Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | TFFBGA |
| Pkg. Code: | pkg_846 |
| Lead Count (#): | 48 |
| Pkg. Dimensions (mm): | 10 x 8 x 1.2 |
| Pitch (mm): | 0.75 |
Environmental & Export Classifications
| Moisture Sensitivity Level (MSL) | 3 |
| ECCN (US) | 3A991.b.2.a |
| HTS (US) | 8542.32.0041 |
| Pb (Lead) Free | Yes |
Product Attributes
| Pkg. Type | TFFBGA |
| Carrier Type | Tray |
| Moisture Sensitivity Level (MSL) | 3 |
| Assembly Location | JAPAN, TAIWAN |
| Wafer Fab Location | JAPAN |
| Access Time (ns) | 55 |
| Density (Kb) | 16000 |
| Lead Compliant | Yes |
| Lead Count (#) | 48 |
| Length (mm) | 10 |
| MOQ | 1 |
| Memory Capacity (kbit) | 16000 |
| Memory Density | 16 |
| Organization | 1M x 16 |
| Organization (bit) | x 16 |
| Organization (kword) | 1000 |
| Pb (Lead) Free | Yes |
| Pkg. Dimensions (mm) | 10 x 8 x 1.2 |
| Remarks | Dual Chip Select (CS1#, CS2) |
| Supply Voltage (V) | 2.7 - 3.6 |
| Tape & Reel | No |
| Temp. Range (°C) | -40 to +85 |
| Thickness (mm) | 1.2 |
| Width (mm) | 8 |
Resources for RMLV1616A-U
Description
The RMLV1616A-U Series is a family of 16Mbit asynchronous SRAMs organized 1,048,576-word × 16-bit.
The RMLV1616A-U Series realizes higher soft error immunity compared to typical SRAMs with on-chip ECC, achieved by Renesas’ unique Advanced LPSRAM technologies. Therefore, it is suitable for battery backup systems.
It is offered in a 48-pin TSOP (I) or 48-ball fine pitch ball grid array.