Skip to main content

List of Related Articles in Technical Information Magazine RENESAS EDGE

The following page content corresponds to the products marketed in Japan.
If you do not live in Japan, please

Technical Information Magazine RENESAS EDGE Articles Listed by Product:
System in Package (SiP)

Vol.23, 2009.3 issue

SiP (System-in-Package) Technology
Noise-reduction and Cost-saving Benefits Give SiP Technology a Growing Role in New Semiconductor Devices

Vol.19, 2007.10 issue

Overview for Renesas Vehicle Control Solutions
A wide product range based around flash microcomputers meets diverse needs of customers in the global automotive industry

Vol.16, 2007.2 issue

The latest packaging technology
Pursuing high reliability and low cost through the latest packaging technology; SiP solutions that tie in with SoC development are a particular strength.

Vol.13, 2006.4 issue

Chip-on-Chip Interconnect Technology Achieves World-Leadeing Fine Pitch Connections
CoC-FCBGA package supports high-speed data transfer using multi-pin connections and micro-bumps with a 30µm pich.

End of content

Back To Top