IDT to Feature Its Latest RF Solutions at EDI CON China 2017

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Investor Relations

19 Apr 2017

SAN JOSE, Calif., April 19, 2017—Integrated Device Technology, Inc. (IDT) (NASDAQ: IDTI) today announced plans to feature its leading technology this month at EDI CON China 2017, a leading microwave show. IDT representatives will showcase the company’s advanced RF solutions for communications and other applications. In addition, IDT will present a session titled, “Wide Bandwidth, Low Current Consumption Amplifier for 5G Massive MIMO Applications.”

EDI CON China 2017 runs April 25 through 27 at Shanghai Convention & Exhibition Center of International Sourcing. IDT will be at booth 436 and present at 4:20 p.m. on April 26 in Room 305A. In addition to visiting the booth, attendees request a meeting with an IDT representative.

“IDT has a quickly growing portfolio of leading RF devices, and EDI CON provides an excellent opportunity for us to showcase them,” said Duncan Pilgrim, general manager of IDT’s RF Division. “And our demos will show how a variety of our RF solutions can be integrated by our customers, and future customers, to offer differentiated products.”

More information about EDICON China 2017 can be found at www.ediconchina.com (English) or http://www.mwjournalchina.com/edicon (Chinese)

 

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