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Automotive Sensor Signal Conditioner with LIN and PWM Interface

Package Information

CAD Model: View CAD Model
Pkg. Type: WAFER
Pkg. Code: DICE
Lead Count (#):
Pkg. Dimensions (mm): 0.0 x 0.0 x 0.0
Pitch (mm):

Environmental & Export Classifications

Moisture Sensitivity Level (MSL) 1
Pb (Lead) Free Yes
ECCN (US) EAR99
HTS (US) 8542.39.0090

Product Attributes

Lead Count (#) 0
Carrier Type Wafer
Moisture Sensitivity Level (MSL) 1
Pkg. Dimensions (mm) 0.0 x 0.0 x 0.0
Qty. per Reel (#) 0
Qty. per Carrier (#) 0
Pb (Lead) Free Yes
Pb Free Category e3 Sn
Temp. Range (°C) -40 to +125°C
Country of Wafer Fabrication GERMANY
Adj. Analog Gain 3 - 3, 7 - 7, 9 - 9, 14 - 14, 26 - 26, 35 - 35, 52 - 52, 70 - 70, 105 - 105, 140 - 140, 210 - 210, 280 - 280, 420 - 420
Automotive Qual. Yes
Function Resistive SSC
Input Type Single-bridge
Interface PWM, LIN
MOQ 2300
Pkg. Type WAFER
Published No
Qualification Level Automotive
Requires Terms and Conditions Does not require acceptance of Terms and Conditions
Resolution (bits) 14
Sample Rate Max (KHz) 0.43
Supply Voltage (V) 7 - 18
Tape & Reel No

Description

The ZSSC3170 is a CMOS integrated circuit for highly accurate amplification and sensor-specific correction of bridge sensor signals. Featuring a maximum analog gain of 420, as well as extended offset compensation capabilities, the ZSSC3170 is adjustable to nearly all resistive bridge sensor types. Digital compensation of offset, sensitivity, temperature drift, and nonlinearity is accomplished via a 16-bit RISC microcontroller. Conditioning coefficients are stored in an EEPROM certified for automotive applications. Measured values are provided by one of the digital LIN or PWM interfaces. Each interface can support end-of-line calibration using the sensor output. Noise sensitivity is greatly reduced because the calibration equipment and the ZSSC3170 are mated digitally. For quick and easy evaluation and support for calibrating prototypes, IDT offers the ZSSC3170 SSC Evaluation Kit, which includes evaluation hardware, SSOP20 samples, and software.