Skip to main content
576M-BIT Low Latency DRAM Common I/O

Package Information

CAD Model:View CAD Model
Pkg. Type:TFBGA
Pkg. Code:pkg_11760
Lead Count (#):144
Pkg. Dimensions (mm):18.5 x 11 x 1.2
Pitch (mm):

Environmental & Export Classifications

RoHS (UPD48576236F1-E24-DW1-A)EnglishJapanese
Moisture Sensitivity Level (MSL)3
Pb (Lead) FreeYes
ECCN (US)
HTS (US)

Product Attributes

Pkg. TypeTFBGA
Carrier TypeTray
ArchitectureLow Latency DRAM-II
Burst Length (Words)2
Data Width (bits)36000
Density (Kb)576000
Frequency (Max) (MHz)400
I/O Voltage (V)1.5 - 1.5
Lead CompliantYes
Lead Count (#)144
Length (mm)18
MIN Frequency (MHz)175
MOQ1
Moisture Sensitivity Level (MSL)3
Pb (Lead) FreeYes
Pkg. Dimensions (mm)18 x 11 x 1.2
Supply Voltage (V)1.8 - 1.8
Tape & ReelNo
Thickness (mm)1.2
Width (mm)11
tRC (ns)15

Description

The µPD48576209F1 is a 67, 108, 864-word by 9 bit, the µPD48576218F1 is a 33, 554, 432 word by 18 bit and the µPD48576236F1 is a 16, 777, 216 word by 36 bit synchronous double data rate Low Latency RAM fabricated with advanced CMOS technology using one-transistor memory cell. The µPD48576209F1, µPD48576218F1 and µPD48576236F1 integrate unique synchronous peripheral circuitry and a burst counter. All input registers controlled by an input clock pair (CK and CK#) are latched on the positive edge of CK and CK#. These products are suitable for application which require synchronous operation, High-Speed, low voltage, high density and wide bit configuration.