Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | T-TFBGA |
| Pkg. Code: | pkg_8330 |
| Lead Count (#): | 144 |
| Pkg. Dimensions (mm): | 18.5 x 11 x 1.17 |
| Pitch (mm): |
Environmental & Export Classifications
| RoHS (UPD48288118AFF-E18-DW1-A) | EnglishJapanese |
| Moisture Sensitivity Level (MSL) | |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
Product Attributes
| Pkg. Type | T-TFBGA |
| Carrier Type | Tray |
| Architecture | Low Latency DRAM-II |
| Burst Length (Words) | 2 |
| Data Width (bits) | 18000 |
| Density (Kb) | 288000 |
| Frequency (Max) (MHz) | 533 |
| I/O Voltage (V) | 1.5 - 1.5 |
| Lead Compliant | Yes |
| Lead Count (#) | 144 |
| Length (mm) | 18 |
| MIN Frequency (MHz) | 175 |
| MOQ | 1 |
| Pb (Lead) Free | Yes |
| Pkg. Dimensions (mm) | 18 x 11 x 1.17 |
| Supply Voltage (V) | 1.8 - 1.8 |
| Tape & Reel | No |
| Thickness (mm) | 1.17 |
| Width (mm) | 11 |
| tRC (ns) | 15 |
Resources for UPD48288118AFF-E18-DW1-A
Description
Support is limited to customers who have already adopted these products.
Low Latency DRAM is our newest large-density memory boasting high performance. Incorporating high-performance technology used in our synchronous SRAM and the pseudo-SRAM technology used in mobile-specified RAM, Low Latency DRAM is ideal for use in various networking applications. With a Fast random access time-and data latency lower than other DRAM products-Low Latency DRAM realizes extremely high performance compared to commodity DRAM. Those features, combined with large density and lower cost per bit compared to SRAM solutions make Low Latency DRAM an attractive choice for use in next-generation, high-performance networking products.