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Release of the RX630 Group for Consumer Electronics, Office Equipment, and Industrial Applications, and the RX63N and RX631 Groups for Networking and Industrial Applications

The RX600 is the high-speed and high-performance series in the RX family.
The series is positioned as the upward successor to the H8SX and R32C, the 32-bit families of Renesas MCUs. Already released are the RX610 Group suitable for photocopiers, laser beam printers, home audio systems, and so on, the RX621 Group and RX62N Group suitable for networking equipment with enhanced connectivity and fail-safe functions, and the RX62T Group suitable for energy-saving motor and other inverter control applications. Now, the RX630 Group suitable for consumer electronics and office equipment, and the RX63N and RX631 Groups suitable for networking and industrial applications, all with 90% reduced power consumption at standby, have been released.

Looking forward, Renesas will enhance the RX600 Series by reinforcing the memory, packages, and peripheral functions focusing on a variety of applications.

Features of the RX600 Series

Specifications of the RX610, RX621, RX62N, RX62T, RX630, RX63N, and RX631 Groups

Product
name
610 Group 621 Group 62N Group 62T Group
CPU
  • RX CPU 100MHz
  • Maximum 165DMIPS (1.65DMIPS/MHz)
  • Flash 0 wait access at 100MHz
  • Floating-point processing unit
Power
consumption
3.3V single power supply 50mA Typ
On-chip
memory
  • Flash 2.0MB
    RAM 128KB
  • Flash 1.5MB
    RAM 128KB
  • Flash 1.0MB
    RAM 128KB
  • Flash 768KB
    RAM 128KB
  • Flash 512KB
    RAM 96KB
  • Flash 384KB
    RAM 64KB
  • Flash 256KB
    RAM 64KB
  • Flash 512KB
    RAM 96KB
  • Flash 384KB
    RAM 64KB
  • Flash 256KB
    RAM 16KB
  • Flash 128kB
    RAM 8KB
  • Flash 64kB
    RAM 8KB
Peripheral functions Commu
nication
None
  • CAN
  • USB 2.0 x 2 ch (176-pin) 2 ch: H/F/OTG
  • USB 2.0 x 1 ch (up to 144-pin) 1ch: H/F/OTG
  • EtherMAC
  • CAN(option)
  • USB 2.0 x 2 ch (176-pin) 2 ch: H/F/OTG
  • USB 2.0 x 1 ch (up to 144-pin) 1ch: H/F/OTG
  • CAN x 1 ch
  • LIN x 1 ch
Serial
  • SCI x 7 ch
  • I2C x 2 ch
  • SCI x 6 ch
  • I2C x 2 ch
  • RSPI x 2 ch
  • SCI x 3 ch
  • I2C x 1 ch
  • RSPI x 1 ch
Timers
  • 8-bit timer x 4 ch
  • 16-bit timer x 4 ch
  • 8-bit WDT x 1 ch
  • 8-bit timer x 4 ch
  • 16-bit timer x 4 ch (CMT) + 12 ch (MTU2)
  • 8-bit WDT x 1 ch
  • 14-bit independent WDT x 1 ch
  • RTC
  • 16-bit timer 4 ch (CMT) + 8 ch (MTU3) + 4 ch (GPT)
  • 8-bit WDT x1 ch
  • 14-bit independent WDT x 1 ch
Other
  • DTC/DMAC
  • AD: 10-bit 4 ch x 4
  • DA: 10-bit 2 ch
  • DTC/DMAC/
    EXDMAC
  • AD: 12-bit x 4 ch x 2, 10-bit 4 ch x 2
  • DA:10bit 2ch
  • POR/LVD
  • OCO (Low-speed)
  • EDMAC
  • DTC/DMAC/
    EXDMAC
  • AD: 12-bit x 4 ch x 2 ch, 10-bit 4 ch x 2
  • DA: 10-bit 2 ch
  • POR/LVD
  • OCO(Low-speed)
  • EDMAC
  • DTC
  • A/D 12-bit x 8 ch (2 units), 10-bit x 12 ch
  • POR/LVD
  • CRC

 

Packages
  • LQFP144
  • BGA176
  • LQFP144,100
  • LGA145,85
  • BGA176
  • LQFP100,144
  • LGA145
  • BGA176
  • LQFP112
  • LQFP100
  • LQFP80
  • LQFP64
Product
name
630 Group 63N Group 631 Group
CPU
  • RX CPU 100MHz
  • Maximum 165DMIPS (1.65DMIPS/MHz)
  • Flash 0 wait access at 100MHz
  • Floating-point processing unit
Power
consumption
3.3V single power supply 50mA Typ
On-chip
memory
  • Flash 2.0MB
    RAM 128KB
  • Flash 1.5MB
    RAM 128KB
  • Flash 1.0MB
    RAM 96KB
  • Flash 768KB
    RAM 96KB
  • Flash 512KB
    RAM 64KB
  • Flash 384KB
    RAM 64KB
  • Flash 256KB
    RAM 64KB
  • Flash 1.0MB
    RAM 128KB
  • Flash 768KB
    RAM 128KB
  • Flash 512KB
    RAM 96KB
  • Flash 384KB
    RAM 64KB
  • Flash 265KB
    RAM 64KB
  • Flash 1.0MB
    RAM 128KB
  • Flash 768KB
    RAM 128KB
  • Flash 512KB
    RAM 96KB
  • Flash 384KB
    RAM 64KB
  • Flash 265KB
    RAM 64KB
  • Flash -KB
    RAM 128KB
Peripheral functions Commu
nication
  • CAN x 3 ch (177/176/145/144-pin)
    *1 MB and 768 KB are 2 ch
    CAN x 1 ch (100/80/64-pin)
  • USB 2.0 Full x 1 ch (Function)
  • EtherMAC
  • CAN x 2 ch
  • USB 2.0 Full x 2 ch
    (177/176-pin)
    USB 2.0 Full x 1 ch
    (up to 145-pin)
  • USB 2.0 Full×2 ch
    (Host or Function or OTG)
  • USB 2.0 Full×1 ch
    (Host or Function or OTG)
  • CAN x 2 ch
  • USB 2.0 Full x 2 ch(177/176-pin)
    USB 2.0 Full x 1 ch
    (up to 145-pin)
  • USB 2.0 Full × 2 ch
    (Host or Function or OTG)
  • USB 2.0 Full × 1 ch
    (Host or Function or OTG)
Serial
  • SCIc x 12 ch (177/176/145/144-pin)
    SCIc x 6 ch(100-pin)
    SCIc x 1 ch(80/64-pin)
  • SCId x 1 ch
  • I2C x 4 ch (177/176/145/144-pin)
    I2C x 2 ch
    (100-pin)
    I2C x 1 ch
    (80/64-pin)
  • RSPI x 3 ch (177/176/145/144-pin)
    RSPI x 2 ch
    (100/80/64-pin)
  • SCIc x 12 ch (177/176/145/144-pin)
    SCIc x 8 ch (100-pin)
    SCIc x 5 ch (up to 85-pin)
  • SCId x 1 ch
  • I2C x 4 ch (177/176/145/144-pin)
    I2C x 2 ch
    (100/85/80-pin)
  • RSPI x 3 ch (177/176/145/144-pin)
    RSPI x 2 ch (100/85-pin)
  • SCIc x 12 ch (177/176/145/144-pin)
    SCIc x 8 ch (100-pin)
    SCIc x 5 ch (up to 85-pin)
  • SCId x 1 ch
  • I2C x 4 ch
    (177/176/145/144-pin)
    I2C x 2 ch
    (100/85/80-pin)
  • RSPI x 3 ch
    (177/176/145/144-pin)
    RSPI x 2 ch
    (100/85-pin)
Timers
  • 8-bit timer x 4 ch
  • 16-bit timer x 12 ch(177/176/145/144-pin)/
    16-bit timer x 6 ch(100/80/64-pin) + 4 ch (CMT) + 8 ch (MTU2)
  • 14-bit WDT x 1 ch
  • 14-bit independent WDT x 1 ch
  • RTC
  • 8-bit timer x 4 ch
  • 16-bit timer x 12 ch
    (177/176/145/144-pin)/
    16-bit timer x 6 ch (100/85-pin) + 4 ch (CMT) + 6 ch (MTU2)
  • 14-bit WDT x 1 ch
  • 14-bit independent WDT x 1 ch
  • RTC
  • 8-bit timer x 4 ch
  • 16-bit timer x 12 ch
    (177/176/145/144-pin) /
    16-bit timer x 6 ch (100/85-pin) + 4 ch (CMT) + 6 ch (MTU2)
  • 14-bit WDT x 1 ch
  • 14-bit independent WDT x 1 ch
  • RTC
Other
  • DTC/DAMC
  • A/D: 12-bit x 21 ch (177/176/145/144-pin) 12-bit x 14 ch
    (100-pin)
    12-bit x 11 ch
    (80-pin)
    12-bit x 6 ch
    (64-pin)
    10-bit x 8 ch (177/176/145/144/100-pin)
    10-bit x 4 ch
    (80/64-pin)
  • D/A: 10-bit x 2 ch
    (177/176/145/144-pin) 10-bit x 1 ch (100/80/64-pin)
  • POR/LVD
  • CRC
  • DTC/DAMC/EXDMAC
  • A/D: 12-bit x 21 ch (177/176/145/144-pin)
    12-bit x 14 ch
    (100-pin) 
    12-bit x 11 ch
    (85/80-pin)
    12-bit x 7 ch
    (64-pin)
    10-bit x 8 ch
    (176/145/144/100-pin)
    10-bit x 4 ch
    (up to 85-pin)
  • D/A: 10-bit x 2 ch
    (177/176/145/144-pin)
  • D/A: 10-bit x 1 ch
    (100/85-pin)
  • POR/LVD
  • CRC
  • DTC/DAMC/EXDMAC
  • A/D: 12-bit x 21 ch
    (177/176/145/144-pin)
    12-bit x 14 ch
    (100-pin)
    12-bit x 11 ch
    (85/80-pin)
    12-bit x 7 ch
    (64-pin)
    10-bit x 8 ch
    (176/145/144/100-pin)
    10-bit x 4 ch
    (up to 85-pin)
  • D/A: 10-bit x 2 ch
    (177/176/145/144-pin)
  • D/A: 10-bit x 1 ch
    (100/85-pin)
  • POR/LVD
  • CRC
Packages
  • LQFP64,80,100,
    144,176
  • LGA100,145,177
  • BGA176
  • LQFP64,80,100,144,176
  • LGA85,100,145,
    177
  • BGA176
  • LQFP64,80,100,144,176
  • LGA85,100,145,177
  • BGA176

RX CPU core: High-speed, high-performance, and high-code-efficiency

High speed: 100MHz; high performance: 165DMIPS@100MHz (1.65DMIPS/MHz) Built-in multiply-divide unit, multiply-and-accumulate unit, and single-precision floating point unit (FPU)

Benchmark Test

The RX CPU has achieved a maximum operating frequency up to 200MHz. It is the next-generation CPU core that adopted high-speed features such as 5-stage pipeline, Harvard architecture, out-of-order execution, as well as multiply and accumulate unit, and FPU. With the RX610 Group, high processing performance of 1.65DMIPS at 1MHz (165DMIPS at 100MHz) has been achieved.

Low power consumption

Output current is about 50mA, even at the fastest-speed operation at 100MHz. This translates to 0.5mA per 1MHz, about half that of Renesas’ existing products.
In addition, by optimizing the instruction length of frequently used instructions, an average 30% improvement in code efficiency over existing products is achieved.

Equipped with large-volume high-speed memory

The maximum memory capacity is 2MB flash ROM with a 128KB RAM. The 2MB flash ROM is of high-speed MONOS (Metal Oxide Nitride Oxide Silicon) structure, no wait states at speeds up to 100MHz. Combined with more than 30% improvement in code efficiency compared to Renesas’ existing products, it is highly useful for large-scale applications that require high-speed processing. In addition, a 128KB SRAM and a data flash with 30,000 erase/write cycles are mounted to eliminate the need for external SRAM or EEPROM.

Enhanced built-in functions

In addition to enhanced standard functions such as serial communications and timer, the new products incorporate a variety of popular functions used in existing Renesas products, including DMAC (Direct Memory Access Controller) to perform high-speed data transfer in place of the CPU, DTC (Data Transfer Controller) to make data transfer efficient, and CMT (Compare Match Timer) useful for interrupt and polling.

Product Lineup:

Documents Tools Operating
Voltage
(V)
Max.
Frequency
(MHz)
Program
Memory
(KB)
Data
Flash
(KB)
RAM
(KB)
Pins
RX621, RX62N
The RX621 Group and the RX62N Group are built around the RX core and are equipped with 2 channels of USB 2.0 full-speed (Host, Function and OTG), 2 channels of CAN*, and EtherMAC** as communications interfaces. The products are designed to not put a restriction on applications based on their communication method, and these communication methods can be achieved on a single chip. They are also equipped with a rich set of system fail-safe functions such as power-on reset (POR), low voltage detection (LVD), and an independent watchdog timer. *Optional setting for RX62N Group. **Only available for RX62N Group.
Development
Environment
2.7 - 3.6 100 256 - 512 32 64 - 96 00,85,100,176
RX62T
The RX62T Group of high-performance microcontrollers with a maximum operating frequency of 100MHz are designed for motor control. They are equipped with multifunction timers (MTU, GPT), high-speed 12-bit A/D converter, and 10-bit A/D converter for facilitating motor control. <br />The products also incorporate many safety features to comply with the IEC60730 safety standard for home appliances. In addition to a maximum of 256KB flash and 16KB RAM on-chip memory, they have a maximum of 32KB of on-chip flash memory for data storage. 64-pin to 112-pin packages are available.
Development
Environment
2.7 - 5.5 100 64 - 256 8,32 8 - 16 64,80,100,112
RX610
The RX610 Group is built around the RX core and has enhanced analog, communication, and timer functions. <br />The products are equipped with four units of 10-bit A/D converters (1 us), 10-bit D/A converter, large-capacity memory (2MB flash, 128KB RAM max) capable of single-cycle access at 100MHz, 7 channels of SCI, I2C, 16 channels of 16-bit timer, 4 channels of 8-bit timer, and major functions.? They enable a system to be configured without peripheral memory and other peripheral devices, reducing the total cost of the system.
Development
Environment
3 - 3.6 100 768 - 2048 32 128 - 128 176
RX630
With flash memory capacities from small to large and package pin counts from low to high, the RX630 Group can satisfy the demands of a variety of embedded devices. All the products of the RX630 Group are equipped with E2 data flash capable of 100,000 rewrites and enhanced peripheral functions with increased numbers of channels including timers, USB 2.0 function module, serial communication interface, I<sup>2</sup>C bus interface, CAN, 10-bit and 12-bit A/D converter, and 10-bit D/A converter. In particular, built-in features such as RTC with timestamp, temperature sensor, independent WDT, and POR/LVD enable the number of external parts to be reduced. We are also planning on releasing small packages such as LGA and BGA.
Development
Environment
2.7 - 3.6 100 384 - 2048 32 64 - 128 100,176
RX63N, 631
The RX63N/RX631 Group incorporates communication functions suitable for networking equipment, such as Ethernet controller, USB 2.0 full-speed (function, host, or OTG selectable), and CAN. In addition, with a RTC (Real-Time Clock) that can operate on a dedicated power supply as a low power feature, standby power consumption can be reduced by approximately 90% compared to existing products. The selection of on-chip memory has been expanded from ROMless to 2 MB, and even smaller-sized packages are available. This makes possible mounting in anything from large-scale systems to small-scale/small-space devices.
Development
Environment
2.7 - 3.6 100 768 - 1024 32 128 - 128 -

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