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Automotive Sensor Signal Conditioner with LIN and PWM Interface

Package Information

CAD Model:View CAD Model
Pkg. Type:WAFER
Pkg. Code:DICEF
Lead Count (#):
Pkg. Dimensions (mm):0.0 x 0.0 x 0.0
Pitch (mm):

Environmental & Export Classifications

Moisture Sensitivity Level (MSL)1
Pb (Lead) FreeYes
ECCN (US)EAR99
HTS (US)8542.39.0090

Product Attributes

Lead Count (#)0
Carrier TypeWafer
Moisture Sensitivity Level (MSL)1
Pkg. Dimensions (mm)0.0 x 0.0 x 0.0
Qty. per Reel (#)0
Qty. per Carrier (#)0
Pb (Lead) FreeYes
Pb Free Categorye3 Sn
Temp. Range (°C)-40 to +125°C
Country of Wafer FabricationGERMANY
Adj. Analog Gain3 - 3, 7 - 7, 9 - 9, 14 - 14, 26 - 26, 35 - 35, 52 - 52, 70 - 70, 105 - 105, 140 - 140, 210 - 210, 280 - 280, 420 - 420
Automotive Qual.Yes
FunctionResistive SSC
Input TypeSingle-bridge
InterfacePWM, LIN
MOQ2300
Pkg. TypeWAFER
PublishedNo
Qualification LevelAutomotive
Requires Terms and ConditionsDoes not require acceptance of Terms and Conditions
Resolution (bits)14
Sample Rate Max (KHz)0.43
Supply Voltage (V)7 - 18
Tape & ReelNo

Description

The ZSSC3170 is a CMOS integrated circuit for highly accurate amplification and sensor-specific correction of bridge sensor signals. Featuring a maximum analog gain of 420, as well as extended offset compensation capabilities, the ZSSC3170 is adjustable to nearly all resistive bridge sensor types. Digital compensation of offset, sensitivity, temperature drift, and nonlinearity is accomplished via a 16-bit RISC microcontroller. Conditioning coefficients are stored in an EEPROM certified for automotive applications. Measured values are provided by one of the digital LIN or PWM interfaces. Each interface can support end-of-line calibration using the sensor output. Noise sensitivity is greatly reduced because the calibration equipment and the ZSSC3170 are mated digitally. For quick and easy evaluation and support for calibrating prototypes, IDT offers the ZSSC3170 SSC Evaluation Kit, which includes evaluation hardware, SSOP20 samples, and software.