Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | WAFER |
| Pkg. Code: | DICE |
| Lead Count (#): | |
| Pkg. Dimensions (mm): | 0.0 x 0.0 x 0.0 |
| Pitch (mm): |
Environmental & Export Classifications
| Moisture Sensitivity Level (MSL) | 1 |
| Pb (Lead) Free | Yes |
| ECCN (US) | EAR99 |
| HTS (US) | 8542.39.0090 |
Product Attributes
| Lead Count (#) | 0 |
| Carrier Type | Wafer |
| Moisture Sensitivity Level (MSL) | 1 |
| Qty. per Reel (#) | 0 |
| Pkg. Dimensions (mm) | 0.0 x 0.0 x 0.0 |
| Pb (Lead) Free | Yes |
| Pb Free Category | e3 Sn |
| Temp. Range (°C) | -40 to +85°C |
| Country of Wafer Fabrication | TAIWAN |
| Adj. Analog Gain | 30 |
| Automotive Qual. | No |
| Function | Capacitive SSC |
| Input Type | Single-capacitor |
| Interface | I2C, PDM, Alarm |
| MOQ | 21787 |
| Pkg. Type | WAFER |
| Published | No |
| Qty. per Carrier (#) | 0 |
| Qualification Level | Standard |
| Requires Terms and Conditions | Does not require acceptance of Terms and Conditions |
| Resolution (bits) | 18 |
| Sample Rate Max (KHz) | 0.55 |
| Supply Voltage (V) | 1.68 - 3.6 |
| Tape & Reel | No |
Resources for ZSSC3230
Description
The ZSSC3230 is a CMOS integrated circuit for accurate capacitance-to-digital conversion and sensor-specific correction of capacitive sensor signals. Digital compensation of sensor offset, sensitivity, and temperature drift is accomplished via an internal digital signal processor running a correction algorithm with calibration coefficients stored in a non-volatile, multiple-time programmable (MTP) memory. Programming the ZSSC3230 is simple via the serial interface. The interface is used for the PC-controlled calibration procedure, which programs the set of calibration coefficients in memory. The ZSSC3230 is configurable for capacitive sensors with capacitances up to 30pF and will provide a scalable up to 18-bit output resolution. It is compatible with single-ended capacitive sensors. Measured and corrected sensor values can be output as I²C (≤ 3.4MHz).
The ZSSC3230 provides accelerated signal processing, increased resolution, and improved noise immunity to support high-speed control, safety, and real-time sensing applications with the highest requirements for energy efficiency.