June 19, 2018

TOKYO, Japan, June 19, 2018- Renesas today announced an update of its notice issued on June 18 concerning the impact from the intensity 6 lower earthquake that struck north of Osaka Prefecture at 7:58 a.m. JST on June 18.

Having assessed the status of the manufacturing equipment and products of the Shiga Factory located in Otsu, Shiga, Renesas confirmed the damage is minimal. Part of the manufacturing equipment at Shiga Factory were temporarily halted due to the earthquake, however, they are now being re-launched in a sequential manner and Renesas plans to restore full pre-earthquake production capacity (wafer input capacity) in the morning of June 20.

The content in the press release, including, but not limited to, product prices and specifications, is based on the information as of the date indicated on the document, but may be subject to change without prior notice.