Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | WAFER |
| Pkg. Code: | DICEW |
| Lead Count (#): | |
| Pkg. Dimensions (mm): | 0.0 x 0.0 x 0.0 |
| Pitch (mm): |
Environmental & Export Classifications
| Moisture Sensitivity Level (MSL) | 1 |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) | 8542.39.0090 |
Product Attributes
| Pkg. Type | WAFER |
| Lead Count (#) | 0 |
| Carrier Type | WFP |
| Moisture Sensitivity Level (MSL) | 1 |
| Pkg. Dimensions (mm) | 0.0 x 0.0 x 0.0 |
| Pb (Lead) Free | Yes |
| Pb Free Category | e3 Sn |
| Temp. Range (°C) | 0 to 70°C |
| Country of Wafer Fabrication | TAIWAN |
| Adj. Analog Gain | 1.32 - 540 |
| Automotive Qual. | No |
| Description | Die on Tray, Waffle Pack |
| Function | Resistive SSC |
| Input Type | Dual-bridge |
| Interface | I2C, SPI, Alarm, Ratiometric Voltage, Absolute Voltage, Current Loop, OWI, PWM, 2xPDM, 2xPWM |
| MOQ | 50 |
| Qty. per Carrier (#) | 0 |
| Qty. per Reel (#) | 0 |
| Qualification Level | Standard |
| Resolution (bits) | 24 |
| Sample Rate Max (KHz) | 2.91 |
| Supply Voltage (V) | 1.8 - 48 |
| Tape & Reel | No |
Resources for ZSSC3286
Description
The ZSSC3286 is a dual path sensor signal conditioning IC (SSC) for highly accurate amplification, digitization, and sensor-specific correction of sensor signals. The ZSSC3286 supports IO-Link connectivity with an integrated IO-Link stack running the IO-Link Smart Sensor Profile for digital measuring and switching sensors. The device is suitable for bridge and half-bridge sensors, as well as external voltage source elements. Digital compensation of the sensor offset, sensitivity, temperature drift, and non-linearity is accomplished via a 32-bit Arm® based math core running a correction algorithm with calibration coefficients stored in a non-volatile, reprogrammable memory. The programmable, integrated sensor front-end allows optimally applying various sensors for a broad range of applications.