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Package Information

CAD Model:View CAD Model
Pkg. Type:TFBGA
Pkg. Code:pkg_846
Lead Count (#):48
Pkg. Dimensions (mm):9.5 x 8 x 1.2
Pitch (mm):0.75

Environmental & Export Classifications

Moisture Sensitivity Level (MSL)3
ECCN (US)3A991.b.2.a
HTS (US)8542.32.0041
RoHS (RMLV1616AGBG-5U2#AC0)EnglishJapanese
Pb (Lead) FreeYes

Product Attributes

Longevity1999 Jan
Pkg. TypeTFFBGA
Carrier TypeTray
Moisture Sensitivity Level (MSL)3
Country of AssemblyJAPAN, TAIWAN
Country of Wafer FabricationJAPAN
Access Time (ns)55
Density (Kb)16000
Lead CompliantYes
Lead Count (#)48
Length (mm)10
MOQ1
Memory Capacity (kbit)16000
Memory Density16
Organization1M x 16
Organization (bit)x 16
Organization (kword)1000
Pb (Lead) FreeYes
Pkg. Dimensions (mm)10 x 8 x 1.2
RemarksDual Chip Select (CS1#, CS2)
Supply Voltage (V)2.7 - 3.6
Tape & ReelNo
Temp. Range (°C)-40 to +85
Thickness (mm)1.2
Width (mm)8

Description

The RMLV1616A-U Series is a family of 16Mbit asynchronous SRAMs organized 1,048,576-word × 16-bit.

The RMLV1616A-U Series realizes higher soft error immunity compared to typical SRAMs with on-chip ECC, achieved by Renesas’ unique Advanced LPSRAM technologies. Therefore, it is suitable for battery backup systems.

It is offered in a 48-pin TSOP (I) or 48-ball fine pitch ball grid array.