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Sensor Signal Conditioner for Piezoresistive Bridge Sensors

Package Information

CAD Model: View CAD Model
Pkg. Type: WAFER
Pkg. Code: DICE
Lead Count (#):
Pkg. Dimensions (mm): 0.0 x 0.0 x 0.0
Pitch (mm):

Environmental & Export Classifications

Moisture Sensitivity Level (MSL) 1
Pb (Lead) Free Yes
ECCN (US)
HTS (US)

Product Attributes

Lead Count (#) 0
Carrier Type Wafer
Moisture Sensitivity Level (MSL) 1
Pkg. Dimensions (mm) 0.0 x 0.0 x 0.0
Qty. per Reel (#) 0
Qty. per Carrier (#) 0
Pb (Lead) Free Yes
Pb Free Category e3 Sn
Temp. Range (°C) -40 to 150°C
Country of Wafer Fabrication GERMANY
Adj. Analog Gain 3 - 3, 7 - 7, 9 - 9, 14 - 14, 26 - 26, 35 - 35, 52 - 52, 70 - 70, 105 - 105
Automotive Qual. Yes
Function Resistive SSC
Input Type Single-bridge
Interface Ratiometric Voltage, ZACwire™, I2C
MOQ 2800
Pkg. Type WAFER
Published No
Qualification Level Automotive
Requires Terms and Conditions Does not require acceptance of Terms and Conditions
Resolution (bits) 14
Sample Rate Max (KHz) 0.2
Supply Voltage (V) 4.5 - 5.5
Tape & Reel No

Description

The ZSSC3135 is a member of the ZSSC313x product family of CMOS integrated circuits designed for automotive and industrial sensor applications. All family members are well suited for highly accurate amplification and sensor-specific correction of resistive bridge sensor signals. An internal 16-bit RISC microcontroller running a correction algorithm compensates sensor offset, sensitivity, temperature drift, and nonlinearity of the connected sensor element. The required calibration coefficients are stored by the single-pass calibration procedure in an on-chip EEPROM. The ZSSC3135 is specially designed for piezoresistive bridge sensor elements. The amplification stage with an analog gain of 105 in combination with the optional temperature compensation using an external temperature sensor fits the requirements of piezoresistive sensor applications perfectly.