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Low-Power, High-Resolution 16-Bit Sensor Signal Conditioner

Package Information

CAD Model: View CAD Model
Pkg. Type: WAFER
Pkg. Code: DICE
Lead Count (#):
Pkg. Dimensions (mm): 0.0 x 0.0 x 0.0
Pitch (mm):

Environmental & Export Classifications

Moisture Sensitivity Level (MSL) 1
Pb (Lead) Free Yes
ECCN (US) EAR99
HTS (US) 8542.39.0090

Product Attributes

Lead Count (#) 0
Carrier Type Wafer
Moisture Sensitivity Level (MSL) 1
Pb (Lead) Free Yes
Pb Free Category e3 Sn
Temp. Range (°C) -40 to +85°C
Country of Wafer Fabrication TAIWAN
Adj. Analog Gain 13.2 - 72
Automotive Qual. No
Function Resistive SSC
Input Type Single-bridge
Interface I2C, SPI
MOQ 17000
Pkg. Dimensions (mm) 0.0 x 0.0 x 0.0
Pkg. Type WAFER
Published No
Qty. per Carrier (#) 0
Qty. per Reel (#) 0
Qualification Level Standard
Requires Terms and Conditions Does not require acceptance of Terms and Conditions
Resolution (bits) 16
Sample Rate Max (KHz) 0.33
Supply Voltage (V) 1.8 - 3.6
Tape & Reel No

Description

The ZSSC3036 is a sensor signal conditioner (SSC) integrated circuit for high-accuracy amplification and analog-to-digital conversion of a differential input signal. Designed for high-resolution altimeter module applications, the ZSSC3036 can perform offset, span, and 1st and 2nd order temperature compensation of the measured signal. Developed for correction of resistive bridge sensors, it can also provide a corrected temperature output measured with an internal sensor. The measured and corrected bridge values are provided at the digital output pins, which can be configured as I2C (≤ 3.4MHz) or SPI (≤ 20MHz). Digital compensation of signal offset, sensitivity, temperature, and non-linearity is accomplished via an 18-bit internal digital signal processor (DSP) run