6260C reports output power through a power monitor pin. Current sense can be achieved by using either inductor DCR or discrete precision resistor. In the case of DCR current sensing, a single NTC thermistor is used to thermally compensate the inductor DCR variation with temperature. A unity gain, differential amplifier is available for remote voltage sensing. This allows the voltage on the CPU die to be accurately regulated to meet Intel IMVP-6+ specifications.

特長

  • Precision Multiphase Core Voltage Regulation
  • 0.5% System Accuracy Over Temperature
  • Enhanced Load Line Accuracy
  • Microprocessor Voltage Identification Input
  • 7-Bit VID Input
  • 0.300V to 1.500V in 12.5mV Steps
  • Supports VID Changes On-The-Fly
  • Multiple Current Sensing Approaches Supported
  • Lossless DCR Current Sensing
  • Precision Resistive Current Sensing
  • Supports PSI# and Narrow VDC for Enhanced Battery Life (EBL) Initiatives
  • Superior Noise Immunity and Transient Response
  • Power Monitor and Thermal Monitor
  • Differential Remote Voltage Sensing
  • High Efficiency Across Entire Load Range
  • Programmable 1, 2 or 3 Power Channels
  • Excellent Dynamic Current Balance between Channels
  • Small Footprint 40 Ld 6x6 QFN Package
  • IMVP-6+ Compliant
  • Pb-Free (RoHS Compliant)

アプリケーション

  • Mobile Laptop Computers

製品選択

製品名 Part Status Pkg. Type Carrier Type MOQ 購入/サンプル
ISL6260CCRZ
Obsolete QFN Tube 50
Availability
ISL6260CCRZ-T
Obsolete QFN Reel 4000
Availability
ISL6260CIRZ
Obsolete QFN Tube 50
Availability
ISL6260CIRZ-T
Obsolete QFN Reel 4000
Availability

ドキュメント&ダウンロード

タイトル 他の言語 分類 形式 サイズ 日付
データシート
ISL6260C Datasheet データシート PDF 1.24 MB
アプリケーションノート、ホワイトペーパー
Five Easy Steps to Create a Multi-Load Power Solution ホワイトペーパー PDF 846 KB
AN1681: Grounding Techniques アプリケーションノート PDF 509 KB
AN1684: Nonideality of Ground アプリケーションノート PDF 397 KB
PCN / PDN
PCN13025 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li , Taiwan and STATS ChipPAC (SCM) - Kuala Lumpur, Mal 製品変更通知 PDF 106 KB
PCN13009 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li (ASECL), Taiwan and STATS ChipPAC (SCM) - Kuala Lump 製品変更通知 PDF 173 KB
PCN10055 - Alternate Bond Wire Material for Assembly of the Listed Intersil DFN/QFN Packaged Products - STATS ChipPAC Malaysia 製品変更通知 PDF 248 KB
その他資料
PLC14051A - Product Discontinuance / Obsolescence Notification Product Life Cycle Notice PDF 124 KB