Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | TQFN |
| Pkg. Code: | |
| Lead Count (#): | 20 |
| Pkg. Dimensions (mm): | 2.0 x 3.0 |
| Pitch (mm): |
Environmental & Export Classifications
| Pb (Lead) Free | Yes |
| ECCN (US) | EAR99 |
| HTS (US) | 8542.39.0090 |
| Moisture Sensitivity Level (MSL) |
Product Attributes
| Pkg. Type | TQFN |
| Lead Count (#) | 20 |
| Pb (Lead) Free | Yes |
| Temp. Range (°C) | -40 to +105°C |
| Country of Assembly | TAIWAN |
| Country of Wafer Fabrication | TAIWAN |
| # of Programable Delays (#) | 1 |
| ACMP Channels (#) | 4 |
| Additional Features | Supported in Go Configure™ Software Hub |
| CNT/DLY (Max) (#) | 7 |
| Carrier Type | Tape & Reel |
| DFF (Max) (#) | 8 |
| GPIOs (#) | 18 |
| Interface | I2C |
| LUTs (Max) (#) | 17 |
| Longevity | 2032 Sep |
| Look-up Table (LUTs) | 17 |
| Memory Type | OTP |
| Oscillator Type | Conf. OSC, RC OSC |
| Pattern Generator | 1 |
| Pipe Delay | 16-stage |
| Pkg. Dimensions (mm) | 2.0 x 3.0 |
| Special Features | ASM (8 states) |
| Temperature Sensor (ch) (#) | 1 |
Resources for SLG46537-E
Description
The SLG46537-E provides a small, low-power component for commonly used mixed-signal functions. The user creates their circuit design by programming the one-time programmable (OTP) non-volatile memory (NVM) to configure the interconnect logic, the IO pins, and the macrocells of the SLG46537-E. This highly versatile device allows for a wide variety of mixed-signal functions to be designed within a very small, low-power single integrated circuit.