IDT's sensor platform with Bluetooth® capability is sampling in 1CQ2019 with integrated high performance, low-power connectivity powered by Telink Semiconductor.
07 Feb 2019
SAN JOSE, Calif., February 7, 2019 – Leveraging respective leadership technologies in sensors and IoT connectivity, Integrated Device Technology, Inc. (IDT) (NASDAQ: IDTI) and Telink Semiconductor are announcing a partnership to create connected and integrated sensor platforms for IoT applications. These platforms enable a wide variety of IoT use cases, such as environmental sensing, health and fitness monitoring, connected smart buildings, as well as asset identification, position and location tracking.
IDT plans to release the new Bluetooth Low Energy 5 module featuring Telink’s 32-bit microcontroller core with better power-balanced performance for battery-operated devices. The Bluetooth module has an integrated 2.4GHz RF transceiver supporting the IEEE802.15.4 multi-standard wireless protocol along with audio support.
“We are excited about Telink’s technology and how it will augment our existing sensor technology and connectivity platform,” said Sailesh Chittipeddi, IDT’s executive vice president for global operations and chief technology officer. “With this partnership, we will be able to address markets together that we weren’t fully capable of with our standalone solutions.”
“IDT’s integrated sensors and applications combined with Telink’s third generation, ultra-low power connectivity ICs – specifically designed to enable cost sensitive applications – give high-performance options without compromise to connected sensing product designers,” said Jim Wargnier, global VP of sales for Telink Semiconductor. “We look forward to pushing the boundaries with IDT on this exciting platform.”
TELINK SEMICONDUCTOR (Shanghai) CO, LTD is a fabless IC design company and was founded in 2010 with subsidiaries and offices in California, Shenzhen, Taiwan and Hong Kong. Telink is dedicated to the development of highly integrated and low power radio-frequency and mixed signal system chips for Internet of Things (IoT) applications. The current product portfolio from Telink includes 2.4Ghz RF SoCs for Bluetooth Smart, Zigbee, 6LoWPAN/Thread, Homekit and low-power high-precision analog ICs for resistive/capacitive/electromagnetic touch control, serving numerous markets including smart lighting, home automation, smart city, and other consumer electronics markets.
Integrated Device Technology, Inc. develops system-level solutions that optimize its customers’ applications. IDT’s market-leading products in RF, high performance timing, memory interface, real-time interconnect, optical interconnect, wireless power, and smart sensors are among the company’s broad array of complete mixed-signal solutions for the communications, computing, consumer, automotive and industrial segments. Headquartered in San Jose, Calif., IDT has design, manufacturing, sales facilities and distribution partners throughout the world. IDT stock is traded on the NASDAQ Global Select Stock Market® under the symbol “IDTI.” Additional information about IDT can be found at idt.com. Follow IDT on Facebook, LinkedIn, Twitter, and YouTube.
© 2019, Integrated Device Technology, Inc., IDT and the IDT logo are trademarks or registered trademarks of Integrated Device Technology, Inc., and its worldwide subsidiaries. The Bluetooth® word mark and logos are registered trademarks owned by Bluetooth SIG, Inc. Other trademarks and trade names are those of their respective owners. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners.
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