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RA Flexible Software Package (FSP)

Software Package

Renesas Flexible Software Package (FSP) v6.2.0 User's ManualRenesas Flexible Software Package (FSP) User's Manual (Web Version - HTML)

Overview

The Renesas Flexible Software Package (FSP) is an enhanced software package designed to deliver user-friendly, scalable, high-quality software for embedded system designs using the Renesas RA family of Arm Microcontrollers, ensuring software compatibility across the RA family, from entry-level to high-performance microcontrollers. With the support of new Arm® TrustZone® and other advanced security features, FSP provides a quick and versatile way to build secure, connected IoT devices using production-ready drivers, Azure® RTOS, FreeRTOS™, and other middleware stacks.

download Download Latest FSP (v6.2.0):

FSP Platform Installer (Includes e² studio IDE, toolchain, and FSP packs):

RA Smart Configurator (RASC) Installer (FSP packages to use with 3rd party IDEs with IAR Embedded Workbench, Arm Keil MDK):

FSP Standalone Installer (FSP packs for the users who only update the FSP and no e² studio update):

  • Download from the Assets section of the GitHub

The installation instructions can be found here. All the FSP Releases and Patches can be found on GitHub.

FSP includes best-in-class HAL drivers with high performance and low memory footprint. Middleware stacks with Azure RTOS and FreeRTOS integration are included to ease the implementation of complex modules like communication and security. The e² studio IDE provides support with intuitive configurators and intelligent code generation to make programming and debugging easier and faster.

FSP uses an open software ecosystem and provides flexibility in using bare-metal programming, including Azure RTOS or FreeRTOS, your preferred RTOS, legacy code, and third-party ecosystem solutions. FSP and e² studio can be used free of charge on any Renesas device.

RA Flexible Software Package (FSP)
  • Multi-Core and Single Core support of Arm® Cortex®- M-based RA MCUs
  • Small memory footprint HAL drivers
  • Intuitive configurator and code generator
  • Static and dynamic analysis using industry-standard tools
  • Application support using RTOS and non-RTOS environments
  • Azure RTOS and its middleware stacks with Flexible Software Package
    • Azure RTOS ThreadX, NetX Duo & Add-ons, USBX, GUIX & GUIX Studio, FileX, TraceX, exFAT, LevelX, NetX Duo Secure & NetX Crypto (HW acceleration)
  • FreeRTOS support – Includes Kernel and set of software libraries
    • FreeRTOS Kernel, FreeRTOS-Plus-TCP, Core MQTT, Core HTTP/HTTPS, Task pool, Secure Sockets, Cellular Interface
  • Tool configurable RTOS resources (Threads, mutexes, etc.)
  • Middleware stacks from Renesas and third parties
    • Ethos-U55 support for CM85 based MCUs for efficient AI/ML integration
    • TCP/IP and other connectivity protocol stacks including MQTT
    • USB middleware support for CDC, HID, and MSC
    • Wireless connectivity through Cellular (Cat-M1), Wi-Fi, and Bluetooth Low Energy LE 5.0 (BLE Mesh)
    • File System support with FreeRTOS+FAT and LittleFS
    • Storage (Block Media) support for SDMMC, SPI, and USB.
    • Virtual EEPROM on Flash
    • Capacitive touch middleware to implement widgets like Button, Slider, and Wheels.
    • Motor control algorithms
    • Secure Bootloader through MCUboot
    • Sensor Module APIs
  • TrustZone support (for applications on CM33-based MCUs)
    • TrustZone enabled drivers and middleware
    • Easy-to-use tool support for TrustZone configuration
  • PSA Level 2 Certified
  • AWS qualified for FreeRTOS
  • Easy connectivity options to major cloud providers
  • Secure connections through NetX Duo Secure and Mbed TLS
  • Cryptographic APIs and integrated Hardware Acceleration support
    • Arm PSA Cryptographic APIs
    • Azure RTOS NetX Crypto APIs
    • Ultimate security with FSP Crypto APIs (SCE9 protected mode)
    • Oberon Ocrypto targeting low end RA2E1 devices
    • TinyCrypt targeting constrained devices
  • Graphics interface support and tools
    • LVGL integration support for RA devices
    • Segger emWin (RA customers can use Segger emWin graphic tools and libraries for free from Downloads below)
    • Azure RTOS GUIX and GUIX Studio (available free on Microsoft Apps Store)
  • Secure debugging capabilities
  • Extensive tool support from Renesas and leading third-party solutions
  • Integrated package with all required components for easy setup and starting development (single installer with e2 studio, CMSIS packs, toolchain, and Segger J-Link drivers)
  • Complete source code available through GitHub

For additional information and links, go to GitHub.

v6.2.0

Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 6.2.0

Minimum e2 studio version for FSP 6.2.0 is e2 studio 2025-10

If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator (RASC) for this release.

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

New Features

  • Added support for RA8D2 devices
    • Includes EK-RA8D2 board support
  • Added support for RA8M2 devices
    • Includes EK-RA8M2 board support
  • Added support for 303 pin devices of RA8M2, RA8D2, RA8P1, and RA8T2
  • Added support for running NetX Duo using Ethernet drivers without zero-copy (including r_rmac)
  • This feature has limited performance and is only meant to supplement Ethernet drivers that may not have zero-copy functionality available immediately.
  • R_SCI_B_SPI: Added support for receive sampling timing adjustment and FIFO mode with DTC/DMAC
  • Added timestamp function support for r_rmac
  • Added zero-copy Ethernet support for RA8M2, RA8D2, RA8T2, and RA8P1
  • Added DMAC support for r_spi_b
  • Added BSP configuration options under 'I/O Ports|Voltage Mode' which configure I/O ports based on VCC and VCC2 voltage levels
    • Applicable to RA8 devices, which provide the Low Voltage Operation Control Register (LVOCR)
  • Added ECC support to r_mram
  • Added third-party libraries for LVGL
  • Added support for NetxDuo Ethernet zerocopy feature on RA8M2, RA8D2, RA8T2 and RA8P1
  • Added USB HAUD support for BareMetal and FreeRTOS
  • Added ChaCha20-Poly1305 feature for RSIP-E50D Protected Mode driver
  • Updated CAVP certified module for RSIP-E51A Protected Mode driver due to re-acquisition of CAVP certification
  • Added support for Post Quantum Crypto (PQC) ML-DSA-44 and ML-DSA-65 key generation, signing and verification
  • Added SHA-3 feature for RSIP-E50D PM driver
  • Added Frame Replication and Elimination Support for Reliability (FRER) feature for Ethernet on RA8M2, RA8D2, RA8T2, and RA8P1
  • Added KDF-HMAC feature for RSIP-E31A PM driver
  • Added new FSP Solution Templates for supported RTOS
  • Added HMAC-SHA 512/224 and 512/256 features for RSIP-E31A PM driver

Fixes and Improvements

  • Updated VBAT voltage threshold value for RA4C1 in r_lvd module
  • Fixed an RSA-related warning in rm_netx_crypto on RA8E2 devices
  • Fixed rm_littlefs_flash build failure on r_mram
  • Updated PQC to use PSA SHA3 APIs
    • Added SHA3 HW Acceleration for E50D devices
  • Updated solution project templates to use new hal_warmstart.c
  • Fixed possible infinite register wait loop in r_agt when an AGT interrupt occurs while executing an AGT driver function and the driver is in one-shot mode
  • Platform installer updated to include e2 studio 2025-10
  • Updated symbolic names of LED pins for FPB-RA8E1
  • Improved SCI LIN auto synchronization bitrate tolerance to ± 14%
  • AES code size reduction for RSIP-E31A PM driver
  • Improved ECDSA P-512 performance for RSIP-E51A and RSIP-E50D PM driver
  • Fixed USB HCDC-ECM initializaztion error
  • Fixed incorrect setting of PLL Multipliers above 255.66x via r_cgc
  • Updated Usage Notes and constraints for using MbedTLS with lwIP HTTP and MQTT applications
  • Updated display and tooltip of Clocks for RA0 MCUs
  • Fixed LLVM build issue in LwIP HTTPS server when using mbedTLS
  • Reduced code size of ECDSA verification feature for RSIP-E31A Protected Mode driver
  • Fixed potential hang in multicore project boot code on devices with NPU
  • Removed padding from OSIS region that could result in out-of-bounds SREC data
  • Fixed an issue in KDF-SHA feature for RSIP-E11A where the generated DKM was incorrect when the input message length was 55 bytes
  • FSP Common API updated to v1.14.0
  • Support Multiple Interfaces for lwIP TCP/IP
  • Restricted FSP Blinky Solution Templates to RA development boards
  • Fixed a few constraint-message references of r_vin
  • Updated R_ADC_D_SnoozeModePrepare to set the ADM0.ADCE bit after setting the ADM2.AWC bit
  • Segger JLink version updated to 8.74

Known Issues

  • RA0E1:
    • e2 studio projects automatically reset compiler optimization to a Size setting on every generate or build operation
    • Add optimization flags (e.g. -O0) manually to 'Other optimization flags' to override the -Oz setting
    • HS400x and ZMOD4xxx sensors cannot be used on RA0E1
    • FS3000 sensor does not support SAU-I2C driver
  • Selecting 'Safely Remove Hardware and Eject Media' on Windows and eject the mass storage (PMSC), when
    using USBX composite device (PCDC+PMSC), the Windows Explorer for PMSC does not disappear.
  • PMSC may not work properly when USBX Composite Device (PCDC+PMSC) is connected to specific Linux OS
    (USB Host).
  • EWARM version 9.70.1 does not contain support for RA0L1, RA2T1, RA4C1, RA8D2, RA8M2, RA8P1 and RA8T2. To develop with IAR for these devices, it is necessary to install a support patch file for which can be downloaded by EWARM v9.70.1 users from the IAR MyPages system
    • RA0L1 (arm_Renesas_RA0L1_20250305_1.zip)
    • RA2T1 (arm_Renesas_RA2T1_20250714_1.zip)
    • RA4C1 (arm_Renesas_RA4C1_20250213_1.zip)
    • RA8D2 (patches_2025-05-30_RA8D2-M2.zip)
    • RA8M2 (patches_2025-05-30_RA8D2-M2.zip)
    • RA8P1 (arm_Renesas_RA8P1_20250530_1.zip)
    • RA8T2 (arm_Renesas_RA8T2_20250530_1.zip)
  • Due to limitations in RASC, Projects fail to build if there are files with the same name in a build group. To fix this issue, create files with the same name in different build groups. For known issues in the tools, please refer to the respective tool's release notes, e2 studio RN

Deprecations

  • r_sci_b_lin: Enum SCI_LIN_COMPARE_DATA_SELECT_PRIORITY is now deprecated; use SCI_LIN_COMPARE_DATA_SELECT_PRIMARY instead.

Visit GitHub Issues for this project.

Downloads

Documentation

Design & Development

Note: Separate installation of e² studio is not required for FSP, as the FSP Platform Installer installs e² studio and all other tools required to use FSP.

 

Support

Support Communities

Support Communities

Get quick technical support online from Renesas Engineering Community technical staff.
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Browse FAQs

FAQs

Browse our knowledge base of common questions and answers.
Browse FAQs
Submit a Ticket

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Resources

Videos & Training

This video shows how to import the Renesas RA Flat project and TrustZone project in e² studio.

e² studio Tips - How to Import Example Project in e² studio for RA
0:00:00 Opening
0:00:14 Flat Project and TrustZone Project
0:00:34 Set up IDE
0:00:54 Download Example Project
0:01:07 Import Flat Project
0:02:44 Import TrustZone Project
0:04:30 e² studio User Guide

Events & Webinars

News & Blog Posts

Blog Post
Nov 15, 2022
Three Reasons You'll Want to Use Our Flexible Software Package for Your IoT Designs
Blog Post
Apr 28, 2022
Arm Cortex-M85 Is Here, Is Your IoT Design Ready?
Blog Post
Jan 28, 2022
The RA MCU Family is Made to Help Solve Your Design Challenges
Blog Post
Jan 28, 2022
Get Where You’re Going with the Official Renesas RA Family Guide
News
Jun 15, 2021
Renesas Extends Support for Microsoft Azure RTOS Across 32-bit MCU Families with Simple Licensing for Secure Embedded IoT Development

Additional Details

Components

  • CMSIS compliant pack files for e2 studio integrated development environment
  • BSPs for RA MCUs and boards
  • HAL drivers to access peripherals
  • Real Time Operating Systems (RTOS)
  • Middleware stacks and protocols
  • Module configurators and code generators
  • Source files to integrate with any development environment and third-party tools

Supported Toolchains

Software components in the FSP support following toolchains:

  • e2 studio Integrated Development Environment, with toolchain supports of GCC Arm Embedded and LLVM Embedded Toolchain for Arm
  • IAR Embedded Workbench
  • Arm Keil MDK

Software Installation Instructions

Refer to the FSP GitHub page for installation and usage instructions: FSP GitHub Instructions

e2 studio Integrated Development Environment

The FSP provides a host of efficiency-enhancing tools for developing projects targeting the Renesas RA series of MCU devices. The e2 studio Integrated Development Environment provides a familiar development cockpit from which the key steps of project creation, module selection and configuration, code development, code generation, and debugging are all managed. FSP uses a Graphical User Interface (GUI) to simplify the selection, configuration, code generation and code development of high level modules and their associated Application Program Interfaces (APIs) to dramatically accelerate the development process.

e2 studio is equipped with set of options to configure various aspects of your application project. Some of these options include:

BSP configuration

Configure or change MCU and board-specific parameters from the initial project selection.

Clock Configuration

Configure the MCU clock settings for your project. The Clock Configuration presents a graphical view of the MCU's clock tree, allowing the various clock dividers and sources to be modified.

Pin Configuration

The Pin Configuration provides flexible configuration of the MCU's pins. This configures the electrical characteristics and functions of each port pin. As many pins are able to provide multiple functions, the pin configurator makes it easy to configure the pins on a peripheral basis. The Pin Configuration tool simplifies the configuration of large packages with highly multiplexed pins by highlighting errors and presenting the options for each pin or for each peripheral.

Module Configuration

The Module Configuration provides options to add FSP modules (HAL drivers, Middleware stacks and RTOS) for RTOS and non-RTOS based applications and configure various parameters of the modules. For each module selected, the Properties window provides access to the configuration parameters, interrupt priorities, pin selections etc.

Interrupt Configuration

Interrupt Configuration allows to add new user interrupts or events and set interrupt priorities. This will also allow the user to bypass a peripheral interrupt and have user-defined ISRs for the peripheral interrupts.

Components Configuration

The Components configuration enables the individual modules required by the application to be included or excluded. All modules that are necessary for the modules added to the application are included automatically. You can easily include or exclude additional modules by ticking the box next to the required component.

QE Tools

QE for Capacitive Touch is an assistance tool for applications which operate under the e2 studio. For the development of embedded systems that work with capacitive touch sensors, this tool simplifies the initial settings of the touch user interface and the tuning of the sensitivity, thus shortening developing times.

The QE for BLE is a dedicated tool for developing embedded software in systems which support the Bluetooth®low energy protocol stack. This solution toolkit runs in the e2 studio integrated development environment. The combination of the e2 studio and QE for BLE makes it easy to test the communications features of Bluetooth®low energy.

Other Tool Features

  • Context-sensitive Autocomplete feature that provides intelligent options for completing a programming element
  • Developer Assistance tool for selection of and drag and drop placement of API functions directly in application code
  • Smart Manual that provides driver and device documentation in the form of tooltips right in the code
  • Edit Hover feature to show detailed descriptions of code elements while editing
  • Welcome Window with links to example projects, application notes and a variety of other self-help support resources
  • Information Icon for each module is provided in the graphic configuration viewer that links to specific design resources for that module in the user manual.

Third Party Tool Support

In addition to the Renesas e2 studio IDE, FSP supports third party tools and IDEs as well. This support is provided through RA Smart configurators (RASC) application. The Renesas RA Smart Configurator is a desktop application that allows you to configure the software system (BSP, drivers, RTOS and middleware) for a Renesas RA microcontroller when using a 3rd-party IDE and toolchain. The RA Smart Configurator can currently be used with IAR Embedded Workbench, Keil MDK and the Arm compiler 6 toolchains.