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Renesas Electronics Corporation
Host Bridge

Package Information

CAD Model:View CAD Model
Pkg. Type:FCBGA
Pkg. Code:HM1023
Lead Count (#):1023
Pkg. Dimensions (mm):33.0 x 33.0 x 2.0
Pitch (mm):1

Environmental & Export Classifications

Pb (Lead) FreeNo
Moisture Sensitivity Level (MSL)4
ECCN (US)
HTS (US)

Product Attributes

Lead Count (#)1023
Pb (Lead) FreeNo
Carrier TypeTray
DRAM I/FDDR2-333 MHz
Length (mm)33
MOQ48
Moisture Sensitivity Level (MSL)4
PCI Bus133MHz/64-bit PCI-X
Package Area (mm²)1089
Pb Free Categorye0
Pitch (mm)1
Pkg. Dimensions (mm)33.0 x 33.0 x 2.0
Pkg. TypeFCBGA
Power Consumption Max (W)2.27
Processor BusPowerPC 7xx/7448 -167MHz
Qty. per Carrier (#)24
Qty. per Reel (#)0
Requires Terms and ConditionsDoes not require acceptance of Terms and Conditions
Tape & ReelNo
Temp. Range (°C)0 to 70°C
Thickness (mm)2
Width (mm)33

Description

The TSI110 is a low-cost PowerPC interconnect device that bridges PCI/X, DDR2 SDRAM, Gigabit Ethernet, and Flash. The integrated features of the TSI110 serve to reduce the number of components in a system, resulting in significantly lower system cost, power, and design complexity. It is well suited for a variety of applications, including entry-level router and storage, consumer appliance, set-top box, video surveillance, video/IP, and printers.