| CAD Model: | View CAD Model |
| Pkg. Type: | DPAK |
| Pkg. Code: | |
| Lead Count (#): | |
| Pkg. Dimensions (mm): | |
| Pitch (mm): |
| Moisture Sensitivity Level (MSL) | 3 |
| ECCN (US) | EAR99 |
| HTS (US) | 8541.29.0095 |
| Pb (Lead) Free |
| Pkg. Type | DPAK |
| Carrier Type | Tape & Reel |
| Moisture Sensitivity Level (MSL) | 3 |
| Mounting Type | Surface Mount |
| Temp. Range (°C) | -55 to +150°C |
| Country of Assembly | CHINA |
| Country of Wafer Fabrication | JAPAN |
| Blocking Capability | Uni-Directional Switch |
| Ciss (Typical) (pF) | 465 |
| Coss (Typical) (pF) | 8 |
| FET Type | N-Channel |
| Id max @ 25°C (A) | 5 |
| Published | Yes |
| Qg typ (nC) | 5.2 |
| Qoss (nC) | 9.2 |
| Qualification Level | Standard |
| Quality Level | Standard |
| RDSON (Typ) (mΩ) | 480 |
| RDSON (max) (mΩ) | 560 |
| Ron * Qoss (FOM) | 4416 |
| V(TR)DSS max (V) | 800 |
| Vds min (V) | 700 |
| Vth typ (V) | 2 |
| trr (Typical) (nS) | 27.6 |
The TP70H480G4ZS 700V, 480mΩ, Gallium Nitride (GaN) FET is a normally-off device using Renesas’ Gen IV SuperGaN® platform. It integrates high-voltage GaN High Electron Mobility Transistor (HEMT) and low-voltage silicon MOSFET technologies, delivering superior reliability and performance. Renesas GaN achieves higher efficiency than silicon by minimizing gate charge, crossover loss, and reverse recovery charge. The TP70H480G4ZS is available in a DPAK TO-252 package with a common-source configuration.