Recently, as part of voluntary action plans on their part, we have had an increasing number of customers requesting the reduction of halogen materials included in semiconductor parts.
Renesas has developed packaging technology using molding compounds and interposer which meet halogen-free requirements, and is delivering many halogen-free products.
Renesas is increasing halogen-free products according to customers' requests.
Renesas has defined the specifications of halogen-free products as follows, which is the same as IEC 61249-2-21.
- Bromine is less than 900ppm by weight.
- Chlorine is less than 900ppm by weight.
- Bromine + Chlorine is less than 1500ppm by weight.
The management of corrosive substances to products with copper bond wire is different.
If there is a need to understand the management of corrosive substances to products with copper bond wire, please contact your local sales team.