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Releases: renesas/fsp

v5.2.0

28 Feb 20:35
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Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 5.2.0.

Minimum e2 studio version for FSP 5.2.0 is e2 studio 2024-01.1

Download the FSP with e2 studio Windows installer for this release, setup_fsp_v5_2_0_e2s_v2024-01.1.exe, from here.

Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v5_2_0_e2s_v2024-01.1.AppImage, from here. Refer to https://en-support.renesas.com/knowledgeBase/19934358 for information on installing e2 studio and related software components in a Linux PC.

Download the FSP with e2 studio macOS (Apple Silicon) installer for this release, setup_fsp_v5_2_0_e2s_v2024-01.1.pkg, from here.

If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v5_2_0_rasc_v2024-01.1.exe, from here.

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

Arm GNU Toolchain: 13.2

LLVM Embedded Toolchain for Arm: 17.0.1

IAR Compiler: 9.50.1

ARM Compiler: 6.21

QE for Capacitive Touch: 3.3.0 or higher

QE for Display: 3.2.0

QE for BLE: 1.6.0

QE for Motor: 1.3.0

e2 studio: 2024-01.1

RASC: 2024-01.1

Renesas E2 and E2 Lite: 2.1.3

SEGGER J-Link: 7.94g

Important Information for RA0E1 Development

FSP v5.2.0 includes support for the upcoming RA0E1 MCU. For developers using this MCU, please note the following important improvements and known issues:

Improvements

  • The space between the vector table (at 0x0) and option setting memory (at 0x400) is now automatically filled with a preselected set of BSP functions. This functionality can be changed via the new 'Fill flash gap' BSP property.
    • The functions placed in the section have been selected based on -Oz (aggressive size) optimization. When using other optimization levels this function may need to be disabled.
    • When disabled, the space can be filled with user code/data by placing items in the .flash_gap section.
  • The FSP development team is currently analyzing all RA0E1 drivers to identify additional areas where code size savings can be made. Significant optimizations will continue to be made in coming releases

Known Issues

  • RA0E1 e2 studio projects currently automatically reset compiler optimization to -Oz (aggressive size optimization) when generating or compiling. To override this behavior, manually add the desired optimization flag(s) (e.g. -O0) to the 'Other optimization flags' box in the project Properties.
  • The LPM module is not yet supported.
  • The following sensors are currently not supported:
    • HS400x
    • ZMOD4xxx
    • OB1203

Features

  • Support for new devices:
    • RA2A2 MCU
    • RA0E1 MCU
  • Support for new development kits:
    • EK-RA2A2
    • FPB-RA0E1
  • Support updated part numbers for RA2E1
  • USB Host Composite CDC + MSC support
  • Added new 'Using Registers Directly' guide to usage notes
  • RSIP-E51A Protected Mode support

Fixes and Improvements

  • Platform installer updated to include e2 studio 2024-01.1
  • Platform installer for MacOS
  • IAR compiler version updated to 9.50.1
  • Arm compiler version updated to 6.21
  • Segger J-Link version updated to 7.94g
  • Segger emWin version updated to 6.36
  • E2 and E2 Lite version updated to 2.1.3
  • Common FSP API support updated to v1.3.0
  • Resolved issues in SCE5 and SCE5_B cryptographic procedures
  • All peripherals now set to Secure by default in Flat projects
  • Fixed build warning when using FreeRTOS Heap in IAR EW projects
  • Added missing ADC_B Developer Assistance entries
  • Updated to support 0 length data for GCM AAD. Cleaned up documentation and error condition checks. Added more examples for CCM and CMAC.
  • SCE5 & SCE5_B security updates
  • Improved r_ble API usage note about L2CAP CBFC Channel connection parameters
  • USB Changes
    • Fixed DMA src/dest address in configurator generated code
    • Improved an error message when enabling continuous transfer mode on Full-Speed
    • Improved timeout process for USBX PCDC
    • Fixed configuration issue related to interrupt priority and Battery Charging on Hi-Speed
    • Fixed memory corruption when USB related interrupt configuration is set to Not Supported
    • Fixed USB HMSC setup failure on Hi-Speed

Known Issues

  • RA0E1:
    • e2 studio projects automatically reset compiler optimization to a Size setting on every generate or build operation
      • Add optimization flags (e.g. -O0) manually to 'Other optimization flags' to override the -Oz setting
    • The LPM module is not supported
    • HS400x, ZMOD4xxx and OB1203 sensors cannot be used on RA0E1
  • EWARM support for RA2A2, RA0E1
    • EWARM version 9.50.1 does not contain support for RA2A2, RA0E1. To develop for these devices, It will be necessary to Install support patch files (arm_Renesas_RA2A2_patch_20230302_1.zip,arm_Renesas_RA0E1_patch_20240103_1.zip) which can be downloaded by EWARM v9.50.1 users from the IAR MyPages system.
  • AGTW event not being properly output as activation source
  • DTC events are shown for selection that are not configured as interrupts

Visit GitHub Issues for this project.

Third Party Software

These third party software solutions are included alongside FSP.

Amazon coreHTTP: 3.0.0+renesas.0

Amazon coreMQTT: 2.1.1

Amazon corePKCS11: 3.5.0

Amazon coreJSON: 3.2.0

Amazon FreeRTOS+FAT: 08d0cff40d9832f235442ab22e577ddf4204da52

Amazon FreeRTOS Cellular Interface: 1.3.0

Amazon FreeRTOS Kernel: 10.6.1

Amazon FreeRTOS+TCP: 4.0.0

Amazon OTA 3.4.0

Arm CMSIS5: 5.9.0+renesas.1

Arm CMSISNN: 4.1.0

Arm Mbed TLS: 3.4.0+renesas.6

Arm Trusted Firmware-M: 1.8.0+renesas.0

Arm littlefs: 2.2.1+renesas.1

Intel TinyCrypt: 0.2.8+renesas.2

Intel tinyCBOR: 0.6.0

MCUboot: 1.10.0+renesas.1

Microsoft Azure Embedded Wireless Framework: 1.0.0-preview.2+renesas.1

Microsoft Azure RTOS FileX: 6.2.1

Microsoft Azure RTOS GUIX: 6.2.1

Microsoft Azure RTOS LevelX: 6.2.1

Microsoft Azure RTOS NetX Duo: 6.2.1+renesas.1

Microsoft Azure RTOS ThreadX: 6.2.1

Microsoft Azure RTOS USBX: 6.2.1

SEGGER emWin: 6.36

TES D/AVE 2D: 3.8.0

Bug Fixes

See fixed GitHub Issues for this release.

Knowledge Base

Visit our knowledge base for other technical updates.

MD5 Checksums

  • FSP_Packs_v5.2.0.zip fcf...

v5.1.0

08 Dec 17:55
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Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 5.1.0.

Minimum e2 studio version for FSP 5.1.0 is e2 studio 2023-10

Download the FSP with e2 studio Windows installer for this release, setup_fsp_v5_1_0_e2s_v2023-10.exe, from here.

Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v5_1_0_e2s_v2023-10.AppImage, from here. Refer to https://en-support.renesas.com/knowledgeBase/19934358 for information on installing e2 studio and related software components in a Linux PC.

If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v5_1_0_rasc_v2023-10.exe, from here.

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

Arm GNU Toolchain: 13.2

LLVM Embedded Toolchain for Arm: 17.0.1

IAR Compiler: 9.40.1

ARM Compiler: 6.19

QE for Capacitive Touch: 3.3.0 or higher

QE for Display: 3.1.1 or higher

QE for BLE: 1.6.0 or higher

QE for Motor: 1.2.0

e2 studio: 2023-10

RASC: 2023-10

Renesas E2 and E2 Lite: 1.13.3

SEGGER J-Link: 7.92o

Features

  • Support for new devices:
    • RA8D1 MCU
    • RA8T1 MCU
  • Support for new development kits:
    • EK-RA8D1
    • MCK-RA8T1
  • Added SCI_B LIN driver (r_sci_b_lin)
  • Added support for multiple data collector instances.
  • Added ability to control the transmit power on the DA14531 via the existing API’s
  • Support USB PPRN for FreeRTOS
  • Support interrupt mode for USB-PCDC on bare-metal
  • Added new driver to support using the DA16xxx HTTP stack with FSP

Fixes and Improvements

  • Arm GNU Toolchain updated to version 13.2
  • J-Link updated to version 7.92o
  • Improved CTSU measurement accuracy by correcting correction calculation

Known Issues

  • Potential issue with AES CCM support in PSA Crypto (under investigation)
  • Potential issue with ZMOD4xxx RAQ support on CM4 devices (under investigation)
  • EWARM support for RA8M1, RA8D1, RA8T1 and RA2E3
    • EWARM version 9.40.1 do not contain support for RA8M1, RA8D1, RA8T1 and RA2E3. To develop for these devices, It will be necessary to Install support patch files which can be downloaded by EWARM v9.40.1 users from the IAR MyPages system.
  • The following is not yet supported in projects using LLVM Compiler:
    • BLE Mesh modules
    • RYZ Cellular AWS support
  • USB HMSC does not work with secure project on RA4, RA6 and RA8 series devices other than GCC compiler (deploys TrustZone).

Visit GitHub Issues for this project.

Third Party Software

These third party software solutions are included alongside FSP.

Amazon coreHTTP: 3.0.0+renesas.0

Amazon coreMQTT: 2.1.1

Amazon corePKCS11: 3.5.0

Amazon FreeRTOS+FAT: 08d0cff40d9832f235442ab22e577ddf4204da52

Amazon FreeRTOS Cellular Interface: 1.3.0

Amazon FreeRTOS Kernel: 10.6.1

Amazon FreeRTOS+TCP: 4.0.0

Arm CMSIS5: 5.9.0

Arm CMSISNN: 4.1.0

Amazon OTA 3.4.0

Arm Mbed TLS: 3.4.0+renesas.4

Arm Trusted Firmware-M: 1.8.0+renesas.0

Arm littlefs: 2.2.1+renesas.1

Intel TinyCrypt: 0.2.8+renesas.1

MCUboot: 1.10.0+renesas.0

Microsoft Azure Embedded Wireless Framework: 1.0.0-preview.2+renesas.0

Microsoft Azure RTOS FileX: 6.2.1

Microsoft Azure RTOS GUIX: 6.2.1

Microsoft Azure RTOS LevelX: 6.2.1

Microsoft Azure RTOS NetX Duo: 6.2.1+renesas.1

Microsoft Azure RTOS ThreadX: 6.2.1

Microsoft Azure RTOS USBX: 6.2.1

SEGGER emWin: 6.34c

TES D/AVE 2D: 3.8.0

Bug Fixes

See fixed GitHub Issues for this release.

Knowledge Base

Visit our knowledge base for other technical updates.

MD5 Checksums

  • FSP_Packs_v5.1.0.zip 7ca3c7beca916e720a28ac09077374f4
  • FSP_Packs_v5.1.0.exe 115b2763b74d50d5665d795ab4ddaf74
  • fsp_documentation_v5.1.0.zip 57ba796be534148ca860d0ae6a28261a
  • setup_fsp_v5_1_0_e2s_v2023-10.exe 4dd25d3b0c4f3c7fa003484f47c15936
  • setup_fsp_v5_1_0_e2s_v2023-10.AppImage 0e476c797846fc3dec36f75b735651b4
  • setup_fsp_v5_1_0_rasc_v2023-10.exe 16f84eae3b579a7061b40518222de273
  • setup_fsp_v5_1_0_rasc_v2023-10.AppImage ae77dc9143471b37814770b418923100
  • MDK_Device_Packs_v5.1.0.zip 15be2247cd3bd7761048d0cd77e5fc43

v5.0.1

09 Nov 22:48
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Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 5.0.1.

This release includes packs that are installed separately from e2 studio. This means the v5.0.0 platform installer (Windows) or the v5.0.0 AppImage (Linux) should be installed first, then the packs in this release can be installed into the new e2 studio.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Bug Fixes

See fixed GitHub Issues for this release.

Knowledge Base

Visit our knowledge base for other technical updates.

MD5 Checksums

  • FSP_Packs_v5.0.1.zip 5c62b6b347f3baf126cdc55589d7e6c0
  • FSP_Packs_v5.0.1.exe 5912286c922021fc90251f8e621ffddd
  • fsp_documentation_v5.0.1.zip ef80f6e4007e8683b9b934d64c823150
  • MDK_Device_Packs_v5.0.1.zip eae8bf4923923fe1bc8b316e64495d8e

v5.0.0

27 Oct 16:45
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Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 5.0.0.

Minimum e2 studio version for FSP 5.0.0 is e2 studio 2023-10

Download the FSP with e2 studio Windows installer for this release, setup_fsp_v5_0_0_e2s_v2023-10.exe, from here.

Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v5_0_0_e2s_v2023-10.AppImage, from here. Refer to https://en-support.renesas.com/knowledgeBase/19934358 for information on installing e2 studio and related software components in a Linux PC.

If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v5_0_0_rasc_v2023-10.exe, from here.

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

Arm GNU Toolchain: 12.2

LLVM Embedded Toolchain for Arm: 17.0.1

IAR Compiler: 9.40.1

ARM Compiler: 6.19

QE for Capacitive Touch: 3.3.0

QE for Display: 3.1.1

QE for BLE: 1.6.0

QE for Motor: 1.2.0

e2 studio: 2023-10

RASC: 2023-10

Renesas E2 and E2 Lite: 1.13.3

SEGGER J-Link: 7.92j

Features Added

  • Support for new devices:
    • RA8M1 MCU
    • RA2E3 MCU
  • Support for new development kits:
    • EK-RA8M1
    • FPB-RA2E3
    • CK-RA6M5 V2
  • Support for LLVM Embedded Toolchain for Arm (v17.0.1)
  • Support for booting DA14531 from host MCU
  • Support for USB HCDC-ECM
  • RSIP Key Injection API for ECC and RSA
  • I2C slave DTC support

Fixes and Improvements

  • Platform installer updated to include e2 studio 2023-10
  • TF-M version has been updated to v1.8.0
  • E2 and E2 Lite version updated to 1.13.3
  • JLink version updated to 7.92j
  • emWin version updated to 6.34c
  • CMSIS NN version updated to 4.1.0
  • Updated FreeRTOS
  • Updated zmod modules IAQ 2nd Gen, IAQ 2nd Gen ULP, Relative IAQ, Relative IAQ ULP
  • Common FSP API support updated to v1.1.0
  • Improved CTSU CFC measurement feature
  • Updated Sensor GMOD library
  • Added user custom feature for ether phy

Known Issues

  • EWARM support for RA8M1 and RA2E3
    • EWARM version 9.40.1 do not contain support for RA8M1 and RA2E3. To develop for these devices, It will be necessary to Install support patch files which can be downloaded by EWARM v9.40.1 users from the IAR MyPages system.
  • The following is not yet supported in projects using LLVM Compiler:
    • BLE Balance and Compact configurations
    • BLE Mesh modules
    • RYZ Cellular AWS support
    • Virtual EEPROM (VEE) module
  • USB HMSC does not work with secure project on RA4, RA6 and RA8 series devices (deploys TrustZone).

Visit GitHub Issues for this project.

Third Party Software

These third party software solutions are included alongside FSP.

Amazon coreHTTP: 3.0.0+renesas.0

Amazon coreMQTT: 2.1.1

Amazon corePKCS11: 3.5.0

Amazon FreeRTOS+FAT: 08d0cff40d9832f235442ab22e577ddf4204da52

Amazon FreeRTOS Cellular Interface: 1.3.0

Amazon FreeRTOS Kernel: 10.6.1

Amazon FreeRTOS+TCP: 4.0.0

Arm CMSIS5: 5.9.0

Arm CMSISNN: 4.1.0

Amazon OTA 3.4.0

Arm Mbed TLS: 3.4.0+renesas.2

Arm Trusted Firmware-M: 1.8.0+renesas.0

Arm littlefs: 2.2.1+renesas.1

Intel TinyCrypt: 0.2.8+renesas.1

MCUboot: 1.10.0+renesas.0

Microsoft Azure Embedded Wireless Framework: 1.0.0-preview.2+renesas.0

Microsoft Azure RTOS FileX: 6.2.1

Microsoft Azure RTOS GUIX: 6.2.1

Microsoft Azure RTOS LevelX: 6.2.1

Microsoft Azure RTOS NetX Duo: 6.2.1+renesas.1

Microsoft Azure RTOS ThreadX: 6.2.1

Microsoft Azure RTOS USBX: 6.2.1

SEGGER emWin: 6.34c

TES D/AVE 2D: 3.8.0

Bug Fixes

See fixed GitHub Issues for this release.

Knowledge Base

Visit our knowledge base for other technical updates.

MD5 Checksums

  • FSP_Packs_v5.0.0.zip 669b14f09baddf3f124bc22f8cd11a84
  • FSP_Packs_v5.0.0.exe e6c10f42bfa6a2bfaa59a5b4abfc4e12
  • fsp_documentation_v5.0.0.zip cbc95d60af9955fdc161af048a026268
  • setup_fsp_v5_0_0_e2s_v2023-10.exe e287c88e5ac12f7b82996a1a2af9cf6f
  • setup_fsp_v5_0_0_e2s_v2023-10.AppImage 7801a3a269e8639200f9ab66bc3734ab
  • setup_fsp_v5_0_0_rasc_v2023-10.exe 27c30bd4707d97fd7979230c6cbe3b28
  • setup_fsp_v5_0_0_rasc_v2023-10.AppImage 47bc45b2ca8388d9b77d82aa56499f6a
  • MDK_Device_Packs_v5.0.0.zip bac7c614a09d2718becc62b17e760adb

v4.6.0

30 Aug 16:55
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Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 4.6.0.

Minimum e2 studio version for FSP 4.6.0 is e2 studio 2023-07

Download the FSP with e2 studio Windows installer for this release, setup_fsp_v4_6_0_e2s_v2023-07.exe, from here.

Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v4_6_0_e2s_v2023-07.AppImage, from here. Refer to https://en-support.renesas.com/knowledgeBase/19934358 for information on installing e2 studio and related software components in a Linux PC.

If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v4_6_0_rasc_v2023-07.exe, from here.

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

GCC Compiler: 12.2

IAR Compiler: 9.40.1

ARM Compiler: 6.19

QE for Capacitive Touch: 3.3.0

QE for Display: 3.1.1

QE for BLE: 1.6.0

QE for Motor: 1.2.0

e2 studio: 2023-07

RASC: 2023-07

Renesas E2 and E2 Lite: 1.13.2

SEGGER J-Link: 7.88n

Features Added

  • DA16600 WiFi support

Fixes and Improvements

  • Platform installer updated to include e2 studio 2023-07
  • SEGGER emWin version updated to 6.34
  • E2 and E2 Lite version updated to 1.13.2
  • Arm Compiler updated to 6.19
  • GCC compiler updated to 12.2
  • Segger J-Link version updated to 7.88n
  • MCUboot updated to 1.10
  • Memory optimizations for using On-Chip MQTT drivers for DA16XXX modules
  • Fixed invalid default clocks on CK-RA6M5
  • Added TFM Support for RA6M5
  • Added CANFD transmit FIFO support (Common FIFOs)
  • Improved Motor driver support when using two motors
  • Fixed issue with filter function in ADC_B Hybrid mode
  • Fixed issue with configuring QSPI pins on RA4E1 48 pin devices

Third Party Software

These third party software solutions are included alongside FSP.

Amazon coreHTTP: 2.1.0

Amazon coreMQTT: 1.2.0

Amazon corePKCS11: 3.4.0

Amazon FreeRTOS+FAT: d725a4c1

Amazon FreeRTOS Cellular Interface: 1.2.0

Amazon FreeRTOS Kernel: 10.4.6

Amazon FreeRTOS+TCP: 2.4.0

Arm CMSIS5: 5.9.0

Arm CMSISNN: 4.0.0

Amazon OTA 3.3.0

Arm Mbed TLS: 3.4.0+renesas.0

Arm Trusted Firmware-M: 1.7.0+renesas.0

Arm littlefs: 2.2.1+renesas.1

Intel TinyCrypt: 0.2.8+renesas.0

MCUboot: 1.10.0+renesas.0

Microsoft Azure Embedded Wireless Framework: 1.0.0-preview.2+renesas.0

Microsoft Azure RTOS FileX: 6.2.1

Microsoft Azure RTOS GUIX: 6.2.1

Microsoft Azure RTOS LevelX: 6.2.1

Microsoft Azure RTOS NetX Duo: 6.2.1+renesas.1

Microsoft Azure RTOS ThreadX: 6.2.1

Microsoft Azure RTOS USBX: 6.2.1

SEGGER emWin: 6.34

TES D/AVE 2D: 3.8.0

Bug Fixes

See fixed GitHub Issues for this release.

Known Issues

Visit GitHub Issues for this project.

Knowledge Base

Visit our knowledge base for other technical updates.

MD5 Checksums

  • FSP_Packs_v4.6.0.zip 3210d59e6a5590b418365f482271e3e0
  • FSP_Packs_v4.6.0.exe 595c788db86ffcca864c2c37a63dbbb5
  • fsp_documentation_v4.6.0.zip 2da86a6186ddb19a8c762463226b8bb5
  • setup_fsp_v4_6_0_e2s_v2023-07.exe e1407ac041d9f8a63b2474e27e5eb125
  • setup_fsp_v4_6_0_e2s_v2023-07.AppImage 57a97a6691ad20f6c65940752b836bc6
  • setup_fsp_v4_6_0_rasc_v2023-07.exe 616c5b17b7fd721c32fa3eafd74a536b
  • setup_fsp_v4_6_0_rasc_v2023-07.AppImage 0412882ac6e05f342faa21db0d4bb204
  • MDK_Device_Packs_v4.6.0.zip 64e31470e443900e92a54dcae22e49ea

v4.5.0

29 Jun 19:39
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Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 4.5.0.

Minimum e2 studio version for FSP 4.5.0 is e2 studio 2023-04

Download the FSP with e2 studio Windows installer for this release, setup_fsp_v4_5_0_e2s_v2023-04.exe, from here.

Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v4_5_0_e2s_v2023-04.AppImage, from here.

If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v4_5_0_rasc_v2023-04.exe, from here.

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

GCC Compiler: 10.3-2021.10

IAR Compiler: 9.40.1

ARM Compiler: 6.18

QE for Capacitive Touch: 3.2.0

QE for Display: 3.1.1

QE for BLE: 1.6.0

QE for Motor: 1.1.0

e2 studio: 2023-04

RASC: 2023-04

Renesas E2 and E2 Lite: 1.12.2

SEGGER J-Link: 7.88d

Features Added

  • Support CCM hardware acceleration on SCE7 and SCE9 for PSA Crypto
  • Support CCM hardware acceleration on all SCE engines for Netx Crypto
  • Support generating transfer descriptor array for chain transfer in DTC
  • Support Block Media RAM
  • Support Smart Card Interface
  • Added Data Collector module for Reality AI
  • Added Data Shipper module for Reality AI
  • Added new zmod modules IAQ 2nd Gen and IAQ 2nd Gen ULP
  • Added on-chip MQTT support to DA16xxx

Fixes and Improvements

  • Fixed initialization issue in Virtual EEPROM (rm_vee_flash)
  • Fixed missing files in AWS TLS 1.3
  • Segger J-Link version updated to 7.88d
  • SEGGER emWin version updated to 6.32c
  • Arm Mbed TLS version updated to 3.4.0
  • IAR compiler version updated to 9.40.1
  • The rm_wifi_onchip_da16200 module has been renamed to rm_wifi_onchip_da16xxx to make way for future Dialog 16xxx series support in FSP.
    Users calling the following SNTP APIs in projects created before v4.5.0 will need to update to the new API names:
    • RM_WIFI_ONCHIP_DA16200_SntpServerIpAddressSet -> RM_WIFI_ONCHIP_DA16XXX_SntpServerIpAddressSet
    • RM_WIFI_ONCHIP_DA16200_SntpEnableSet -> RM_WIFI_ONCHIP_DA16XXX_SntpEnableSet
    • RM_WIFI_ONCHIP_DA16200_SntpTimeZoneSet -> RM_WIFI_ONCHIP_DA16XXX_SntpTimeZoneSet
    • RM_WIFI_ONCHIP_DA16200_LocalTimeGet -> RM_WIFI_ONCHIP_DA16XXX_LocalTimeGet

Third Party Software

These third party software solutions are included alongside FSP.

Amazon coreHTTP: 2.1.0

Amazon coreMQTT: 1.2.0

Amazon corePKCS11: 3.4.0

Amazon FreeRTOS+FAT: d725a4c1

Amazon FreeRTOS Cellular Interface: 1.2.0

Amazon FreeRTOS Kernel: 10.4.6

Amazon FreeRTOS+TCP: 2.4.0

Arm CMSIS5: 5.9.0

Arm CMSISNN: 4.0.0

Amazon OTA 3.3.0

Arm Mbed TLS: 3.4.0+renesas.0

Arm Trusted Firmware-M: 1.7.0+renesas.0

Arm littlefs: 2.2.1+renesas.1

Intel TinyCrypt: 0.2.8+renesas.0

MCUboot: 1.9.0+renesas.0

Microsoft Azure Embedded Wireless Framework: 1.0.0-preview.2.renesas.rx

Microsoft Azure RTOS FileX: 6.2.1

Microsoft Azure RTOS GUIX: 6.2.1

Microsoft Azure RTOS LevelX: 6.2.1

Microsoft Azure RTOS NetX Duo: 6.2.1

Microsoft Azure RTOS ThreadX: 6.2.1

Microsoft Azure RTOS USBX: 6.2.1

SEGGER emWin: 6.32c

TES D/AVE 2D: 3.8.0

Bug Fixes

See fixed GitHub Issues for this release.

Known Issues

Visit GitHub Issues for this project.

Knowledge Base

Visit our knowledge base for other technical updates.

MD5 Checksums

  • FSP_Packs_v4.5.0.zip 48af462dfcd5e92345f8cd9f76bd83f6
  • FSP_Packs_v4.5.0.exe 19bc88bfb598b0a8c73d42e8adc3a483
  • fsp_documentation_v4.5.0.zip ccca8b498a534543db815fd4b6d4e855
  • setup_fsp_v4_5_0_e2s_v2023-04.exe 6c7039e47811ad0c7ebee5ab8673aa0c
  • setup_fsp_v4_5_0_e2s_v2023-04.AppImage 2114bc0f6eea10257f5ccf96c17a365b
  • setup_fsp_v4_5_0_rasc_v2023-04.exe 9f5a7cfe42f2dc30e0a368031eece13a
  • setup_fsp_v4_5_0_rasc_v2023-04.AppImage 23e0e2c580149523188de6edfe5e7553
  • MDK_Device_Packs_v4.5.0.zip f9adee2ffcf534f49d4c1e4af2c323bd

v4.4.0

25 Apr 16:58
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Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 4.4.0.

Minimum e2 studio version for FSP 4.4.0 is e2 studio 2023-04

Download the FSP with e2 studio Windows installer for this release, setup_fsp_v4_4_0_e2s_v2023-04.exe, from here.

Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v4_4_0_e2s_v2023-04.AppImage, from here.

If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v4_4_0_rasc_v2023-04.exe, from here.

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Refer to e2 studio section in System Requirements for operating environment information of e2 studio

Tools

GCC Compiler: 10.3-2021.10

IAR Compiler: 9.32.2

ARM Compiler: 6.18

QE for Capacitive Touch: 3.2.0

QE for Display: 3.1.1

QE for BLE: 1.6.0

QE for Motor: 1.1.0

e2 studio: 2023-04

RASC: 2023-04

Renesas E2 and E2 Lite: 1.12.2

SEGGER J-Link: 7.86b

Known Issues

  • EWARM support for RA4T1 and RA6T3 MCUs.
    EWARM 9.32.2 does not contain support for the RA4T1 and RA6T3 devices. To develop for RA4T1 / RA6T3, It will be necessary to either:
    • Update to a later version of EWARM than v9.32.2, or
    • Install support patch files which can be downloaded by EWARM 9.32.2 users from the MyPages system on www.iar.com

Features Added

  • Support for new RA4T1 and RA6T3 MCUs
    • Includes support for the following development boards:
      • MCK-RA4T1
      • MCK-RA6T3
  • Support AWS OTA
  • Support for AWS Cellular APN Authentication
  • Support CMAC hardware acceleration on SCE5, SCE5b, SCE7 and SCE9 for PSA Crypto
  • Support NetX RSA acceleration on SCE7
  • SCE7 Key Injection API supports AES-192, Brainpool 256 / 384
  • Support USB composite device (PVND + PCDC)
  • Support motor control on RA6T3 and RA4T1
  • Support for TRNG module on RA4T1, RA6T3, RA6E2 and RA4E2
  • support NetX SHA256 acceleration on SCE7
  • support NetX ECC acceleration on SCE7
  • Support USB Composite PCDC + PVND
  • Support fastboot protected mode

Fixes and Improvements

  • E2 and E2 Lite version updated to 1.12.2
  • Platform installer updated to include e2 studio 2023-04
  • Segger J-Link version updated to 7.86b
  • SEGGER emWin version updated to 6.32b
  • Arm Mbed TLS version updated to 3.3.0
  • Arm Trusted Firmware-M updated to 1.7.0
  • Microsoft Azure components updated to 6.2.1
  • IAR compiler updated to 9.32.2
  • Added Developer Assistance support to BLE Mesh
  • Refactored DA14531 middleware and reduced memory usage

Third Party Software

These third party software solutions are included alongside FSP.

Amazon coreHTTP: 2.1.0

Amazon coreMQTT: 1.2.0

Amazon corePKCS11: 3.4.0

Amazon FreeRTOS+FAT: d725a4c1

Amazon FreeRTOS Cellular Interface: 1.2.0

Amazon FreeRTOS Kernel: 10.4.6

Amazon FreeRTOS+TCP: 2.4.0

Arm CMSIS5: 5.9.0

Arm CMSISNN: 4.0.0

Amazon OTA 3.3.0

Arm Mbed TLS: 3.3.0+renesas.0

Arm Trusted Firmware-M: 1.7.0+renesas.0

Arm littlefs: 2.2.1+renesas.1

Intel TinyCrypt: 0.2.8+renesas.0

MCUboot: 1.9.0+renesas.0

Microsoft Azure Embedded Wireless Framework: 1.0.0-preview.2.renesas.rx

Microsoft Azure RTOS FileX: 6.2.1

Microsoft Azure RTOS GUIX: 6.2.1

Microsoft Azure RTOS LevelX: 6.2.1

Microsoft Azure RTOS NetX Duo: 6.2.1

Microsoft Azure RTOS ThreadX: 6.2.1

Microsoft Azure RTOS USBX: 6.2.1

SEGGER emWin: 6.32b

TES D/AVE 2D: 3.8.0

Bug Fixes

See fixed GitHub Issues for this release.

Known Issues

Visit GitHub Issues for this project.

Knowledge Base

Visit our knowledge base for other technical updates.

MD5 Checksums

  • FSP_Packs_v4.4.0.zip 6d1db8a1b6ca4a68f49865c66da448a2
  • FSP_Packs_v4.4.0.exe 1fd47ccfce259992800f92a67fc2f4b0
  • fsp_documentation_v4.4.0.zip 9ddefcb1ab3628e0116afe9937b184c4
  • setup_fsp_v4_4_0_e2s_v2023-04.exe c59dce2e388b7bb1de7db5dd62ce357a
  • setup_fsp_v4_4_0_e2s_v2023-04.AppImage f9f48404a921e964fc852b85f9942ae5
  • setup_fsp_v4_4_0_rasc_v2023-04.exe 71071ce4d721db0362330df604e02417
  • setup_fsp_v4_4_0_rasc_v2023-04.AppImage bc3b1a86bd30cedf8eb24d91af438505
  • MDK_Device_Packs_v4.4.0.zip b128b0db28313a273dd84f617543920c

v4.3.0

24 Feb 17:59
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Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 4.3.0.

Minimum e2 studio version for FSP 4.3.0 is e2 studio 2023-01

Download the FSP with e2 studio Windows installer for this release, setup_fsp_v4_3_0_e2s_v2023-01.exe, from here.

Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v4_3_0_e2s_v2023-01.AppImage, from here.

If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v4_3_0_rasc_v2023-01.exe, from here.

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

GCC Compiler: 10.3-2021.10

IAR Compiler: 9.20.2

ARM Compiler: 6.18

QE for Capacitive Touch: 3.1.0

QE for Display: 3.1.1

QE for BLE: 1.6.0

QE for Motor: 1.1.0

e2 studio: 2023-01

RASC: 2023-01

Renesas E2 and E2 Lite: 1.11.4

SEGGER J-Link: 7.84d

Known Issues

  • EWARM support for RA4E2 and RA6E2 MCUs.
    EWARM versions 9.20.x, 9.30.1 and 9.32.1 do not contain support for the RA4E2 and RA6E2. To develop for RA4E2 / RA6E2, It will be necessary to either:
    • Update to EWARM v9.32.2 or
    • Install support patch files which can be downloaded by EWARM v9.20/9.30/9.32.1 users from the MyPages system on www.iar.com

Features Added

  • Support for new RA4E2 and RA6E2 MCUs
    • Includes support for the following development boards:
      • EK-RA4E2
      • EK-RA6E2
      • FPB-RA4E2
      • FPB-RA6E2
    • Added TrustZone support
    • Added ID Code support
  • Dialog DA14531 BLE module support
  • Support for Azure Cellular Embedded Wireless Framework (EWF) on RYZ024A
    • Includes support for running in bare-metal applications
  • Support for Azure USBX DFU
  • Two new motor control functions ("Return origin" and "Inertia estimation")
  • Security features:
    • AES XTS support on SCE5 and SCE5_B
    • AES XTS and CTR support on SCE7
    • Key Injection for AES 192 and ECC-Brainpool 256/384 curves on SCE9
  • Support for new part packages:
    • 16-pin BGA package for RA2E2
    • 64-pin BGA package for RA4M3 and RA6M4
    • 144-pin BGA package for RA4M3, RA6M4 and RA6M5

Fixes and Improvements

  • SEGGER JLink updated to 7.84d
  • E2 and E2 Lite version updated to 1.11.4
  • Microsoft Azure components updated to v6.2.0
    • Fixed GUIX image corruption in rotated display modes
  • Platform installer updated to include e2 studio 2023-01
  • CTSU:
    • Improved moving average calculation
    • Fixed linearity issue when scan time is increased (CTSU2 only)
  • Motor Control:
    • Updated speed observer for position control
    • Improved PWM output control
    • Fixed issue when using a down-count timer for speed calculation
  • Improved floating point operations in HS300X support
  • Corrected TSN calibration data register address on RA6M5
  • Various configuration tool property and constraint fixes
  • AGT:
    • Updated AGT driver to support AGT and AGTW at runtime
    • AGT and AGTW peripheral IO-Define registers have been updated as follows
      • They now use the "R_AGTX" prefix instead of "R_AGT" or "R_AGTW"
      • Added 16-bit and 32-bit overlap registers
      • If using direct register access, update code to the new register mapping

Third Party Software

These third party software solutions are included alongside FSP.

Amazon coreHTTP: 2.1.0

Amazon coreMQTT: 1.2.0

Amazon corePKCS11: 3.4.0

Amazon FreeRTOS+FAT: d725a4c1

Amazon FreeRTOS Cellular Interface: 1.2.0

Amazon FreeRTOS Kernel: 10.4.6

Amazon FreeRTOS+TCP: 2.4.0

Arm CMSIS5: 5.9.0

Arm Mbed TLS: 3.2.1+renesas.0

Arm Trusted Firmware-M: 1.6.0+renesas.0

Arm littlefs: 2.2.1+renesas.1

Intel TinyCrypt: 0.2.8+renesas.0

MCUboot: 1.9.0+renesas.0

Microsoft Azure Embedded Wireless Framework: 1.0.0-preview.1+renesas.0

Microsoft Azure RTOS FileX: 6.2.0

Microsoft Azure RTOS GUIX: 6.2.0

Microsoft Azure RTOS LevelX: 6.2.0

Microsoft Azure RTOS NetX Duo: 6.2.0

Microsoft Azure RTOS ThreadX: 6.2.0

Microsoft Azure RTOS USBX: 6.2.0

SEGGER emWin: 6.30 (Includes AppWizard: V134_630)

TES D/AVE 2D: 3.8.0

Bug Fixes

See fixed GitHub Issues for this release.

Known Issues

Visit GitHub Issues for this project.

Knowledge Base

Visit our knowledge base for other technical updates.

MD5 Checksums

  • FSP_Packs_v4.3.0.zip 2de298cbdb0ed2ee58a50cfbca6274a9
  • FSP_Packs_v4.3.0.exe c9e4823e3c5ad1fac7bc46a6f93de540
  • fsp_documentation_v4.3.0.zip 8284da806d27b0d73118558def479ae5
  • setup_fsp_v4_3_0_e2s_v2023-01.exe b68d892697f8ad4f55b5d9ff2d71dc69
  • setup_fsp_v4_3_0_e2s_v2023-01.AppImage a870a52f2317535e8af2dab076ae3153
  • setup_fsp_v4_3_0_rasc_v2023-01.exe 80215914886842d00b883db834e72408
  • setup_fsp_v4_3_0_rasc_v2023-01.AppImage bf00b738d09e93ff4e894cb80392e97f
  • MDK_Device_Packs_v4.3.0.zip 7ea9af8270ac5c2a1fa9a82a7d2c6547

v4.2.0

15 Dec 17:55
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Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 4.2.0.

Download the FSP with e2 studio Windows installer for this release, setup_fsp_v4_2_0_e2s_v2022-10.exe, from here.

Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v4_2_0_e2s_v2022-10.AppImage, from here.

If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v4_2_0_rasc_v2022-10.exe, from here.

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

GCC Compiler: 10.3-2021.10

IAR Compiler: 9.20.2

ARM Compiler: 6.18

QE for Capacitive Touch: 3.1.0

QE for Display: 3.1.0

QE for BLE: 1.5.0

QE for Motor: 1.1.0

e2 studio: 2022-10

RASC: 2022-10

Renesas E2 and E2 Lite: 1.10.2

SEGGER J-Link: 7.82c

New Features

  • Dialog DA 16200 WiFi module support
  • USBX Host Video Class (HUVC) support
  • Security features:
    • Plaintext key generation support for SCE7/SCE9
    • Key Injection for RSA and ECC on SCE7/SCE9
    • AES XTS support on SCE9
  • BLE Mesh Light LC Server updated to return detailed Events

Fixes and Improvements

  • CTSU:
    • Improved handling of ADC for CTSU2 diagnostic operations
    • Added new touch judgement algorithm
  • BLE:
    • Fixed various issues
  • Fixed build warning when using the USB Bare-Metal Printer class with DMA
  • Fixed build issue with PWM Audio Playback module on MCUs with AGTW
  • Fixed secure project build issue with IAR compiler
  • Fixed infinite loop in FreeRTOS+TCP when FreeRTOS_IPInit() is called with unplugged Ethernet cable
  • Fixed incorrect description of the usb_instance_ctrl_t type in FSP documentation
  • Fixed linker memory map issues with OSPI
  • Added missing UCKSEL register setting for RA2A1
  • Corrected External Bus register mapping for RA6M5
  • SCE7 devices now support all ECC-384 operations including key generation, signing, verification and key derivation
  • SEGGER JLink updated to 7.82c
  • SEGGER emWin updated to 6.30

Third Party Software

These third party software solutions are included alongside FSP.

Amazon coreHTTP: 2.1.0

Amazon coreMQTT: 1.2.0

Amazon corePKCS11: 3.4.0

Amazon FreeRTOS+FAT: d725a4c1

Amazon FreeRTOS Cellular Interface: 1.2.0

Amazon FreeRTOS Kernel: 10.4.6

Amazon FreeRTOS+TCP: 2.4.0

Arm CMSIS5: 5.9.0

Arm Mbed TLS: 3.2.1+renesas.0

Arm Trusted Firmware-M: 1.6.0+renesas.0

Arm littlefs: 2.2.1+renesas.1

Intel TinyCrypt: 0.2.8+renesas.0

MCUboot: 1.9.0+renesas.0

Microsoft Azure Embedded Wireless Framework: 1.0.0-preview.1+renesas.0

Microsoft Azure RTOS FileX: 6.1.12

Microsoft Azure RTOS GUIX: 6.1.12

Microsoft Azure RTOS LevelX: 6.1.12

Microsoft Azure RTOS NetX Duo: 6.1.12

Microsoft Azure RTOS ThreadX: 6.1.12

Microsoft Azure RTOS USBX: 6.1.12

SEGGER emWin: 6.30

TES D/AVE 2D: 3.8.0

Bug Fixes

See fixed GitHub Issues for this release.

Known Issues

Visit GitHub Issues for this project.

Knowledge Base

Visit our knowledge base for other technical updates.

MD5 Checksums

  • FSP_Packs_v4.2.0.zip 41e8bcf190faee054fd3844a3ba018d1
  • FSP_Packs_v4.2.0.exe 8a67c8792c2f6bf337f55818633863ed
  • fsp_documentation_v4.2.0.zip b6fb9fc9aea43857bd311d7879f9f13c
  • setup_fsp_v4_2_0_e2s_v2022-10.exe 4b05453d2024114a6846f40e7c0c753b
  • setup_fsp_v4_2_0_e2s_v2022-10.AppImage 1ebf7099e2d2b62c3b577703e10b10d7
  • setup_fsp_v4_2_0_rasc_v2022-10.exe 56452459dc6e4df055c47047340617ee
  • setup_fsp_v4_2_0_rasc_v2022-10.AppImage 8a7b1af0d8afb39552e1c50725f479c7
  • MDK_Device_Packs_v4.2.0.zip 97b1b9cfd731474d2c78bbb63352169b

v4.1.0

24 Oct 16:56
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Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 4.1.0.

Download the FSP with e2 studio Windows installer for this release, setup_fsp_v4_1_0_e2s_v2022-10.exe, from here.

Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v4_1_0_e2s_v2022-10.AppImage, from here.

If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v4_1_0_rasc_v2022-10.exe, from here.

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

GCC Compiler: 10.3-2021.10

IAR Compiler: 9.20.2

ARM Compiler: 6.18

QE for Capacitive Touch: 3.1.0

QE for Display: 3.1.0

QE for BLE: 1.5.0

QE for Motor: 1.1.0

e2 studio: 2022-10

RASC: 2022-10

Renesas E2 and E2 Lite: 1.10.2

SEGGER J-Link: 7.80c

Features Added

  • AWS Cellular support for RYZ024A
  • RYZ014A API support for Azure Embedded Wireless Framework (EWF)
    • NetX is supported through Azure EWF. Please see the usage notes for limitations and examples.
  • Added USB bare-metal Printer class
  • Mass Storage class support for USBX OTG
  • Added key injection support for SCE5, SCE5_B and SCE9
  • Updated Azure RTOS to 6.1.12
  • Updated Arm Mbed TLS to 3.2.1
  • Updated emWin to v6.28
  • Updated SEGGER JLink to 7.80c
  • Updated Renesas E2 and E2 Lite Emulator support files to V1.10.2

Fixes and Improvements

  • GPT TPCS bitfield width adjusted for some MCUs
  • Fixed issue with the AWS Core MQTT Silex WiFi implementation where a socket error was returned when no data is received before the receive timeout
  • Removed references to removed R_DOC_StatusGet function in TrustZone guard function generation
  • RM_MOTOR modules now generate the correct callback prototype
  • Fixed issue with ADC_B where the mode selection for converter 1 was configured incorrectly
  • Improved ease of use for BLE Mesh library network configuration
  • Fixed issue where the r_ble_balance library scan functions were returning an incorrect device address when compiled with AC6
  • Fixed issue with CTSU FuSa functions when closing and re-opening module
  • NetX can now change the Ethernet MAC address at runtime via nx_ip_interface_physical_address_set()
  • Fixed USB compile error on part families that provide USBHS when using a package that does not support it
  • Fixed issue with using more than one USB MSC device with USBX Hub Host

Third Party Software

These third party software solutions are included alongside FSP.

Amazon coreHTTP: 2.1.0

Amazon coreMQTT: 1.2.0

Amazon corePKCS11: 3.4.0

Amazon FreeRTOS+FAT: d725a4c1

Amazon FreeRTOS Cellular Interface: 1.2.0

Amazon FreeRTOS Kernel: 10.4.6

Amazon FreeRTOS+TCP: 2.4.0

Arm CMSIS5: 5.9.0

Arm Mbed TLS: 3.2.1+renesas.0

Arm Trusted Firmware-M: 1.6.0+renesas.0

Arm littlefs: 2.2.1+renesas.1

Intel TinyCrypt: 0.2.8+renesas.0

MCUboot: 1.9.0+renesas.0

Microsoft Azure Embedded Wireless Framework: 1.0.0-preview.1+renesas.0

Microsoft Azure RTOS FileX: 6.1.12

Microsoft Azure RTOS GUIX: 6.1.12

Microsoft Azure RTOS LevelX: 6.1.12

Microsoft Azure RTOS NetX Duo: 6.1.12

Microsoft Azure RTOS ThreadX: 6.1.12

Microsoft Azure RTOS USBX: 6.1.12

SEGGER emWin: 6.28

TES D/AVE 2D: 3.8.0

Bug Fixes

See fixed GitHub Issues for this release.

Known Issues

Visit GitHub Issues for this project.

Knowledge Base

Visit our knowledge base for other technical updates.

MD5 Checksums

  • FSP_Packs_v4.1.0.zip 922d828b7e49268ce10029d7e34f1990
  • FSP_Packs_v4.1.0.exe 3f8e4b8ae9ca9e4fe0232ba11cdf7b11
  • fsp_documentation_v4.1.0.zip 55f5de1167c6e4d419473d3968a15519
  • setup_fsp_v4_1_0_e2s_v2022-10.exe 3e97197740751ab0636eafeba439ec2b
  • setup_fsp_v4_1_0_e2s_v2022-10.AppImage 4d064f0cd017f73a05e7615c6f7b2630
  • setup_fsp_v4_1_0_rasc_v2022-10.exe c3ac7e2ab9cb963f371c69cba4727264
  • setup_fsp_v4_1_0_rasc_v2022-10.AppImage faa425886e2b0da6d9f134baccc4e5b8
  • MDK_Device_Packs_v4.1.0.zip fcd6e4baf26fdeecae5321f0186e2069