Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | TFBGA |
| Pkg. Code: | pkg_11618 |
| Lead Count (#): | 48 |
| Pkg. Dimensions (mm): | 8.5 x 7.5 x 1.2 |
| Pitch (mm): |
Environmental & Export Classifications
| Moisture Sensitivity Level (MSL) | 3 |
| ECCN (US) | 3A991.b.2.a |
| HTS (US) | 8542.32.0041 |
| RoHS (RMLV0816BGBG-4S2#KC0) | EnglishJapanese |
| Pb (Lead) Free | Yes |
Product Attributes
| Carrier Type | Embossed Tape |
| Moisture Sensitivity Level (MSL) | 3 |
| Country of Assembly | TAIWAN |
| Country of Wafer Fabrication | JAPAN |
| Access Time (ns) | 45 |
| Density (Kb) | 8000 |
| Lead Compliant | Yes |
| Lead Count (#) | 48 |
| Length (mm) | 8 |
| Longevity | 2032 Dec |
| MOQ | 1000 |
| Memory Capacity (kbit) | 8000 |
| Memory Density | 8M |
| Organization | 512K x 16 |
| Organization (bit) | x 16 |
| Organization (kword) | 512 |
| Pb (Lead) Free | Yes |
| Pkg. Dimensions (mm) | 8 x 8 x 1.2 |
| Pkg. Type | FBGA(48) |
| Price (USD) | $5.12538 |
| Remarks | Dual Chip Select (CS1#, CS2) |
| Replacement Remark | Change in generation from 0.15 um to 0.11 um |
| Supply Voltage (V) | 2.4 - 3.6 |
| Tape & Reel | No |
| Temp. Range (°C) | -40 to +85 |
| Thickness (mm) | 1.2 |
| Width (mm) | 8 |
Resources for RMLV0816BGBG
Description
The RMLV0816BGBG is an 8-Mbit static RAM organized as 524, 288-word × 16-bit, fabricated by Renesas' high-performance Advanced LPSRAM technologies. The RMLV0816BGBG realizes higher density, higher performance, and low-power consumption. The device offers low-power standby power dissipation. Therefore, it is suitable for battery backup systems. It is offered in a 48-ball fine-pitch ball grid array.