Renesas Electronics | News Releases

Renesas Electronics Announces USB 2.0 Hub Controller Chip with Battery Charging Function

Wed, 22 May 2013 06:00:00 GMT

TOKYO, Japan, May 22, 2013 — Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced the development of the µPD720115 USB 2.0 hub controller chip, which supports simultaneous USB communication and charging of portable devices such as smartphones and tablet PCs via a single USB connector.

Imec and Renesas collaborate on ultra-low power short range radios

Thu, 16 May 2013 07:00:00 GMT

Leuven (Belgium) — May 16, 2013 — Imec and Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced today that they have entered into a new strategic research collaboration at Holst Centre. Together, the companies will collaborate to enhance ultra-low power (ULP) wireless technologies for short range communication, targeting sensor networks for automotive and industrial purposes.

Renesas Electronics Reports Financial Results for the Year Ended March 31, 2013

Thu, 9 May 2013 06:00:00 GMT

Tokyo, Japan, May 9, 2013 — Renesas Electronics Corporation (TSE:6723) today announced consolidated financial results for the year ended March 31, 2013.

Renesas Electronics Announces Changes in Representative Directors and the Titles

Thu, 9 May 2013 06:00:00 GMT

TOKYO, Japan, May 9, 2013 — Renesas Electronics Corporation (TSE: 6723, Renesas), a premier supplier of advanced semiconductor solutions, made the following decisions at a meeting of the Board of Directors held today on the nomination of part of a candidate for the Member of the Board to be submitted for approval at the Ordinary General Meeting of Shareholders held in June 2013 and the changes in its Representative Directors as well as the titles to be officially appointed at a meeting of the Board of Directors scheduled after the Ordinary General Meeting of Shareholders.

Regarding Today's Reports in Certain Media

Wed, 8 May 2013 00:30:01 GMT

May 8, 2013 — Today certain media carried reports about the changes of the Executive Officers of Renesas. However, the reports were not based on Renesas' announcement and they cannot be confirmed at this time.

QNX and Renesas to Integrate Renesas R-Car SoC and QNX CAR Application Platform

Tue, 7 May 2013 07:00:00 GMT

OTTAWA and TOKYO, May 7, 2013 — QNX Software Systems Limited and Renesas Electronics Corporation today announced that they are integrating support for the Renesas R-Car SoC (system on chip) platform into the QNX CAR™ application platform to help automotive companies reduce the time and effort of building advanced infotainment systems. As part of their growing collaboration, the companies also announced that QNX Software Systems is joining the Renesas R-Car consortium, a partner program designed to help drive rapid development of next-generation in-car solutions, and to provide enhanced support for automakers and tier 1 automotive suppliers.

Renesas Electronics to Release Intelligent Power Device for IGBT Drive with Micro-Isolator for Reduced System Footprint and High Reliability

Thu, 25 Apr 2013 06:00:00 GMT

TOKYO, Japan, April 25, 2013 — Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced the development of the R2A25110KSP intelligent power device of isolated IGBT driver for use in electric and hybrid vehicle power inverters. Incorporating newly developed Micro-Isolator isolation technology exclusive to Renesas Electronics, the R2A25110KSP makes it possible to build more highly reliable and compact systems for today’s demanding automotive applications.

Renesas Electronics Adds Miniaturization, Power-Savings Enhancements to the RL78 Family of Ultra Low Power Microcontrollers

Wed, 17 Apr 2013 06:00:00 GMT

TOKYO, Japan, April 17, 2013 — Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, has developed the RL78/G10 Group as low pin count versions of the RL78/G1x Series of microcontrollers (MCUs) that feature excellent low-power operation as well as superb processing performance with on-chip flash memory capacities from 1 to 4 KB in 10-pin SSOP (Shrink Small Outline Package) and 16-pin SSOP packages. These MCUs are optimal for consumer products such as small appliances.

Renesas Electronics Introduces Microcontrollers with Ultra Low Power and USB Connectivity

Tue, 16 Apr 2013 06:00:00 GMT

TOKYO, Japan, April 16, 2013 — Renesas Electronics Corporation (TSE: 6723), a premier provider of advanced semiconductor solutions, has introduced the first in its RX100 Series of powerful 32-bit microcontrollers (MCUs)—the new RX111 Group. The RX111 is produced on an ultra low power zero wait state flash process supporting market leading 32-bit power consumption / performance levels as well as supporting fast wake-up, with a wide range of standard peripherals and multiple safety functions as well as an integrated USB 2.0 peripheral supporting host, device and on-the-go (OTG) functionality. This new device group brings the ultra low power features of the Renesas 8-/16-bit RL78 MCU Series to the 32-bit RX product lineup, offering a greater range of device scalability and functionality. The new RX111 devices are designed to support a broad range of low-end 32-bit embedded applications including mobile healthcare, smart meters, sensors/detectors, and industrial and building automation.

Renesas Electronics to Extend Lineup of Digital Broadcast Reception Middleware for Automotive SoC Devices

Tue, 26 Mar 2013 06:00:00 GMT

TOKYO, Japan, March 26, 2013 — Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced the development of digital TV broadcast reception middleware products for automotive SoC devices: a new ISDB-TB (Integrated Service Digital Broadcasting—Terrestrial Brazil) (One-Seg) broadcast reception middleware product for the Brazilian market and the addition of the new “content protection system” [Note 1] standard for Japan to the ISDB-T (Integrated Service Digital Broadcasting—Terrestrial) [Note 2] (Full-Seg) broadcast reception middleware product. Both products will be available starting in April 2013.