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Overview of the RX630 Group
With flash memory capacities from small to large and package pin counts from low to high, the RX630 Group can satisfy the demands of a variety of embedded devices. All the products of the RX630 Group are equipped with E2 data flash capable of 100,000 rewrites and enhanced peripheral functions with increased numbers of channels including timers, USB 2.0 function module, serial communication interface, I2C bus interface, CAN, 10-bit and 12-bit A/D converter, and 10-bit D/A converter. In particular, built-in features such as RTC with timestamp, temperature sensor, independent WDT, and POR/LVD enable the number of external parts to be reduced. We are also planning on releasing small packages such as LGA and BGA.
Memory vs. Package Lineup

RX630 Group Block Diagram

RX630 Group Specifications
| item | RX630 Group |
|---|---|
| CPU core | RX CPU
|
| Maximum operating frequency | 100MHz |
| Power supply voltage | 2.7 to 3.6V |
| Floating-point processing unit | Single-precision floating-point processing unit (Supports add/subtract/compare/multiply/divide and other instructions) |
| Flash ROM (for program storage) |
Max. 2MB |
| Flash ROM (for data storage) | 32KB |
| RAM | Max. 128KB |
| On-chip peripheral functions |
|
| On-chip debugging function | Yes (176/145/144-pin: with trace function; 100/80-pin: without trace function) |
| Low power consumption modes | 4 modes
|
| Packages | PLQP0100KB-A (100-pin LFQFP, 14 x 14mm 0.5mm pitch) PLQP0144KA-A (144-pin LFQFP, 20 x 20mm 0.5mm pitch) PTLG0145KA-A (145-pin TFLGA, 7 x 7mm 0.5mm pitch) PLBG0176GA-A (176-pin LFBGA, 24 x 24mm 0.5mm pitch) |
*Part number differs between with CAN/without CAN versions.
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