DA14531 Hardware Design Examples
Description
For DA14531, Dialog provides Design Examples files to help customers develop their PCB. These examples show a minimum size layout using the minimum number of external components on a 2-layer PCB. For details on layout guidelines and component selection, see the Application Note AN-B-075 available on the Dialog website.
The following Design Examples files are available: - Boost configuration: better power efficiency at low supply voltage - Buck configuration: better power efficiency at high supply voltage - Bypass mode: lowest cost because no inductor is used. DCDC converter is disabled, resulting in a lower power efficiency
The provided Design Examples files contain the following components:
DA14531 chip in 24 pin FCGQFN package
DA14531 chip in 17 pin WLCSP package
The AT25DF011 Flash
32 MHz XTAL
Inductor (Buck and Boost only)
De-coupling/matching components
PCB Antenna
A small strip antenna design is connected to the chip antenna port. The antenna efficiency and radiation patterns are described in the DA14531 Module Datasheet.
For different antenna designs, see the following documents:
The Design Examples (FCGQFN and WLCSP) are delivered as a .zip file and contain the following items:
- Source_da14531-ed-xxxxx
da14531-ed-xxxxx.brd: Allegro .pcb layout design files
DA14531-ED-xxxxx.DSN: Allegro schematic design files
- Tapeout_da14531-ed-xxxxx
da14531-ed-xxxxx_BOM.xlsx: Bill Of Materials
da14531-ed-xxxxx_PCB.pdf: .pdf layout files
da14531-ed-xxxxx_SCH.pdf: .pdf schematic files
gerber-da14531-ed-xxxxx.zip: gerber files
odbjob-da14531-ed-xxxxx.tgz: ODB++ manufacturing data
The Design Examples files are created according to the DA14531 design guidelines, but these files do not have performance verification or regulatory approvals. These HW design examples are provided As is
without warranty of any kind.
For the verified design examples, see the DA14531 Development Kit PRO Daughterboard Design Files available on the Dialog website or the DA14531 module design that is certified across regions and provides significant savings in development cost and time-to-market.
Revision history
Revision |
Date |
Description |
---|---|---|
1.2 |
22-Aug-2022 |
Changed to Renesas Template |
1.1 |
15-Sept-2020 |
Added WLCSP files |
1.0 |
29-July-2020 |
Initial version for QFN package |