Overview
Description
The Renesas Flexible Software Package (FSP) is an enhanced software package designed to deliver user-friendly, scalable, high-quality software for embedded system designs using the Renesas RA family of Arm Microcontrollers, ensuring software compatibility across the RA family, from entry-level to high-performance microcontrollers. With the support of new Arm® TrustZone® and other advanced security features, FSP provides a quick and versatile way to build secure, connected IoT devices using production-ready drivers, Azure® RTOS, FreeRTOS™, and other middleware stacks.
download Download Latest FSP (v6.0.0):
FSP Platform Installer (Includes e² studio IDE, toolchain, and FSP packs):
RA Smart Configurator (RASC) Installer (FSP packages to use with 3rd party IDEs with IAR Embedded Workbench, Arm Keil MDK):
FSP Standalone Installer (FSP packs for the users who only update the FSP and no e² studio update):
- Download from the Assets section of the GitHub
The installation instructions can be found here. All the FSP Releases and Patches can be found on GitHub.
FSP includes best-in-class HAL drivers with high performance and low memory footprint. Middleware stacks with Azure RTOS and FreeRTOS integration are included to ease the implementation of complex modules like communication and security. The e² studio IDE provides support with intuitive configurators and intelligent code generation to make programming and debugging easier and faster.
FSP uses an open software ecosystem and provides flexibility in using bare-metal programming, including Azure RTOS or FreeRTOS, your preferred RTOS, legacy code, and third-party ecosystem solutions. FSP and e² studio can be used free of charge on any Renesas device.
Features
- Multi-Core and Single Core support of Arm® Cortex®- M-based RA MCUs
- Small memory footprint HAL drivers
- Intuitive configurator and code generator
- Static and dynamic analysis using industry-standard tools
- Application support using RTOS and non-RTOS environments
- Azure RTOS and its middleware stacks with Flexible Software Package
- Azure RTOS ThreadX, NetX Duo & Add-ons, USBX, GUIX & GUIX Studio, FileX, TraceX, exFAT, LevelX, NetX Duo Secure & NetX Crypto (HW acceleration)
- FreeRTOS support – Includes Kernel and set of software libraries
- FreeRTOS Kernel, FreeRTOS-Plus-TCP, Core MQTT, Core HTTP/HTTPS, Task pool, Secure Sockets, Cellular Interface
- Tool configurable RTOS resources (Threads, mutexes, etc.)
- Middleware stacks from Renesas and third parties
- Ethos-U55 support for CM85 based MCUs for efficient AI/ML integration
- TCP/IP and other connectivity protocol stacks including MQTT
- USB middleware support for CDC, HID, and MSC
- Wireless connectivity through Cellular (Cat-M1), Wi-Fi, and Bluetooth Low Energy LE 5.0 (BLE Mesh)
- File System support with FreeRTOS+FAT and LittleFS
- Storage (Block Media) support for SDMMC, SPI, and USB.
- Virtual EEPROM on Flash
- Capacitive touch middleware to implement widgets like Button, Slider, and Wheels.
- Motor control algorithms
- Secure Bootloader through MCUboot
- Sensor Module APIs
- TrustZone support (for applications on CM33-based MCUs)
- TrustZone enabled drivers and middleware
- Easy-to-use tool support for TrustZone configuration
- PSA Level 2 Certified
- AWS qualified for FreeRTOS
- Easy connectivity options to major cloud providers
- Secure connections through NetX Duo Secure and Mbed TLS
- Cryptographic APIs and integrated Hardware Acceleration support
- Arm PSA Cryptographic APIs
- Azure RTOS NetX Crypto APIs
- Ultimate security with FSP Crypto APIs (SCE9 protected mode)
- Oberon Ocrypto targeting low end RA2E1 devices
- TinyCrypt targeting constrained devices
- Graphics interface support and tools
- LVGL integration support for RA devices
- Segger emWin (RA customers can use Segger emWin graphic tools and libraries for free from Downloads below)
- Azure RTOS GUIX and GUIX Studio (available free on Microsoft Apps Store)
- Secure debugging capabilities
- Extensive tool support from Renesas and leading third-party solutions
- Integrated package with all required components for easy setup and starting development (single installer with e2 studio, CMSIS packs, toolchain, and Segger J-Link drivers)
- Complete source code available through GitHub
Release Information
For additional information and links, go to GitHub.
v6.0.0
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 6.0.0
Minimum e2 studio version for FSP 6.0.0 is e2 studio 2025-04.1
- Download the FSP with e2 studio Windows installer for this release: FSP Windows Platform Installer
- Download the FSP with e2 studio Linux installer for this release: FSP Linux Platform Installer
- Refer to Installing e² studio in a Linux PC | Renesas Customer Hub for information on installing e2 studio and related software components on a Linux PC.
- Download the FSP with e2 studio MacOS (Apple Silicon) installer for this release: FSP MacOS Platform Installer
- Refer to the Quick Start Guide for the e² studio for macOS for information on installing e2 studio and related software components on a macOS PC.
If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator (RASC) for this release.
- For Windows download: FSP RASC Windows Installer
- For Linux download: FSP RASC Linux Installer
- For macOS (Apple Silicon) download: FSP RASC macOS Installer
All installers are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
New Features
- Added support for RA8P1 devices
- Includes EK-RA8P1 board support
- Added support for RA4C1 devices
- Includes EK-RA4C1 board support
- Added support for RA2T1 devices
- Includes FPB-RA2T1 board support
- Added Central/Client and Security functionality to r_ble_gtl module
- Added support to r_sci_b_lin for configuring the noise cancellation clock divider
- Added HW Acceleration support for ECC/ECDSA p384 and keygen p384 for NetX Crypto on RA4C1 devices
- Added ability to load/store Bluetooth BD addresses in flash
- OSPI_B feature updates:
- Support 1-byte and 2-byte addressing
- Support devices that require an address to get device status
- Additional timing options
- Support retrieving the device's part number through the R_BSP_PartNumberGet function
- Blinky template projects updated with multicore support; CPU0 will release CPU1 from reset and each core will blink its respective LED
- Added new Modbus TCP Server module
- Added support for the LVGL graphics library
- Support TLS Layer on lwIP with ARM MbedTLS
- Support FreeRTOS Plus TCP for ESWM
- Support lwIP stack for ESWM
- Updated IAR toolchain to v9.70.1
- A new linker directive was added for proper operation of PSA Crypto that is not supported by IAR v9.60.4, so v9.70.1 is required for FSP v6.0.0 and up
- FSP Common API updated to v1.12.0
- A new tutorial section on creating a multicore blinky application has been added to the FSP User's Manual. It covers new features on creating and debugging multicore applications in e2 studio. It can be found under the 'Starting Development' section.
- Added NDEF add-on API support to NFC PTX driver
- Updated documentation relating to predefined non-cacheable linker sections
Compatibility Breaks
- Deprecated RYZ cellular modules have been removed
- Renamed BSP_CFG_UCK_DIV to BSP_CFG_UCLK_DIV
- Renamed BSP_CFG_UCK_SOURCE to BSP_CFG_UCLK_SOURCE
- Renamed BSP_CFG_U60CK_SOURCE to BSP_CFG_USB60CLK_SOURCE
- Renamed BSP_CFG_U60CK_DIV to BSP_CFG_USB60CLK_DIV
- Renamed BSP_CFG_OCTA_SOURCE to BSP_CFG_OCTACLK_SOURCE
- Renamed BSP_CFG_OCTA_DIV to BSP_CFG_OCTACLK_DIV
- Removed all deprecated ELC event enumerated values
- Deprecated R_XSPI_Type, R_XSPI, and related R_XSPI_ macros have been removed; use R_XSPI0_Type and R_XSPI0 instead
- LIN (r_sci_b_lin, r_sci_lin, r_sau_lin):
- Enumeration Deprecations:
- In lin_event_t, LIN_EVENT_RX_START_FRAME_COMPLETE is now LIN_EVENT_RX_HEADER_COMPLETE
- In lin_event_t, LIN_EVENT_TX_START_FRAME_COMPLETE is now LIN_EVENT_TX_HEADER_COMPLETE
- In lin_event_t, LIN_EVENT_RX_INFORMATION_FRAME_COMPLETE is now LIN_EVENT_RX_DATA_COMPLETE
- In lin_event_t, LIN_EVENT_TX_INFORMATION_FRAME_COMPLETE is now LIN_EVENT_TX_DATA_COMPLETE
- Function Deprecations:
- In lin_api_t, 'startFrameWrite' and 'informationFrameWrite' are replaced by 'write.' Use 'write' for both header and data transmission.
- In lin_api_t, 'informationFrameRead' is replaced by 'read.' No usage change.
- Struct Deprecations:
- In lin_transfer_params_t, member p_information is now p_data
- Enumeration Deprecations:
- Removed EOL FS2012, FS1015, and OB1203 sensor support
- Removed deprecated ZMOD4410 Odor and ZMOD4510 OAQ 1st Gen support
- Removed deprecated BLE_LIB_ALL_FEATS macro
- Removed improperly named enumerated values in rm_ble_mesh_error_code_t
- All enumerated values in this type now start with the base type name
- Removed BLE_ABS_EVENT_NOTIFY_∗_POS macros (superseded by versions without ABS_)
- Removed RM_BLOCK_MEIDA_RAM_CFG_MEDIA_SIZE macro (superseded by RM_BLOCK_MEDIA_RAM_CFG_MEDIA_SIZE)
- Removed r_pdc_api.h (unused; superseded by r_capture_api.h)
- Removed board_sdram.h (superseded by BSP-level SDRAM support via bsp_sdram.h)
- Removed u∗_ prefix from floats motor_120_driver_extended_cfg_t::u4_pwm_carrier_freq and motor_driver_extended_cfg_t::u2_pwm_carrier_freq
- Removed deprecated/unused WIFI_SetMAC() from rm_wifi_api.h
- Removed RYZ cellular stacks
- Handling of SAU pin restrictions in RA0 MCUs:
- Only allow pins of the same group (same suffix) to be set, except for SAU_I2C11, SAU_SPI11
- Removed 'Mixed' Pin Group for SAU_I2C, SAU_SPI and SAU_UART
- Replaced 'Custom' Operation Mode by 'Custom (No Mixed)' for SAU_SPI and SAU_UART
- Only allow one operation mode to be set for one SAU channel
- Disabled SAU channel in other operation modes when one mode is used in SAU_I2C, SAU_SPI, SAU_UART
- Only allow pins of the same group (same suffix) to be set, except for SAU_I2C11, SAU_SPI11
- Corrected LPM macro name LPM_SNOOZE_END_SCI0_ADDRESS_MATCH to LPM_SNOOZE_END_SCI0_ADDRESS_MISMATCH
- Removed the deprecated IICRSV (Communication reservation) setting in IICA master
- The pin names of r_ssi have been fixed for RA8M1/D1/T1/E1/E2 devices to match the HW user manual. Existing projects for the affected devices with SSIE pins configured shall need to be reconfigured
- In accordance with the update to the new security policy, the public key injection APIs for RSA and ECC algorithms have been removed in the r_rsip_key_injection module. This change only affects RSIP-E51A devices.
- Changed the method of releasing Ether-related tasks from waiting and the method of retrieving the MAC address
- USB pipe selection in the Host/Peripheral stack has been removed. Pipes are now selected automatically at run-time.
- Users may now refer to the type member in the usb_event_info structure to determine which write or read event has completed.
- Please check and update your application code if the project build fails due to undefined macros USB_CFG_PCDC_BULK_IN or USB_CFG_PHID_INT_IN; for example:
- In a PCDC+PCDC or PCDC+PVND Composite Baremetal project, update the condition for USB_STATUS_WRITE_COMPLETE/USB_STATUS_READ_COMPLETE status from if (USB_CFG_PCDC_BULK_IN/OUT == event_info.pipe) to if (USB_CLASS_PCDC == event_info.type)
- In a PHID+PHID Composite FreeRTOS project, update the condition for USB_STATUS_WRITE_COMPLETE status from if (USB_CFG_PHID_INT_IN == p_usb_basic_event->pipe) to if (USB_CLASS_PHID == p_usb_basic_event->type)
- Please note that R_USB_Read() and R_USB_Write() APIs should only be called during the Data Transfer state. If called in any other state(such as Control Transfer, etc.), these functions will return FSP_ERR_USB_FAILED
- Removed the element handle in the BLE MESH ACCESS instance control struct
- Removed deprecated BSP_PACKED macro
- The key management specification in the r_rsip_protected module has been revised. The main change is that the specification of the rsip_wrapped_key_t structure, which manages wrapped key, has been changed, and its members are now type and * p_value. The member type indicates the key type managed by this structure, and the member * p_value indicates the pointer to the address where the actual wrapped key is located. Previously, the actual wrapped key value was managed in rsip_wrapped_key_t, but the new specification instead stores a pointer to the address where the key is located. With this change, users must initialize each member (type and * p_value) when declaring rsip_wrapped_key_t variable. In addition, since the key type is initialized in advance as described above, it is no longer necessary to specify it in APIs such as key generation, so the argument key_type has been removed from the related APIs. For specific instructions, please refer to the Examples on the r_rsip_protected page of the FSP User Manual.
- The behavior of MCUboot images and flash areas is now configured via the Solution project instead of via MCUboot stack properties
Fixes and Improvements
- RA2 compiler/linker changes:
- Default optimization is now -Oz (max optimize for size)
- By default, content will be placed in the flash 'gap' (area between vector table and OFS registers)
- Added constraint for limiting TrustZone selection for non-secure projects in MCUboot
- Add multiple instance support for OSPI_B DOTF
- r_sci_b_lin:
- Add support for selecting the number of base clock cycles per bit period in e2 studio to control the SCI base clock frequency
- R_SCI_B_LIN_BaudCalculate now ignores the input parameter sci_b_lin_baud_setting_t::bus_conflict_clock when calculating the baud rate because the bus conflict clock divider cannot be easily selected unless the SCI base clock frequency setting is already known. This parameter may be removed in a future major version of FSP.
- Update usage notes to improve description of how to select an appropriate bus conflict clock divider when using bus conflict detection
- CMSIS-NN updated to version 7.0.0
- Updated the constraint logic of the properties 'ECDSA Scratch Buffer Size (Bytes)' and 'ECDH Scratch Buffer Size (Bytes)' for rm_netx_secure_crypto module to avoid negative values
- Fixed LLVM build error for C++ projects
- Fixed source file inclusion causing lockup for Ocrypto S/W Only stack
- Updated R_ADC_D_ScanCfg parameter checking for invalid channels in select mode
- Platform installer updated to include e2 studio 2025-04.1
- Fixed misleading constraint regarding Ocrypto for when using MCUboot
- Fixed compiler warning if the OSPI_B prefetch function is disabled (OSPI_B_CFG_PREFETCH_FUNCTION=0)
- Fixed internal pull up for IRQ mode
- Improved performance of AES-GCM encryption processing for RSIP-E51A PM driver
- Added usage note regarding USB event handling when using the USB API
- Fixed unsupported modes for SCI in pin configurator
- AC6 C++ now uses standard libraries instead of microlib
- PLL Frequency item is removed and 'CL Only Mode' item is added in r_usb_basic configuration (driver now automatically configures CLKSET based on BSP clock configuration)
- Fixed P005 as GPIO input in EK-RA4E2
- Fix various spelling mistakes throughout codebase
- Fixed ADC group priority setting
- Fixed ADC_B issue where channels 19 and 23-28 may not have been correctly selectable for virtual channels
- Add UCKSEL register and select HOCO on UCLK
- Fixed issue where Software Delay is 50% too long on devices with Flash LP when ICLK is higher than 32MHz
- Fix default clock settings for FPB-RA4T1
- Blinky project templates now all blink at 1Hz
- RSIP-E11A Protected Mode Elliptic Curve Cryptography (ECC) side-channel countermeasures were strengthened, which impacts the time required for key pair generation, ECDSA signature generation, and ECDH calculation. The time required for ECDSA signature verification is unaffected.
- Removed const from p_context declarations allowing users to point to non-const data
- Fix missing/incorrect constraint on PLL Input Frequency for RA4 and RA6 MCUs
- Segger JLink version updated to v8.44a
- FreeRTOS Timer task stack size now correctly set to configTIMER_TASK_STACK_DEPTH instead of configMINIMAL_STACK_SIZE
- Fixed SHA and HMAC features for RSIP-E11A PM not calculating correctly for input messages between 65 and 118 bytes
- E2 and E2 Lite version updated to 2.5.8
- Renamed __Vectors to CMSIS macro __VECTOR_TABLE
- Fixed MQTT Receive input parameters and updated usage notes on supported baud rates
- Removed 1 Mbps minimum limitation on CANFD Data Rate
- Move USB_DM and USB_DP pins to USB_FS group from Systems group for RA4E2, RA4T1, RA6E2, and RA6T3 devices
- Added fix to show the selected unit's pins in the Properties view for OSPI_B
Deprecations
- The following modules have been deprecated:
- rm_hs300x
- rm_hs400x
- rm_fs3000
- rm_rrh47000
- rm_rrh62000
- Some rm_zmod4xxx measurement modes:
- ZMOD4410 IAQ 1st Generation
- ZMOD4410 Relative IAQ
- ZMOD4410 Relative IAQ Ultra-Low Power
- Enum mipi_dsi_cmd_id_t deprecated in favor of mipi_cmd_id_t
- Replaced and deprecated BSP_FEATURE_ADC_TSN_SLOPE macro (use BSP_FEATURE_TSN_SLOPE instead)
- Support multiple PHY LSIs on a single MDIO interface
Known Issues
- RA0E1:
- e2 studio projects automatically reset compiler optimization to a Size setting on every generate or build operation
- Add optimization flags (e.g. -O0) manually to 'Other optimization flags' to override the -Oz setting
- HS400x and ZMOD4xxx sensors cannot be used on RA0E1
- FS3000 sensor does not support SAU-I2C driver
- Selecting 'Safely Remove Hardware and Eject Media' on Windows and eject the mass storage (PMSC), when using USBX composite device (PCDC+PMSC), the Windows Explorer for PMSC does not disappear.
- PMSC may not work properly when the USBX Composite Device (PCDC+PMSC) is connected to a specific Linux OS (USB Host).
- EWARM version 9.60.4 does not contain support for RA0E2, RA2L2, RA2T1, RA4C1 and RA8P1. To develop with IAR for these devices, it is necessary to install a support patch file for which can be downloaded by EWARM v9.60.4 users from the IAR MyPages system
- RA0E2(arm_Renesas_RA0E2_20240715_1.zip)
- RA2L2(arm_Renesas_RA2L2_patch_20240510_1.zip)
- RA2T1(arm_Renesas_RA2T1_20240611_1.zip)
- Due to limitations in RASC, Projects fail to build if there are files with the same name in a build group. To fix this issue, create files with the same name in different build groups. For known issues in the tools, please refer to the respective tool's release notes, e2 Studio RN
Target Devices
Downloads
|
|
|
---|---|---|
Type | Title | Date |
Software & Tools - Software | ZIP 11.59 MB | |
Software & Tools - Software | 简体中文 | |
Software & Tools - Software | 简体中文 | |
Software & Tools - Software | 简体中文 | |
Software & Tools - Software | 简体中文 | |
Software & Tools - Software | 简体中文 | |
Software & Tools - Software | 简体中文 | |
7 items
|
Design & Development
Sample Code
Related Boards & Kits
Evaluation Kit for RA2A1 MCU Group
The EK-RA2A1 evaluation kit enables users to effortlessly evaluate the features of the RA2A1 MCU Group and develop embedded systems applications using Renesas' Flexible Software Package (FSP) and various IDEs.
Getting Started
Running the Quick Start Example Project
- The EK-RA2A1 board comes...
Capacitive Touch Evaluation System for RA2L1
The RA2L1 capacitive touch evaluation system makes it easy for users to evaluate touch solutions offered by Renesas. You can start evaluating immediately out of the box using the board and software included in each kit.
Configuration
- RA2L1 CPU board
- Touch application board
- Self-capacitance...
Evaluation Kit for RA2L1 MCU Group
The EK-RA2L1 evaluation kit enables users to effortlessly evaluate the features of the RA2L1 MCU Group and develop embedded systems applications using Renesas' Flexible Software Package (FSP) and e2 studio IDE. Utilize rich on-board features along with your choice of popular ecosystem add-ons to...
Evaluation Kit for RA2E1 MCU Group
The EK-RA2E1 evaluation kit enables users to effortlessly evaluate the features of the RA2E1 MCU Group and develop embedded systems applications using Renesas' Flexible Software Package (FSP) and e2 studio IDE. Utilize rich on-board features along with your choice of popular ecosystem add-ons to...
Fast Prototyping Board for RA2E1 MCU Group
The RA2E1 Fast Prototyping Board comes equipped with an R7FA2E1A93CFM microcontroller and is an evaluation board specialized for prototype development for a variety of applications. It has a built-in emulator circuit equivalent to an E2 emulator Lite so you can write/debug programs without...
Test This Board Remotely
Evaluation Kit for RA2E2 MCU Group
The EK-RA2E2 evaluation kit enables users to effortlessly evaluate the features of the RA2E2 MCU Group and develop embedded systems applications using Renesas' Flexible Software Package (FSP) and e2 studio IDE. Utilize rich on-board features along with your choice of popular ecosystem add-ons to...
Evaluation Kit for RA4M1 MCU Group
The EK-RA4M1 evaluation kit enables users to effortlessly evaluate the features of the RA4M1 MCU Group and develop embedded systems applications using Renesas' Flexible Software Package (FSP) and various IDEs.
Getting Started
Running the Quick Start Example Project
- The EK-RA4M1 board comes...
Evaluation Kit for RA4M2 MCU Group
The EK-RA4M2 evaluation kit enables users to effortlessly evaluate the features of the RA4M2 MCU Group and develop embedded systems applications using Renesas' Flexible Software Package (FSP) and e2 studio IDE. Utilize rich on-board features along with your choice of popular ecosystem add-ons to...
Evaluation Kit for RA4M3 MCU Group
The EK-RA4M3 evaluation kit enables users to effortlessly evaluate the features of the RA4M3 MCU Group and develop embedded systems applications using Renesas' Flexible Software Package (FSP) and e2 studio IDE. Utilize rich on-board features along with your choice of popular ecosystem add-ons to...
Evaluation Kit for RA4W1 MCU Group
The EK-RA4W1 evaluation kit enables users to effortlessly evaluate the features of the RA4W1 MCU Group and develop embedded systems applications using Renesas' Flexible Software Package (FSP) and various IDEs.
Getting Started
Running the Quick Start Example Project
- Power up the EK-RA4W1 board...
Fast Prototyping Board for RA4E1 MCU Group
The RA4E1 Fast Prototyping Board comes equipped with an R7FA4E10D2CFM microcontroller and is an evaluation board specialized for prototype development for a variety of applications. It has a built-in SEGGER J-Link™ emulator circuit so you can write/debug programs without additional tools. In...
Evaluation Kit for RA6M1 MCU Group
The EK-RA6M1 evaluation kit enables users to effortlessly evaluate the features of the RA6M1 MCU Group and develop embedded systems applications using Renesas' Flexible Software Package (FSP) and various IDEs.
Getting Started
Running the Quick Start Example Project
- The EK-RA6M1 board comes...
Evaluation Kit for RA6M2 MCU Group
The EK-RA6M2 evaluation kit enables users to effortlessly evaluate the features of the RA6M2 MCU Group and develop embedded systems applications using the Flexible Software Package (FSP) and various IDEs.
Getting Started
Running the Quick Start Example Project
- The EK-RA6M2 board comes...
Capacitive Touch Evaluation System for RA6M2
The RA6M2 capacitive touch evaluation system makes it easy for users to evaluate touch solutions offered by Renesas. You can start evaluating immediately out of the box using the board and software included in each kit.
Evaluation Kit for RA6M3 MCU Group
The EK-RA6M3 evaluation kit enables users to seamlessly evaluate the features of the RA6M3 MCU Group and develop embedded systems applications using the Flexible Software Package (FSP) and e2studio IDE. Utilize rich on-board features along with your choice of popular ecosystem add-ons to bring...
Evaluation Kit for RA6M3 MCU Group with Graphics Expansion Boards
The EK-RA6M3G evaluation kit enables users to seamlessly evaluate the features of the RA6M3 MCU Group and develop embedded systems applications using Renesas' Flexible Software Package (FSP) and e2 studio IDE. You can utilize rich on-board features along with your choice of popular ecosystem...
Evaluation Kit for RA6M4 MCU Group
The EK-RA6M4 evaluation kit enables users to effortlessly evaluate the features of the RA6M4 MCU Group and develop embedded systems applications using the Flexible Software Package (FSP) and e2 studio IDE. Utilize rich on-board features along with your choice of popular ecosystem add-ons to...
Evaluation Kit for RA6M5 MCU Group
The EK-RA6M5 evaluation kit enables users to effortlessly evaluate the features of the RA6M5 MCU Group and develop embedded systems applications using the Flexible Software Package (FSP) and e2 studio IDE. Utilize rich on-board features along with your choice of popular ecosystem add-ons to...
Motor Control Evaluation System for RA Family - RA6T1 Group
The Motor Control Evaluation System for RA Family - RA6T1 Group is a low-voltage permanent magnet synchronous motor (brushless DC motor) solution that allows anyone to easily evaluate motor control. Start evaluating motor control immediately using the kit hardware and software available for...
Fast Prototyping Board for RA6E1 MCU Group
The RA6E1 Fast Prototyping Board comes equipped with an R7FA6E10F2CFP microcontroller and is an evaluation board specialized for prototype development for a variety of applications. It has a built-in SEGGER J-Link™ emulator circuit so you can write/debug programs without additional tools. In...
Renesas Flexible Motor Control Kit for RA6T2 MCU Group
The MCK-RA6T2 is a development kit that enables easy evaluation of motor control using permanent magnet synchronous motors (brushless DC motors). With this product and the sample code and QE for Motor that can be downloaded from the website, you can start evaluating motor control using the RA6T2...
Videos & Training
This video shows how to import the Renesas RA Flat project and TrustZone project in e² studio.
e² studio Tips - How to Import Example Project in e² studio for RA
0:00:00 Opening
0:00:14 Flat Project and TrustZone Project
0:00:34 Set up IDE
0:00:54 Download Example Project
0:01:07 Import Flat Project
0:02:44 Import TrustZone Project
0:04:30 e² studio User Guide
Events & Webinars
News & Blog Posts
Blog Post
Nov 15, 2022
|
Blog Post
Apr 28, 2022
|
Blog Post
Jan 28, 2022
|
News
Jun 15, 2021
|
Additional Details
Components
- CMSIS compliant pack files for e2 studio integrated development environment
- BSPs for RA MCUs and boards
- HAL drivers to access peripherals
- Real Time Operating Systems (RTOS)
- Middleware stacks and protocols
- Module configurators and code generators
- Source files to integrate with any development environment and third-party tools
Supported Toolchains
Software components in the FSP support following toolchains:
- e2 studio Integrated Development Environment, with toolchain supports of GCC Arm Embedded and LLVM Embedded Toolchain for Arm
- IAR Embedded Workbench
- Arm Keil MDK
Software Installation Instructions
Refer to the FSP GitHub page for installation and usage instructions: FSP GitHub Instructions
e2 studio Integrated Development Environment
The FSP provides a host of efficiency-enhancing tools for developing projects targeting the Renesas RA series of MCU devices. The e2 studio Integrated Development Environment provides a familiar development cockpit from which the key steps of project creation, module selection and configuration, code development, code generation, and debugging are all managed. FSP uses a Graphical User Interface (GUI) to simplify the selection, configuration, code generation and code development of high level modules and their associated Application Program Interfaces (APIs) to dramatically accelerate the development process.
e2 studio is equipped with set of options to configure various aspects of your application project. Some of these options include:
BSP configuration
Configure or change MCU and board-specific parameters from the initial project selection.
Clock Configuration
Configure the MCU clock settings for your project. The Clock Configuration presents a graphical view of the MCU's clock tree, allowing the various clock dividers and sources to be modified.
Pin Configuration
The Pin Configuration provides flexible configuration of the MCU's pins. This configures the electrical characteristics and functions of each port pin. As many pins are able to provide multiple functions, the pin configurator makes it easy to configure the pins on a peripheral basis. The Pin Configuration tool simplifies the configuration of large packages with highly multiplexed pins by highlighting errors and presenting the options for each pin or for each peripheral.
Module Configuration
The Module Configuration provides options to add FSP modules (HAL drivers, Middleware stacks and RTOS) for RTOS and non-RTOS based applications and configure various parameters of the modules. For each module selected, the Properties window provides access to the configuration parameters, interrupt priorities, pin selections etc.
Interrupt Configuration
Interrupt Configuration allows to add new user interrupts or events and set interrupt priorities. This will also allow the user to bypass a peripheral interrupt and have user-defined ISRs for the peripheral interrupts.
Components Configuration
The Components configuration enables the individual modules required by the application to be included or excluded. All modules that are necessary for the modules added to the application are included automatically. You can easily include or exclude additional modules by ticking the box next to the required component.
QE Tools
QE for Capacitive Touch is an assistance tool for applications which operate under the e2 studio. For the development of embedded systems that work with capacitive touch sensors, this tool simplifies the initial settings of the touch user interface and the tuning of the sensitivity, thus shortening developing times.
The QE for BLE is a dedicated tool for developing embedded software in systems which support the Bluetooth®low energy protocol stack. This solution toolkit runs in the e2 studio integrated development environment. The combination of the e2 studio and QE for BLE makes it easy to test the communications features of Bluetooth®low energy.
Other Tool Features
- Context-sensitive Autocomplete feature that provides intelligent options for completing a programming element
- Developer Assistance tool for selection of and drag and drop placement of API functions directly in application code
- Smart Manual that provides driver and device documentation in the form of tooltips right in the code
- Edit Hover feature to show detailed descriptions of code elements while editing
- Welcome Window with links to example projects, application notes and a variety of other self-help support resources
- Information Icon for each module is provided in the graphic configuration viewer that links to specific design resources for that module in the user manual.
Third Party Tool Support
In addition to the Renesas e2 studio IDE, FSP supports third party tools and IDEs as well. This support is provided through RA Smart configurators (RASC) application. The Renesas RA Smart Configurator is a desktop application that allows you to configure the software system (BSP, drivers, RTOS and middleware) for a Renesas RA microcontroller when using a 3rd-party IDE and toolchain. The RA Smart Configurator can currently be used with IAR Embedded Workbench, Keil MDK and the Arm compiler 6 toolchains.