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Renesas Electronics Corporation
High-Voltage High-Current H/Half-Bridge Driver

Package Information

CAD Model:View CAD Model
Pkg. Type:STQFN
Pkg. Code:
Lead Count (#):20
Pkg. Dimensions (mm):2.0 x 3.0 x 0.55
Pitch (mm):

Environmental & Export Classifications

ECCN (US)EAR99
HTS (US)8542.39.0090
Pb (Lead) FreeYes
Moisture Sensitivity Level (MSL)

Product Attributes

Pkg. TypeSTQFN
Package Area (mm²)6
Pkg. Dimensions (mm)2.0 x 3.0 x 0.55
Qualification LevelIndustrial
Temp. Range (°C)-40 to +85°C
Country of AssemblyTAIWAN
Country of Wafer FabricationTAIWAN
Carrier TypeTape & Reel
Control ModeIN, Half-Bridge
InterfaceHardware (GPIO)
Key Features3A RMS for two HV GPOs connected in parallel​, Undervoltage lockout, Thermal shutdown, Overcurrent protection
Lead Count (#)20
Pb (Lead) FreeYes
Peak Output Current IPK (A)6
RDS(ON) (HS + LS) (mΩ)474
Sleep/Reset Mode Current (µA)22
TopologyPush-Pull
VS (Max) (V)26.4
VS (Min) (V)4.5

Description

The SLG7MD47673 is a compact and efficient integrated H-Bridge/Half-Bridge driver, designed for wide voltage applications up to 26.4V and 3A (max) output. Ideal for applications where both power and size are crucial, it integrates NMOS FETs in the HV OUT CTRL macrocell, allowing detailed configuration settings. By combining driver FETs and control circuitry into a single component, the SLG7MD47673 simplifies motor driver system design and reduces component count. The device features an EN input interface for precise motor start control and a low-power sleep mode activated via the INH pin to reduce power consumption. With built-in protection features like undervoltage lockout, overcurrent protection, and thermal shutdown, the SLG7MD47673 ensures reliable and safe operation in various environments.