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Renesas Electronics Corporation
Host Bridge

Package Information

CAD Model:View CAD Model
Pkg. Type:FCBGA
Pkg. Code:HC503
Lead Count (#):503
Pkg. Dimensions (mm):33.0 x 33.0 x 2.75
Pitch (mm):1.27

Environmental & Export Classifications

Pb (Lead) FreeNo
Moisture Sensitivity Level (MSL)3
ECCN (US)
HTS (US)

Product Attributes

Pkg. TypeFCBGA
Lead Count (#)503
Pb (Lead) FreeNo
Carrier TypeTray
DRAM I/FSDRAM - 133MHz
Length (mm)33
MOQ48
Moisture Sensitivity Level (MSL)3
PCI Bus66MHz/64 bit PCI
Package Area (mm²)1089
Pb Free Categorye0
Pitch (mm)1.27
Pkg. Dimensions (mm)33.0 x 33.0 x 2.75
Power Consumption Max (W)2.5
Processor BusPowerPC (MPC7xx)-100MHz
Qty. per Carrier (#)24
Qty. per Reel (#)0
Requires Terms and ConditionsDoes not require acceptance of Terms and Conditions
Tape & ReelNo
Temp. Range (°C)0 to 105°C
Thickness (mm)2.75
Width (mm)33

Description

The TSI107 Host Bridge for PowerPC provides system interconnect between PowerPC processors, PCI peripherals, and local memory. The TSI107 provides many of the other necessities for embedded applications, including a high-performance memory controller and dual processor support; two-channel flexible DMA controller, an interrupt controller, an I2O-ready message unit, an inter-integrated circuit controller (I2C), and low-skew clock drivers.