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Host Bridge

Package Information

CAD Model: View CAD Model
Pkg. Type: FCBGA
Pkg. Code: HC503
Lead Count (#): 503
Pkg. Dimensions (mm): 33.0 x 33.0 x 2.75
Pitch (mm): 1.27

Environmental & Export Classifications

Pb (Lead) Free No
Moisture Sensitivity Level (MSL) 3
ECCN (US)
HTS (US)

Product Attributes

Pkg. Type FCBGA
Lead Count (#) 503
Pb (Lead) Free No
Carrier Type Tray
DRAM I/F SDRAM - 133MHz
Length (mm) 33
MOQ 48
Moisture Sensitivity Level (MSL) 3
PCI Bus 66MHz/64 bit PCI
Package Area (mm²) 1089
Pb Free Category e0
Pitch (mm) 1.27
Pkg. Dimensions (mm) 33.0 x 33.0 x 2.75
Power Consumption Max (W) 2.5
Processor Bus PowerPC (MPC7xx)-100MHz
Published No
Qty. per Carrier (#) 24
Qty. per Reel (#) 0
Requires Terms and Conditions Does not require acceptance of Terms and Conditions
Tape & Reel No
Temp. Range (°C) 0 to 105°C
Thickness (mm) 2.75
Width (mm) 33

Description

The TSI107 Host Bridge for PowerPC provides system interconnect between PowerPC processors, PCI peripherals, and local memory. The TSI107 provides many of the other necessities for embedded applications, including a high-performance memory controller and dual processor support; two-channel flexible DMA controller, an interrupt controller, an I2O-ready message unit, an inter-integrated circuit controller (I2C), and low-skew clock drivers.